High voltage MOSFET having Si/SiGe heterojuction structure and method of manufacturing the same
    32.
    发明授权
    High voltage MOSFET having Si/SiGe heterojuction structure and method of manufacturing the same 有权
    具有Si / SiGe异质结构的高压MOSFET及其制造方法

    公开(公告)号:US07233018B2

    公开(公告)日:2007-06-19

    申请号:US11182671

    申请日:2005-07-15

    IPC分类号: H01L29/06 H01L31/00

    摘要: Provided are high voltage metal oxide semiconductor field effect transistor (HVMOSFET) having a Si/SiGe heterojunction structure and method of manufacturing the same. In this method, a substrate on which a Si layer, a relaxed SiGe epitaxial layer, a SiGe epitaxial layer, and a Si epitaxial layer are stacked or a substrate on which a Si layer having a well region, a SiGe epitaxial layer, and a Si epitaxial layer are stacked is formed. For the device having the heterojunction structure, the number of conduction carriers through a potential well and the mobility of the carriers increase to reduce an on resistance, thus increasing saturation current. Also, an intensity of vertical electric field decreases so that a breakdown voltage can be maintained at a very high level. Further, a reduction in vertical electric field due to the heterojunction structure leads to a gain in transconductance (Gm), with the results that a hot electron effect is inhibited and the reliability of the device is enhanced.

    摘要翻译: 提供了具有Si / SiGe异质结结构的高压金属氧化物半导体场效应晶体管(HVMOSFET)及其制造方法。 在该方法中,层叠有Si层,弛豫SiGe外延层,SiGe外延层和Si外延层的基板或其上具有阱区的Si层,SiGe外延层和 Si外延层被形成。 对于具有异质结结构的器件,通过势阱的导电载流子数量和载流子的迁移率增加,以降低导通电阻,从而增加饱和电流。 此外,垂直电场的强度降低,使得击穿电压可以保持在非常高的水平。 此外,由于异质结构造成的垂直电场的减小导致跨导(Gm)的增益,结果是热电子效应被抑制,并且器件的可靠性增强。

    Method for fabricating a high-voltage high-power integrated circuit device
    33.
    发明授权
    Method for fabricating a high-voltage high-power integrated circuit device 有权
    高压大功率集成电路器件的制造方法

    公开(公告)号:US06855581B2

    公开(公告)日:2005-02-15

    申请号:US10153975

    申请日:2002-05-23

    IPC分类号: H01L21/76 H01L21/84 H01L27/12

    CPC分类号: H01L27/1203 H01L21/84

    摘要: The present invention relates to a method of fabricating a high-voltage high-power integrated circuit device using a substrate of a SOI structure in which an insulating film and a silicon layer are sequentially stacked on a silicon substrate. The method comprising the steps of sequentially forming an oxide film and a photoresist film on the silicon layer and then performing a photolithography process using a trench mask to pattern the photoresist film; patterning the oxide film using the patterned photoresist film as a mask and then removing the photoresist film remained after the patterning; etching the silicon layer using the patterned oxide film as a mask until the insulating film is exposed to form a trench; forming a nitride film on the entire surface including the trench, performing an annealing process and depositing polysilicon on the entire surface so that the trench is buried; and sequentially removing the polysilicon and the nitride film until the silicon layer is exposed to flatten the surface, thus forming a device isolating film for electrical isolation between devices within the trench. Therefore, the present invention can effectively reduce the isolation area of the trench between the high-voltage high-power device and the logic CMOS device and can easily control the concentration of a deep well.

    摘要翻译: 本发明涉及使用其中绝缘膜和硅层依次层叠在硅衬底上的SOI结构的衬底的高压大功率集成电路器件的制造方法。 该方法包括以下步骤:在硅层上依次形成氧化物膜和光致抗蚀剂膜,然后使用沟槽掩模进行光刻工艺以对光刻胶膜进行图案化; 使用图案化的光致抗蚀剂膜作为掩模来图案化氧化膜,然后在图案化之后除去光致抗蚀剂膜; 使用所述图案化氧化膜作为掩模蚀刻所述硅层,直到所述绝缘膜暴露以形成沟槽; 在包括沟槽的整个表面上形成氮化物膜,执行退火处理并在整个表面上沉积多晶硅,使得沟槽被埋置; 并且顺序地去除多晶硅和氮化物膜,直到硅层暴露以使表面变平,从而形成用于在沟槽内的器件之间进行电隔离的器件隔离膜。 因此,本发明能够有效地降低高压大功率器件与逻辑CMOS器件之间的沟槽的隔离面积,能够容易地控制深井的浓度。

