公开(公告)号：US20190126393A1

公开(公告)日：2019-05-02

申请号：US16083066

申请日：2017-03-03

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Yasunori IGASAKI ,  Aiko NAKAGAWA

IPC: B23K26/064 ,  B23K26/00 ,  B23K26/03 ,  B23K26/08 ,  B23K26/53 ,  B23K26/70 ,  H01L21/67 ,  H01L21/268 ,  H01L21/78 ,  H01L41/338

Abstract: A laser light irradiation device includes: a laser light source; a spatial light modulator including a display unit configured to display a phase pattern; an objective lens configured to condense a laser light emitted from the spatial light modulator at the object; an image-transfer optical system configured to transfer an image of the laser light on the display unit to an entrance pupil plane of the objective lens; a reflected light detector configured to detect reflected light of the laser light which is incident in the object and reflected by an opposite surface opposite to a laser light entrance surface; and a controller configured to control the phase pattern. When the reflected light detector detects the reflected light, the controller displays a reflected light aberration correction pattern which is the phase pattern correcting aberration generated in the event of the laser light being transmitted through the object having twice the predetermined thickness.

公开(公告)号：US20190084089A1

公开(公告)日：2019-03-21

申请号：US16082982

申请日：2017-03-10

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Yasunori IGASAKI ,  Aiko NAKAGAWA ,  Takeshi YAMADA

IPC: B23K26/38 ,  B23K26/03 ,  B23K26/04 ,  B23K26/06 ,  B23K26/08 ,  B23K26/402 ,  B23K26/70

Abstract: A laser machining device includes a laser light source, a spatial light modulator which includes a display unit, an objective lens, an image-transfer optical system, a camera and a controller. The controller executes first display processing and second display processing. According to first display processing, when the camera captures the image, the display unit displays a first phase pattern for adjusting a condensing position of laser light condensed by the objective lens to a first condensing position. According to second display processing, when the camera captures the image, the display unit displays a second phase pattern for adjusting the condensing position of the laser light condensed by the objective lens to a second condensing position different from the first condensing position in an irradiation direction of the laser light.

公开(公告)号：US20140227860A1

公开(公告)日：2014-08-14

申请号：US14256370

申请日：2014-04-18

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takeshi SAKAMOTO ,  Aiko NAKAGAWA

IPC: H01L21/78

CPC classification number: H01L21/78 ,  B23K26/03 ,  B23K26/0622 ,  B23K26/0853 ,  B23K26/40 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/50 ,  C03B33/0222 ,  H01L21/67092

Abstract: Fractures (17a, 17b) are generated from modified regions (7a, 7b) to front and rear faces (12a, 12b) of a object to be processed (1), respectively, while an unmodified region (2) is interposed between the modified regions (7a, 7b). This can prevent fractures from continuously advancing in the thickness direction of a silicon substrate (12) when forming a plurality of rows of modified regions (7). By generating a stress in the object (1), the fractures (17a, 17b) are connected to each other in the unmodified region (2), so as to cut the object (1). This can prevent fractures from meandering in the rear face (12b) of the object (1) and so forth, whereby the object (1) can be cut accurately along a line to cut the object (5).

Abstract translation: 从修饰区域（7a，7b）分别向被处理物体（1）的前后面（12a，12b）分别产生断裂（17a，17b），而未改性区域（2） 区域（7a，7b）。 这可以防止当形成多行修改区域（7）时在硅衬底（12）的厚度方向上的断裂继续前进。 通过在物体（1）中产生应力，裂纹（17a，17b）在未修改区域（2）中彼此连接，从而切割物体（1）。 这可以防止在物体（1）的后表面（12b）等中产生蜿蜒的折痕，从而可以沿着切割物体（5）的线被精确地切割物体（1）。