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公开(公告)号:US20230420237A1
公开(公告)日:2023-12-28
申请号:US18037383
申请日:2021-09-17
Applicant: HAMAMATSU PHOTONICS K.K.
Inventor: Masahiro KOTANI , Takayuki OHMURA , Akira TASHIRO
IPC: H01J49/04
CPC classification number: H01J49/0418 , H01J49/40
Abstract: A sample support body is used for ionizing a component of a sample. The sample support body includes: a substrate; a porous layer provided on the substrate and having a front surface on a side opposite to the substrate; and a partition portion partitioning the front surface into a first region and a second region. The porous layer includes a main body layer having a plurality of holes opening to the front surface. The partition portion includes a partition groove formed on the front surface so as to pass between the first region and the second region.
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公开(公告)号:US20220260528A1
公开(公告)日:2022-08-18
申请号:US17737430
申请日:2022-05-05
Applicant: HAMAMATSU PHOTONICS K.K.
Inventor: Takayuki OHMURA , Masahiro KOTANI
Abstract: Provided is a sample support body that includes a substrate, an ionization substrate, a support, and a frame. The ionization substrate has a plurality of measurement regions for dropping a sample on second surface. A plurality of through-holes that open in a first surface and the second surface are formed at least in the measurement regions of the ionization substrate. A conductive layer is provided on peripheral edges of the through-holes at least on the second surface. The frame has a wall provided on peripheral edges of the measurement regions on the second surface to separate the plurality of measurement regions when viewed in the direction in which the substrate and the ionization substrate face each other.
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公开(公告)号:US20220189757A1
公开(公告)日:2022-06-16
申请号:US17442729
申请日:2020-01-23
Applicant: HAMAMATSU PHOTONICS K.K.
Inventor: Masahiro KOTANI , Takayuki OHMURA
Abstract: A sample support body is a sample support body for ionization of a sample, including: a substrate having a first surface, a second surface on a side opposite to the first surface, and a plurality of through-holes opening on each of the first surface and the second surface; and a frame attached to the substrate, in which a thermal conductivity of the frame is 1.0 W/m·K or less.
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公开(公告)号:US20220189752A1
公开(公告)日:2022-06-16
申请号:US17442760
申请日:2020-01-23
Applicant: HAMAMATSU PHOTONICS K.K.
Inventor: Masahiro KOTANI , Takayuki OHMURA , Daisuke SAIGUSA
Abstract: An ionization method includes: a first process of preparing a sample support body including an electrically insulating substrate having a first surface, a second surface on a side opposite to the first surface, and a plurality of through-holes opening on each of the first surface and the second surface and an electrically insulating frame attached to the substrate; a second process of mounting a sample on a mount surface of a mount portion and mounting the sample support body on the mount surface so that the second surface is in contact with the sample; and a third process of ionizing components of the sample that have moved to the first surface side via the plurality of through-holes by irradiating the first surface with charged-droplets and sucking the ionized components.
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35.
公开(公告)号:US20210398790A1
公开(公告)日:2021-12-23
申请号:US17465173
申请日:2021-09-02
Applicant: HAMAMATSU PHOTONICS K.K.
Inventor: Yasuhida NAITO , Masahiro KOTANI , Takayuki OHMURA
Abstract: A surface-assisted laser desorption/ionization method according to an aspect includes: a first process of preparing a sample support (2) having a substrate (21) in which a plurality of through-holes (S) passing from one surface (21a) thereof to the other surface (21b) thereof are provided and a conductive layer (23) that covers at least the one surface (21a); a second process of placing a sample (10) on a sample stage (1) and arranging the sample support (2) on the sample (10) such that the other surface (21b) faces the sample (10); and a third process of applying a laser beam (L) to the one surface (21a) and ionizing the sample (10) moved from the other surface (21b) side to the one surface (21a) side via the through-holes (S) due to a capillary phenomenon.
