公开(公告)号：US20220276634A1

公开(公告)日：2022-09-01

申请号：US17640995

申请日：2019-10-23

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Wei Huang ,  Gary J. Dispoto ,  Guy Adams

IPC: G05B19/4099

Abstract: Examples described herein relate to a system consistent with the disclosure. For instance, the system may comprise an additive manufacturing device including hardware to form a three-dimensional (3D) model, a memory resource, and a processing resource to receive data related to the 3D model, modify the data related to the 3D model to include a protective structure connected to the 3D model by a fusion bond, and dispense, based on the modified data, a printing agent onto build material layers to produce the 3D model and the protective structure around a portion of the 3D model.

公开(公告)号：US20220250319A1

公开(公告)日：2022-08-11

申请号：US17415171

申请日：2019-08-05

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Wei Huang ,  Gary J. Dispoto

IPC: B29C64/277 ,  B29C64/153 ,  B29C64/205 ,  B33Y10/00 ,  B33Y30/00

Abstract: In one example in accordance with the present disclosure, an additive manufacturing device is described. The additive manufacturing device includes a build material distributor to deposit layers of powdered build material onto a bed. An agent distributor of the additive manufacturing device deposits at least one property-changing agent in a pattern onto a layer of powdered build material. The additive manufacturing device also includes an array of lasers to selectively fuse portions of the layer of powdered build material in a pattern.

公开(公告)号：US11364684B2

公开(公告)日：2022-06-21

申请号：US16612789

申请日：2018-02-13

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Wei Huang ,  Gary J. Dispoto

IPC: B05D1/36 ,  B29C64/386 ,  B33Y50/00 ,  B29C64/35 ,  B33Y40/20 ,  B41M5/00 ,  G05B19/4099 ,  G06K1/12 ,  G06K19/06 ,  B22F10/10

Abstract: A method is disclosed in which an identifier is to be printed on a surface of a part to be additive manufactured. The identifier is utilized during post-processing of the part at the manufacturing facility, then the identifier is modified so as to no longer be visible before leaving the facility.

公开(公告)号：US20220072802A1

公开(公告)日：2022-03-10

申请号：US17424720

申请日：2019-05-29

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Wei Huang ,  Nathan Moroney

IPC: B29C64/393 ,  B33Y10/00 ,  B33Y50/02 ,  G06T17/00 ,  G06T7/90 ,  G06T7/50 ,  G06T7/60

Abstract: The present disclosure pertains to systems and methods for mapping an image to a three-dimensional pattern of relief features on a surface of an object for 3D printing. In some examples, a system may determine a pattern of relief features, including debossed relief features and/or embossed relief features, to create a shading pattern on the surface of 3D printed object that approximates the continuous halftones of an image.

公开(公告)号：US20220009161A1

公开(公告)日：2022-01-13

申请号：US17298639

申请日：2019-10-10

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Aja Hartman ,  Wei Huang ,  Adekunle Olubummo ,  Kyle Wycoff ,  John Samuel Dilip Jangam

IPC: B29C64/165 ,  B33Y10/00 ,  B33Y70/00 ,  C09D177/02 ,  C09D7/63

Abstract: The present disclosure relates to a three-dimensional (3D) printing materials kit comprising: a first tailoring agent comprising at least one crosslinking agent; a second tailoring agent comprising at least one plasticizer, and a fusing agent. The present disclosure also relates to a printed structure comprising regions of relatively higher ductility and regions of relatively lower ductility. The regions of relatively higher ductility can be interspersed by the regions of relatively lower ductility, and the regions of relatively lower ductility can be formed from a crosslinked polymer and/or a polymer composition comprising a reinforcing filler, and/or the regions of relatively higher ductility can be formed from a polymer composition comprising a plasticizer. The present disclosure also relates to a method of three dimensional printing (3D) that can be used to print a 3D printed object comprising the printed structure described above.

