摘要:
A memory includes a first bit line, a memory cell coupled to the first bit line, and a read assist device coupled to the first bit line. The read assist device is configured to pull a first voltage on the first bit line toward a predetermined voltage in response to a first datum being read out from the memory cell. The read assist device includes a first circuit configured to establish a first current path between the first bit line and a node of the predetermined voltage during a first stage. The read assist device further includes a second circuit configured to establish a second current path between the first bit line and the node of the predetermined voltage during a second, subsequent stage.
摘要:
The layouts, device structures, and methods described above utilize dummy devices to extend the diffusion regions of edge structures and/or non-allowed structures to the dummy device. Such extension of diffusion regions resolves or reduces LOD and edge effect issues. In addition, treating the gate structure of a dummy device next to an edge device also allows only one dummy structure to be added next to the dummy device and saves the real estate on the semiconductor chip. The dummy devices are deactivated and their performance is not important. Therefore, utilizing dummy devices to extend the diffusion regions of edge structures and/or non-allowed structures according to design rules allows the resolution or reduction or LOD and edge effect issues without the penalty of yield reduction or increase in layout areas.
摘要:
An integrated circuit includes a positive power supply node, a current tracking circuit, and a current mirroring circuit including a plurality of current paths coupled in parallel. The currents of the plurality of current paths mirror a current of the current tracking circuit. The current mirroring circuit is configured to turn off the plurality of current paths one-by-one in response to a reduction in a positive power supply voltage on the positive power supply node. The integrated circuit further includes a charging node receiving a summation current of the plurality of current paths, wherein a voltage on the charging node is configured to increase through a charging of the summation current.
摘要:
A static random access memory (SRAM) macro includes a first power supply voltage and a second power supply voltage that is different from the first power supply voltage. A precharge control is connected to the second power supply voltage. The precharge control is coupled to a bit line through a bit line precharge. At least one level shifter receives a level shifter input. The level shifter converts the level shifter input having a voltage level closer to the first power supply voltage than the second power supply voltage to a level shifter output having a voltage level closer to the second power supply voltage than the first power supply voltage. The level shifter output is provided to the precharge control.
摘要:
In some embodiments related to a memory array, a sense amplifier (SA) uses a first power supply, e.g., voltage VDDA, while other circuitry, e.g., signal output logic, uses a second power supply, e.g., voltage VDDB. Various embodiments place the SA and a pair of transferring devices at a local IO row, and a voltage keeper at the main IO section of the same memory array. The SA, the transferring devices, and the voltage keeper, when appropriate, operate together so that the data logic of the circuitry provided by voltage VDDB is the same as the data logic of the circuitry provided by voltage VDDA.
摘要:
In some embodiments related to a memory array, a sense amplifier (SA) uses a first power supply, e.g., voltage VDDA, while other circuitry, e.g., signal output logic, uses a second power supply, e.g., voltage VDDB. Various embodiments place the SA and a pair of transferring devices at a local IO row, and a voltage keeper at the main IO section of the same memory array. The SA, the transferring devices, and the voltage keeper, when appropriate, operate together so that the data logic of the circuitry provided by voltage VDDB is the same as the data logic of the circuitry provided by voltage VDDA.
摘要:
A circuit includes a first inverter including a first PMOS transistor and a first NMOS transistor, and a second inverter including a second PMOS transistor and a second NMOS transistor. A first node is connected to gates of the first PMOS transistor and the first NMOS transistor and drains of the second PMOS transistor and the second NMOS transistor. A second node is connected to gates of the second PMOS transistor and the second NMOS transistor and drains of the first PMOS transistor and the first NMOS transistor. The circuit further includes a first capacitor having a first capacitance connected to the first node; and a second capacitor having a second capacitance connected to the second node. The second capacitance is greater than the first capacitance.
摘要:
This invention discloses a integrated circuit (IC) chip having a plurality of modular cells, the chip comprises a first modular cell having a first metal layer, which contains at least two power lines independent of each other; and a second modular cell, juxtaposed to the first modular cell, also having the first metal layer, which contains at least two power lines independent of each other, wherein all the power lines on the first metal layer serving the first modular cell do not extend into the second modular cell, and all the power lines on the first metal layer serving the second modular cell do not extend into the first modular cell.
摘要:
A circuit and method for providing a sense amplifier for a DRAM memory with reduced distortion in a control signal, the sense amplifier particularly useful for embedding DRAM memory with other logic and memory functions in an integrated circuit. A sense enable circuit is provided for a differential sensing latch in a sense amplifier having a cascade coupled pair of transistors, each transistor receiving a separate control signal. The separate control signals are provided by a control circuit with a delayed overlap. Differential sensing is enabled when the delayed overlap exists between the separate control signals. An array of DRAM memory cells are coupled to a plurality of the sense amplifiers. The DRAM memory incorporating the sense amplifiers may be embedded with other circuitry in an integrated circuit. Methods for providing the control signals and for laying out the DRAM memory with the sense amplifiers are provided.
摘要:
This invention discloses a integrated circuit (IC) chip having a plurality of modular cells, the chip comprises a first modular cell having a first metal layer, which contains at least two power lines independent of each other; and a second modular cell, juxtaposed to the first modular cell, also having the first metal layer, which contains at least two power lines independent of each other, wherein all the power lines on the first metal layer serving the first modular cell do not extend into the second modular cell, and all the power lines on the first metal layer serving the second modular cell do not extend into the first modular cell.