公开(公告)号：US20170106476A1

公开(公告)日：2017-04-20

申请号：US15301451

申请日：2015-03-30

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takeshi SAKAMOTO ,  Takafumi OGIWARA

IPC: B23K26/53 ,  C03B33/02 ,  B23K26/082 ,  B23K26/03 ,  B23K26/064

CPC classification number: B23K26/53 ,  B23K26/03 ,  B23K26/0622 ,  B23K26/064 ,  B23K26/0738 ,  B23K26/082 ,  B23K2101/40 ,  B23K2103/52 ,  B23K2103/54 ,  B23K2103/56 ,  C03B33/0222 ,  C03B33/07

Abstract: A laser processing device includes a laser light source, a converging optical system, a controller, and a reflective spatial light modulator. The controller and the reflective spatial light modulator, while using an aberration as a reference aberration, the aberration occurring when laser light is converged at a converging position with an amount of aberration correction in a state in which an ideal converging position is shifted by a predetermined distance to a laser light entrance side from the converging position, adjusts the aberration such that a first converging length longer than a reference converging length of the reference aberration is obtained and a first converging intensity less than a reference converging intensity of the reference aberration is obtained, when a modified region is formed within a first region closest to a front face of an object to be processed.

公开(公告)号：US20140227860A1

公开(公告)日：2014-08-14

申请号：US14256370

申请日：2014-04-18

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takeshi SAKAMOTO ,  Aiko NAKAGAWA

IPC: H01L21/78

CPC classification number: H01L21/78 ,  B23K26/03 ,  B23K26/0622 ,  B23K26/0853 ,  B23K26/40 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/50 ,  C03B33/0222 ,  H01L21/67092

Abstract: Fractures (17a, 17b) are generated from modified regions (7a, 7b) to front and rear faces (12a, 12b) of a object to be processed (1), respectively, while an unmodified region (2) is interposed between the modified regions (7a, 7b). This can prevent fractures from continuously advancing in the thickness direction of a silicon substrate (12) when forming a plurality of rows of modified regions (7). By generating a stress in the object (1), the fractures (17a, 17b) are connected to each other in the unmodified region (2), so as to cut the object (1). This can prevent fractures from meandering in the rear face (12b) of the object (1) and so forth, whereby the object (1) can be cut accurately along a line to cut the object (5).

Abstract translation: 从修饰区域（7a，7b）分别向被处理物体（1）的前后面（12a，12b）分别产生断裂（17a，17b），而未改性区域（2） 区域（7a，7b）。 这可以防止当形成多行修改区域（7）时在硅衬底（12）的厚度方向上的断裂继续前进。 通过在物体（1）中产生应力，裂纹（17a，17b）在未修改区域（2）中彼此连接，从而切割物体（1）。 这可以防止在物体（1）的后表面（12b）等中产生蜿蜒的折痕，从而可以沿着切割物体（5）的线被精确地切割物体（1）。

公开(公告)号：US20240082959A1

公开(公告)日：2024-03-14

申请号：US18268652

申请日：2021-12-20

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Yo SUGIMOTO ,  Takeshi SAKAMOTO ,  Takafumi OGIWARA ,  Naoki UCHIYAMA ,  Takashi KURITA ,  Ryo YOSHIMURA

IPC: B23K26/53 ,  B23K26/03 ,  B23K26/364 ,  H01L21/268

CPC classification number: B23K26/53 ,  B23K26/032 ,  B23K26/364 ,  H01L21/268 ,  B23K2103/56

Abstract: A laser processing apparatus includes a support unit that supports a wafer including a plurality of functional elements disposed adjacent to each other via a street, an irradiation unit that irradiates the street with laser light, and a control unit that controls the irradiation unit based on information about the streets so that a first region and a second region of the street are simultaneously irradiated with the laser light, and a power of the laser light for removing a surface layer of the street in the first region is higher than a power for removing the surface layer of the street in the first region. The information about the street includes information that a processing threshold value indicating a difficulty of laser processing in the first region is lower than a processing threshold value in the second region.

公开(公告)号：US20230245906A1

公开(公告)日：2023-08-03

申请号：US17910049

申请日：2021-03-03

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takeshi SAKAMOTO ,  Iku SANO

IPC: H01L21/67 ,  H01L21/66 ,  H01L21/78 ,  H01L21/268

CPC classification number: H01L21/67288 ,  H01L22/12 ,  H01L21/78 ,  H01L21/268 ,  H01L21/67092

Abstract: A laser processing device comprising: an irradiation unit configured to irradiate an object with laser light; an image capturing part configured to capture an image of the object; and a control unit configured to control at least the irradiation unit and the image capturing part, wherein the control unit performs a first process of irradiating the object with the laser light by control of the irradiation unit to form a modified spot and a fracture extending from the modified spot in the object so as not to reach an outer surface of the object, a second process of, after the first process, capturing an image of the object with light having transparency to the object and acquiring information indicating a formation state of the modified spot and/or the fracture, by control of the image capturing part.