公开(公告)号：US20210365010A1

公开(公告)日：2021-11-25

申请号：US16606764

申请日：2018-04-30

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Wei Huang

IPC: G05B19/418

Abstract: According to examples, an apparatus may include a processor and a memory on which are stored machine readable instructions. The instructions, when executed by the processor, may cause the processor to receive a file including data of an object to be fabricated and data of a predefined mark to be formed on the object and determine whether the predefined mark is authentic. The instructions may also cause the processor to, based on a determination that the predefined mark is authentic, control fabricating components to fabricate the object, and control the fabricating components to form the predefined mark on the object during fabrication of the object.

公开(公告)号：US20190351612A1

公开(公告)日：2019-11-21

申请号：US16463542

申请日：2017-02-15

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Wei Huang ,  Steven J. Simske ,  Ingeborg Tastl ,  Melanie M. Gottwals ,  Gary J. Dispoto

IPC: B29C64/171 ,  B33Y10/00 ,  B33Y30/00

Abstract: An example system includes an object and a support frame supporting the object. The support frame constrains movement of the object relative to the support frame, and the support frame includes at least one of a cage or a shackle to non-rigidly constrain movement of at least a part of the object.

公开(公告)号：US20190351607A1

公开(公告)日：2019-11-21

申请号：US16462679

申请日：2017-02-14

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Wei Huang ,  Lihua Zhao ,  Gary J. Dispoto

IPC: B29C64/10 ,  B29C64/393 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y50/02 ,  B33Y80/00 ,  B29C70/70 ,  B29C70/88 ,  G01N27/04

Abstract: According to an example, a three-dimensional (3D) printed object may include a body formed of an electrically non-conductive material. In addition, an electrically conductive channel, a sensing device, and a signal emitter may be embedded within the body. The sensing device may be in electrical communication with the electrically conductive channel such that the sensing device is affected by a disruption in a current applied through the electrically conductive channel. In addition, the signal emitter may emit a wireless signal in response to the sensing device being affected by a disruption in the applied current.

公开(公告)号：US20180273720A1

公开(公告)日：2018-09-27

申请号：US15763359

申请日：2015-10-09

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Wei Huang ,  Lihua Zhao ,  Yan Zhao ,  Jun Zeng

IPC: C08K3/16 ,  B33Y10/00 ,  B33Y70/00 ,  B29C64/165

CPC classification number: C08K3/16 ,  B29C64/153 ,  B29C64/165 ,  B29C64/188 ,  B29K2077/10 ,  B33Y10/00 ,  B33Y70/00 ,  C08K3/10 ,  C08K2003/166 ,  C08K2201/005 ,  C08L101/00 ,  C08L77/02

Abstract: The present disclosure is drawn to particulate mixtures, material sets and methods of forming porous 3-dimensional printed parts. The particulate mixtures can include 5 wt % to 40 wt % of a salt having an average particle size from 5 μm to 100 μm. The mixture can also include 60 wt % to 95 wt % of a build material for 3-dimensional printing. The build material can include a particulate polymer having an average particle size from 5 μm to 100 μm and a melting point from 100° C. to 400° C. The melting point of the particulate polymer can be lower than the melting point of the salt.

公开(公告)号：US11710327B2

公开(公告)日：2023-07-25

申请号：US17108819

申请日：2020-12-01

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Craig Peter Sayers ,  Patrick Daney De Marcillac ,  Wei Huang

IPC: G06T7/55 ,  G06V20/80 ,  B29C64/386 ,  G06T7/60 ,  B33Y50/02

CPC classification number: G06V20/80 ,  B29C64/386 ,  G06T7/55 ,  G06T7/60 ,  B33Y50/02

Abstract: In example implementations, a method is provided. The method includes printing a three-dimensional (3D) object that includes a secondary structure. The secondary structure is removed. A representation of a surface of the 3D object where the secondary structure was removed is captured. The 3D object is authenticated based on the representation of the surface.