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公开(公告)号:US20210305033A1
公开(公告)日:2021-09-30
申请号:US17057926
申请日:2019-05-28
Applicant: HAMAMATSU PHOTONICS K.K.
Inventor: Yuki NISHIMURA , Masahiro KOTANI , Takanori ICHINOMIYA
IPC: H01J43/20
Abstract: A first-stage dynode is a first-stage dynode to be used in a photomultiplier tube, and includes a bottom wall portion and a pair of side wall portions extending from both end portions of the bottom wall portion in a predetermined direction to one side. An electron emission surface is formed by a bottom surface of the bottom wall portion on the one side and a pair of side surfaces of the pair of side wall portions on the one side, and each of the pair of side surfaces is a curved surface that is curved in a concave shape in a cross section parallel to the predetermined direction.
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公开(公告)号:US20210231610A1
公开(公告)日:2021-07-29
申请号:US17229914
申请日:2021-04-14
Applicant: HAMAMATSU PHOTONICS K.K.
Inventor: Takayuki OHMURA , Masahiro KOTANI
Abstract: Provided is a sample support body that includes a substrate, an ionization substrate, a support, and a frame. The ionization substrate has a plurality of measurement regions for dropping a sample on second surface. A plurality of through-holes that open in a first surface and the second surface are formed at least in the measurement regions of the ionization substrate. A conductive layer is provided on peripheral edges of the through-holes at least on the second surface. The frame has a wall provided on peripheral edges of the measurement regions on the second surface to separate the plurality of measurement regions when viewed in the direction in which the substrate and the ionization substrate face each other.
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公开(公告)号:US20210093273A1
公开(公告)日:2021-04-01
申请号:US16500192
申请日:2018-02-27
Applicant: HAMAMATSU PHOTONICS K.K.
Inventor: Masahiro KOTANI , Hiroki KAWAKAMI
Abstract: A metal grid includes: a valve metal plate which includes a curved principal surface; an anodic oxide film which is formed on the principal surface of the valve metal plate; and a lattice structure which has an uneven shape periodically formed on the anodic oxide film. Further, a production method for a metal grid includes: a step of bending a principal surface of a valve metal plate including the principal surface; a step of forming an anodic oxide film on the principal surface of the valve metal plate; and a step of forming a lattice structure with a periodic uneven shape on the anodic oxide film by forming an etching mask with a periodic opening on a surface of the anodic oxide film and etching the anodic oxide film through the opening.
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公开(公告)号:US20200266043A1
公开(公告)日:2020-08-20
申请号:US16647261
申请日:2018-08-06
Applicant: HAMAMATSU PHOTONICS K.K.
Inventor: Yasuhide NAITO , Masahiro KOTANI , Takayuki OHMURA
Abstract: A laser desorption/ionization method, includes: a first step of preparing a sample support body including a substrate on which plurality of through holes opening to a first surface and a second surface facing each other are formed, and a conductive layer provided on at least the first surface; a second step of mounting a sample on a mounting surface of a mounting portion, and of disposing the sample support body on the sample such that the second surface is in contact with the sample; a third step of introducing a matrix solution into the plurality of through holes; and a fourth step of ionizing a component of the sample that is mixed with the matrix solution and is moved to the first surface side from the second surface side through the through hole by irradiating the first surface with laser light while a voltage is applied to the conductive layer.
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公开(公告)号:US20230253196A1
公开(公告)日:2023-08-10
申请号:US18015804
申请日:2021-05-10
Applicant: HAMAMATSU PHOTONICS K.K.
Inventor: Akira TASHIRO , Takayuki OHMURA , Masahiro KOTANI , Takamasa IKEDA
IPC: H01J49/04
CPC classification number: H01J49/0418
Abstract: A sample support used for sample component ionization includes: a substrate having a first surface and a plurality of holes opening to the first surface; and a conductive layer provided on the first surface so as not to block the hole, in which the conductive layer is configured by a plurality of nanoparticles and has a thickness of 30 nm or more.
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