ADDITIVE MANUFACTURING OF METALS
    33.
    发明申请

    公开(公告)号:US20210362237A1

    公开(公告)日:2021-11-25

    申请号:US16606898

    申请日:2018-04-30

    Abstract: An example method for additive manufacturing of metals includes spreading a build material including a metal in a sequence of layers. Each layer has a respective thickness, a respective sequence position, and a respective exposed surface to receive energy from a flood energy source prior to spreading of a subsequent layer. Each respective exposed surface has a surface area of at least 5 square centimeters (cm2). Layer-by-layer, the exposed surface of each layer is exposed to the radiated energy from the flood energy source. The energy is radiated at an intensity profile and a fluence sufficient to cause a consolidating transformation of the build material in the exposed layer.

    SELECTIVE LASER MELTING (SLM) ADDITIVE MANUFACTURING

    公开(公告)号:US20210331271A1

    公开(公告)日:2021-10-28

    申请号:US16606245

    申请日:2018-06-08

    Abstract: An in-situ monitoring device for selective laser melting (SLM) additive manufacturing may include at least one coherent electromagnetic wave source to produce a detection beam, an interferometer interposed between the electromagnetic wave source and a target detection area, a photodetector to detect displacement measuring interference between electromagnetic waves from the electromagnetic wave source and reflected electromagnetic waves from the target detection area through the interferometer, and control logic to cause the detection beam to follow a print path of a material forming laser at a distance behind the material forming laser. The detection beam is placed on a laser-melted and at least partially solidified portion of a layer of a three-dimensional (3D) object formed by the material forming laser.

    PRINTERS WITH ORIENTABLE MICRO-MIRRORS

    公开(公告)号:US20210268744A1

    公开(公告)日:2021-09-02

    申请号:US17258279

    申请日:2018-10-24

    Abstract: Printers with orientable micro-mirrors are disclosed. An example printer includes a first micro-minor, a second micro-minor, a third micro-mirror, an energy source; and a controller. The controller is to, during a first time period, orient the first micro-mirror toward a first area of a powder bed, orient the second micro-minor toward the first area of the powder bed, orient the third micro-mirror toward a second area of the powder bed, and activate the energy source, wherein powder in the first area of the powder bed fuses to form a portion of an object in response to energy directed by the first micro-mirror toward the first area and in response to concurrent direction of energy by the second micro-minor toward the first area.

    POWDER LAYER FORMER
    36.
    发明申请

    公开(公告)号:US20210060650A1

    公开(公告)日:2021-03-04

    申请号:US17043112

    申请日:2018-06-08

    Abstract: A system to apply uniform layers of metal powder, the system includes: a conductive roller with a dielectric coating, the conductive roller biased at a first voltage; a powder supply to contain a metal powder biased at a second voltage, the powder supply to provide the metal powder to the conductive roller to form a uniform layer of metal powder on the dielectric coating of the conductive roller; a deposition area to receive the uniform layer of metal powder from the conductive roller, the deposition area biased at a third voltage, wherein the metal powder is transferred across an air gap from the conductive roller to the deposition area by electrostatic attraction of the metal powder.

    POWDER BED MATERIALS
    37.
    发明申请

    公开(公告)号:US20200324338A1

    公开(公告)日:2020-10-15

    申请号:US16603315

    申请日:2018-01-02

    Abstract: The present disclosure is drawn to powder bed materials. The powder bed material can include from 20 wt % to 95 wt % of a large particulate metal and from 5 wt % to 80 wt % of a small particulate metal. The large particulate metal can have a D50 particle size distribution value ranging from 20 μm to 100 μm and an average aspect ratio from 1:1 to 1.1:1. The small particulate metal can have a D50 particle size distribution value ranging from 1 μm to 15 μm and an average aspect ratio from greater than 1.1 to 2.1.

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