    Multiple-gate MOS transistor using Si substrate and method of manufacturing the same
    34.
    发明授权
    Multiple-gate MOS transistor using Si substrate and method of manufacturing the same 有权
    使用Si衬底的多栅极MOS晶体管及其制造方法

    公开(公告)号:US07605039B2

    公开(公告)日:2009-10-20

    申请号:US11447786

    申请日:2006-06-06

    摘要: Provided are a multiple-gate MOS (metal oxide semiconductor) transistor and a method of manufacturing the same. The transistor includes a single crystalline active region having a channel region having an upper portion of a streamlined shape (∩) obtained by patterning an upper portion of a bulk silicon substrate with an embossed pattern, and having a thicker and wider area than the channel region; a nitride layer formed at both side surfaces of the single crystalline active region to expose an upper portion of the single crystalline active region at a predetermined height; and a gate electrode formed to be overlaid with the exposed upper portion of the single crystalline active region of the channel region.

    摘要翻译: 提供一种多栅极MOS(金属氧化物半导体)晶体管及其制造方法。 晶体管包括具有通道区域的单晶有源区域,沟道区域具有通过用压花图案图案化体硅衬底的上部并且具有比沟道区域更厚和更宽的面积而获得的流线型形状(∩)的上部 ; 形成在所述单晶有源区的两个侧表面处的氮化物层,以在预定高度暴露所述单晶有源区的上部; 以及形成为与通道区域的单晶有源区域的暴露的上部分重叠的栅电极。

    Structures of high voltage device and low voltage device, and method of manufacturing the same
    35.
    发明授权
    Structures of high voltage device and low voltage device, and method of manufacturing the same 失效
    高压器件和低压器件的结构及其制造方法

    公开(公告)号:US06887772B2

    公开(公告)日:2005-05-03

    申请号:US10721970

    申请日:2003-11-24

    摘要: The present invention relates to structures of a high voltage device and a low voltage device formed on a SOI substrate and a method for manufacturing the same, and it is characterized in which the low voltage device region of silicon device regions in a SOI substrate is higher than the high voltage device region by steps, and a thickness of the silicon device region, where the high voltage device is formed, is equal to a junction depth of impurities of a source and drain in the low voltage device. Accordingly, silicon device regions in the SOI substrate are divided into the high voltage region and the low voltage region and steps are formed there between by oxidation growth method, so that the high voltage device having low junction capacitance can be made, and the low voltage device compatible with the conventional CMOS process and device characteristics can also be made at the same time.

    摘要翻译: 本发明涉及形成在SOI衬底上的高电压器件和低电压器件的结构及其制造方法,其特征在于SOI衬底中硅器件区域的低电压器件区域较高 比高压器件区域逐步,并且形成高压器件的硅器件​​区域的厚度等于低压器件中的源极和漏极的杂质的结深度。 因此,SOI衬底中的硅器件区域被分成高压区域和低电压区域,并且通过氧化生长方法在其间形成步骤,使得可以制造具有低结电容的高电压器件,并且低电压 与传统CMOS工艺兼容的器件和器件特性也可以同时进行。

    Input and output port circuit
    36.
    发明授权
    Input and output port circuit 有权
    输入输出端口电路

    公开(公告)号:US06774697B2

    公开(公告)日:2004-08-10

    申请号:US10325929

    申请日:2002-12-23

    IPC分类号: H03L500

    CPC分类号: H03K19/0016

    摘要: The present invention relates to an input and output port circuit. The input and output port circuit comprises a signal register for storing output signals, an input/output register at which an input/output control signal for determining an input/output direction is stored, a plurality of control registers, a power supply switch circuit for selectively supplying a low voltage or a high voltage depending on a power mode control signal, a signal direction control circuit for determining the direction of the signal depending on a value of the signal register and a value of the input/output register, an output control circuit driven depending on the value of the control register and an output of the signal direction control circuit, and an output driving circuit for outputting the low voltage, the high voltage or the ground value depending on an output of the signal direction control circuit and an output of the output control circuit. The high voltage and the low voltage can be simultaneously driven using only a single output driving circuit and the single output driving circuit is constructed in multiple stages and is selectively driven by the output control register. Therefore, the power consumption can be saved.