公开(公告)号：US20230158609A1

公开(公告)日：2023-05-25

申请号：US17916844

申请日：2021-03-31

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Iku SANO ,  Takeshi SAKAMOTO ,  Katsuhiro KOREMATSU

IPC: B23K26/53 ,  B23K26/03 ,  H01L21/268

CPC classification number: B23K26/53 ,  B23K26/032 ,  H01L21/268 ,  B23K2103/56

Abstract: A laser processing device includes a control unit, and the control unit executes a first process of controlling a laser irradiation unit according to a first processing condition set such that a modified region and a modified region are formed inside a wafer; a second process of identifying a state related to each of the modified regions, and of determining whether or not the first processing condition is proper; a third process of controlling the laser irradiation unit according to a second processing condition set such that the modified regions are formed and a modified region is formed between the modified regions in a thickness direction of the wafer inside the wafer; and a fourth process of identifying a state related to each of the modified regions, and of determining whether or not the second processing condition is proper.

公开(公告)号：US20230120386A1

公开(公告)日：2023-04-20

申请号：US17910060

申请日：2021-03-03

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takeshi SAKAMOTO ,  Iku SANO

IPC: B23K26/53 ,  B23K26/03 ,  B23K26/06 ,  B23K26/0622

Abstract: A laser processing device includes an irradiation unit configured to irradiate an object with laser light, an image capturing part configured to capture an image of the object, and a control unit configured to control at least the irradiation unit and the image capturing part. A plurality of lines is set in the object. The control unit performs a first process of irradiating the object with the laser light for each of the plurality of lines by control of the irradiation unit to form a modified spot and a fracture extending from the modified spot in the object so as not to reach an outer surface of the object.

公开(公告)号：US20220410311A1

公开(公告)日：2022-12-29

申请号：US17781146

申请日：2020-12-02

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takafumi OGIWARA ,  Tsubasa HIROSE ,  Takeshi SAKAMOTO

IPC: B23K26/06

Abstract: A laser processing device comprising: a light source configured to output laser light; a spatial light modulator configured to display a modulation pattern for modulating the laser light output from the light source; a condenser lens configured to condense the laser light modulated by the spatial light modulator, on an object; and a control unit configured to control the spatial light modulator to adjust the modulation pattern in accordance with a traveling direction of a condensing point of the laser light with respect to the object.

公开(公告)号：US20220355413A1

公开(公告)日：2022-11-10

申请号：US17641533

申请日：2020-09-09

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takafumi OGIWARA ,  Takeshi SAKAMOTO

IPC: B23K26/067 ,  B23K26/03

Abstract: A laser processing apparatus includes a support part, a light source, a spatial light modulator, a converging part, and a controller. The controller controls the spatial light modulator so that laser light is branched into a plurality of rays of processing light including 0th-order light and a plurality of converging points for the plurality of rays of processing light are located at positions different from each other in a Z direction and an X direction, and controls at least one of the support part and the converging part so that the X direction coincides with an extension direction of a line and the plurality of converging points move relatively along the line. The controller controls the spatial light modulator so that a converging point of the 0th-order light is located one side with respect to a converging point of non-modulated light of the laser light, in a Y direction.

公开(公告)号：US20210125868A1

公开(公告)日：2021-04-29

申请号：US16605878

申请日：2018-02-09

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Tomoya TAGUCHI ,  Takeshi SAKAMOTO

IPC: H01L21/78 ,  H01L23/00 ,  H01L21/308 ,  H01L21/3065 ,  H01L21/268

Abstract: A chip production method includes a first step of setting a first cutting line and a second cutting line on a substrate including a plurality of functional elements, a second step of forming a mask on the substrate such that the functional elements are covered and an intersection region including an intersection of the first cutting line and the second cutting line is exposed, a third step of removing the intersection region from the substrate and forming a penetration hole by etching the substrate using the mask, a fourth step of forming a modified region in the substrate along the first cutting line, a fifth step of forming a modified region in the substrate along the second cutting line, and a sixth step of forming chips by cutting the substrate along the first cutting line and the second cutting line.

公开(公告)号：US20250050454A1

公开(公告)日：2025-02-13

申请号：US18718561

申请日：2022-08-22

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takeshi SAKAMOTO ,  Yo SUGIMOTO ,  Takafumi OGIWARA ,  Takashi KURITA ,  Ryo YOSHIMURA

IPC: B23K26/364 ,  B23K26/53 ,  B23K101/40

Abstract: A laser processing method includes: a step of forming a first groove in an object along a line by irradiating the object with laser light; a step of forming a second groove in the object along the line by irradiating the object with laser light, the second groove overlapping an end portion of the first groove in the width direction of the first groove; and a step of forming a modified region inside the object along the line by irradiating the object with laser light and extending a crack from the modified region after forming a composite groove including the first groove and the second groove in the object.