公开(公告)号：US10700021B2

公开(公告)日：2020-06-30

申请号：US16119923

申请日：2018-08-31

Applicant: Intel Corporation

Inventor： Andrew J. Brown ,  Rahul Jain ,  Prithwish Chatterjee ,  Lauren A. Link ,  Sai Vadlamani

IPC: H01L23/00 ,  H01L23/64 ,  H01L23/538 ,  H01L21/48 ,  H01L21/683 ,  H01L21/78

Abstract: A coreless semiconductor package comprises a plurality of horizontal layers of dielectric material. A magnetic inductor is situated at least partly in a first group of the plurality of layers. A plated laser stop is formed to protect the magnetic inductor against subsequent acidic processes. An EMIB is situated above the magnetic inductor within a second group of the plurality of layers. Vias and interconnections are configured within the horizontal layers to connect a die of the EMIB to other circuitry. A first level interconnect is formed on the top side of the package to connect to the interconnections. BGA pockets and BGA pads are formed on the bottom side of the package. In a second embodiment a polymer film is used as additional protection against subsequent acidic processes. The magnetic inductor comprises a plurality of copper traces encapsulated in magnetic material.

公开(公告)号：US20190206597A1

公开(公告)日：2019-07-04

申请号：US15856547

申请日：2017-12-28

Applicant: Intel Corporation

Inventor： Andrew J. Brown ,  Prithwish Chatterjee ,  Lauren A. Link ,  Sai Vadlamani

IPC: H01F1/20 ,  H01L23/498 ,  H01L21/48 ,  H05K1/18 ,  H01F41/02

CPC classification number: H01F1/20 ,  H01F41/02 ,  H01L21/481 ,  H01L21/486 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49894 ,  H01L24/16 ,  H01L2224/16227 ,  H01L2224/16265 ,  H01L2924/19011 ,  H01L2924/19042 ,  H05K1/181

Abstract: An inductor may be fabricated comprising a magnetic material layer and an electrically conductive via or trace extending through the magnetic material layer, wherein the magnetic material layer comprises dielectric magnetic filler particles within a carrier material. Further embodiments may include incorporating the inductor of the present description into an electronic substrate and may further include an integrated circuit device attached to the electronic substrate and the electronic substrate may further be attached to a board, such as a motherboard.