    摘要翻译: 本发明涉及输入和输出端口电路。 输入输出端口电路包括用于存储输出信号的信号寄存器,存储用于确定输入/输出方向的输入/输出控制信号的输入/输出寄存器,多个控制寄存器,用于 选择性地根据功率模式控制信号提供低电压或高电压;信号方向控制电路,用于根据信号寄存器的值确定信号的方向,以及输入/输出寄存器的值,输出控制 电路根据控制寄存器的值和信号方向控制电路的输出驱动,以及输出驱动电路,用于根据信号方向控制电路的输出输出低电压,高电压或接地值,以及 输出控制电路的输出。 高电压和低电压可以使用单个输出驱动电路同时驱动,单输出驱动电路构成多级,由输出控制寄存器有选择地驱动。 因此,可以节省功耗。

    EDMOS device having a lattice type drift region
    37.
    发明授权
    EDMOS device having a lattice type drift region 有权
    EDMOS器件具有晶格型漂移区域

    公开(公告)号:US06617656B2

    公开(公告)日:2003-09-09

    申请号:US10179492

    申请日:2002-06-24

    IPC分类号: H01L2978

    CPC分类号: H01L29/0634 H01L29/7835

    摘要: The present invention provides an EDMOS (extended drain MOS) device having a lattice type drift region and a method of manufacturing the same. In the case of n channel EDMOS(nEDMOS), the drift region has a lattice structure in which an n lattice having a high concentration and a p lattice having a low concentration are alternately arranged. As a drain voltage is applied, a depletion layer is abruptly extended by a pn junction of the n lattice and the p lattice, so that the entire drift region is easily depleted. Therefore, a breakdown voltage of the device is increased, and an on resistance of the device is decreased due to the n lattice with high concentration.

    摘要翻译: 本发明提供一种具有晶格型漂移区域的EDMOS(延伸漏极MOS)器件及其制造方法。 在n沟道EDMOS(nEDMOS)的情况下,漂移区域具有晶格结构,其中具有高浓度的n晶格和具有低浓度的p晶格交替排列。 当施加漏极电压时,耗尽层被n晶格和p晶格的pn结突然延伸,使得整个漂移区域容易耗尽。 因此,器件的击穿电压增加,并且由于具有高浓度的n晶格,器件的导通电阻降低。

    Multiple-gate MOS transistor using Si substrate and method of manufacturing the same
    38.
    发明授权
    Multiple-gate MOS transistor using Si substrate and method of manufacturing the same 有权
    使用Si衬底的多栅极MOS晶体管及其制造方法

    公开(公告)号:US08164137B2

    公开(公告)日:2012-04-24

    申请号:US12556666

    申请日:2009-09-10

    IPC分类号: H01L29/66 H01L21/02

    摘要: Provided are a multiple-gate MOS (metal oxide semiconductor) transistor and a method of manufacturing the same. The transistor includes a single crystalline active region having a channel region having an upper portion of a streamlined shape (∩) obtained by patterning an upper portion of a bulk silicon substrate with an embossed pattern, and having a thicker and wider area than the channel region; a nitride layer formed at both side surfaces of the single crystalline active region to expose an upper portion of the single crystalline active region at a predetermined height; and a gate electrode formed to be overlaid with the exposed upper portion of the single crystalline active region of the channel region.

