Method and apparatus for reducing EMI emissions

    公开(公告)号:US07133356B2

    公开(公告)日:2006-11-07

    申请号:US09916039

    申请日:2001-07-25

    申请人: Harry G. Skinner

    发明人: Harry G. Skinner

    IPC分类号: G06F11/00 H04J3/22

    CPC分类号: H04B15/04 H04L25/03866

    摘要: Briefly, in accordance with one embodiment, a circuit to encode binary digital signals so as to reduce EMI emissions during signal transmission across a bus or interconnect includes circuitry to apply a pseudo-random pattern of binary digital signals to encode selected binary digital signals so as to reduce the harmonic content of the selected binary digital signals.Briefly, in accordance with another embodiment, a method of encoding binary digital signals so as to reduce EMI emissions during signal transmission across a bus or interconnect includes applying a pseudo-random pattern of binary digital signals to encode selected binary digital signals so as to reduce the harmonic content of the selected binary digital signals.

    Package integrated faraday cage to reduce electromagnetic emissions from an integrated circuit
    33.
    发明授权
    Package integrated faraday cage to reduce electromagnetic emissions from an integrated circuit 失效
    封装集成法拉第笼,减少集成电路的电磁辐射

    公开(公告)号:US06515870B1

    公开(公告)日:2003-02-04

    申请号:US09722935

    申请日:2000-11-27

    IPC分类号: H05K714

    摘要: An integrated circuit (IC) includes a package-integrated Faraday cage assembly to reduce the level of electromagnetic radiation emanating from the IC during operation. The IC uses a number of appropriately spaced leads on the IC package to form part of a Faraday cage surrounding a semiconductor chip within the IC. In one approach, the selected leads are coupled by a conductive member to a conductive cover plate of the IC package that forms an upper boundary of the Faraday cage. When the IC is installed in an external circuit, some or all of the selected leads are coupled together outside of the IC package (e.g., to an electrical ground) to form the lower boundary of the Faraday cage.

    摘要翻译: 集成电路(IC)包括封装集成的法拉第笼式组件,以减少在操作期间从IC发出的电磁辐射的水平。 IC在IC封装上使用多个适当间隔的引线,以形成围绕IC内的半导体芯片的法拉第笼的一部分。 在一种方法中,所选择的引线通过导电构件耦合到形成法拉第笼的上边界的IC封装的导电盖板。 当IC安装在外部电路中时,部分或全部所选引线在IC封装外部(例如,电气接地)耦合在一起,以形成法拉第笼的下边界。