    摘要翻译: 提供一种多栅极MOS(金属氧化物半导体)晶体管及其制造方法。 晶体管包括具有通道区域的单晶有源区域,沟道区域具有通过用压花图案图案化体硅衬底的上部并且具有比沟道区域更厚和更宽的面积而获得的流线型形状(∩)的上部 ; 形成在所述单晶有源区的两个侧表面处的氮化物层,以在预定高度暴露所述单晶有源区的上部; 以及形成为与通道区域的单晶有源区域的暴露的上部分重叠的栅电极。

    Dual structure FinFET and method of manufacturing the same
    39.
    发明授权
    Dual structure FinFET and method of manufacturing the same 有权
    双结构FinFET及其制造方法

    公开(公告)号:US07759737B2

    公开(公告)日:2010-07-20

    申请号:US11924903

    申请日:2007-10-26

    IPC分类号: H01L27/12

    摘要: Provided are a dual structure FinFET and a method of fabricating the same. The FinFET includes: a lower device including a lower silicon layer formed on a substrate and a gate electrode vertically formed on the substrate; an upper device including an upper silicon layer formed on the lower device and the vertically formed gate electrode; and a first solid source material layer, a solid source material interlayer insulating layer, and a second solid source material layer sequentially formed between the lower silicon layer and the upper silicon layer. Therefore, the FinFET can be provided which enhances the density of integration of a circuit, suppresses thin film damages due to ion implantation using solid phase material layers, and has a stabilized characteristic by a simple and low-cost process. Also, mobility of an upper device can be improved to enhance current drivability of the upper device, isolation can be implemented through a buried oxide layer to reduce an effect due to a field oxide layer, and raised source and drain can be implemented to reduce serial resistance components of the source and drain to increase current drivability.

    摘要翻译: 提供了一种双重结构的FinFET及其制造方法。 FinFET包括:下部器件,包括形成在衬底上的下硅层和垂直形成在衬底上的栅电极; 上部器件,包括形成在下部器件上的上硅层和垂直形成的栅电极; 以及顺序地形成在下硅层和上硅层之间的第一固体源材料层,固体源材料层间绝缘层和第二固体源材料层。 因此,可以提供FinFET,其增强电路的集成密度,抑制由于使用固相材料层的离子注入引起的薄膜损伤,并且通过简单且低成本的工艺具有稳定的特性。 此外,可以提高上部器件的迁移率以增强上部器件的电流驱动能力,可以通过掩埋氧化物层实现隔离,以减少由于场氧化物层引起的影响,并且可以实现升高的源极和漏极以减少串联 源极和漏极的电阻分量以增加电流驱动能力。

    High voltage MOSFET having Si/SiGe heterojunction structure and method of manufacturing the same
    40.
    发明授权
    High voltage MOSFET having Si/SiGe heterojunction structure and method of manufacturing the same 有权
    具有Si / SiGe异质结结构的高压MOSFET及其制造方法

    公开(公告)号:US07709330B2

    公开(公告)日:2010-05-04

    申请号:US11745574

    申请日:2007-05-08

    IPC分类号: H01L21/8234

    摘要: Provided are high voltage metal oxide semiconductor field effect transistor (HVMOSFET) having a Si/SiGe heterojunction structure and method of manufacturing the same. In this method, a substrate on which a Si layer, a relaxed SiGe epitaxial layer, a SiGe epitaxial layer, and a Si epitaxial layer are stacked or a substrate on which a Si layer having a well region, a SiGe epitaxial layer, and a Si epitaxial layer are stacked is formed. For the device having the heterojunction structure, the number of conduction carriers through a potential well and the mobility of the carriers increase to reduce an on resistance, thus increasing saturation current. Also, an intensity of vertical electric field decreases so that a breakdown voltage can be maintained at a very high level. Further, a reduction in vertical electric field due to the heterojunction structure leads to a gain in transconductance (Gm), with the results that a hot electron effect is inhibited and the reliability of the device is enhanced.

    摘要翻译: 提供了具有Si / SiGe异质结结构的高压金属氧化物半导体场效应晶体管(HVMOSFET)及其制造方法。 在该方法中,层叠有Si层,弛豫SiGe外延层,SiGe外延层和Si外延层的基板或其上具有阱区的Si层,SiGe外延层和 Si外延层被形成。 对于具有异质结结构的器件,通过势阱的导电载流子数量和载流子的迁移率增加,以降低导通电阻,从而增加饱和电流。 此外,垂直电场的强度降低,使得击穿电压可以保持在非常高的水平。 此外,由于异质结构造成的垂直电场的减少导致跨导增益(Gm),结果是热电子效应被抑制,并且器件的可靠性增强。