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    SPUTTER AND SURFACE MODIFICATION ETCH PROCESSING FOR METAL PATTERNING IN INTEGRATED CIRCUITS
    32.
    发明申请
    SPUTTER AND SURFACE MODIFICATION ETCH PROCESSING FOR METAL PATTERNING IN INTEGRATED CIRCUITS 审中-公开
    集成电路中金属图案的溅射和表面改性蚀刻加工

    公开(公告)号：US20140127906A1

    公开(公告)日：2014-05-08

    申请号：US13671166

    申请日：2012-11-07

    申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

    发明人： Cyril Cabral, JR. ,  Benjamin L. Fletcher ,  Nicholas C.M. Fuller ,  Eric A. Joseph ,  Hiroyuki Miyazoe

    IPC分类号： H01L21/3213

    CPC分类号： H01L21/32136 ,  H01L21/32131 ,  H01L21/76852 ,  H01L21/76885 ,  H01L23/48 ,  H01L2924/0002 ,  H01L2924/00

    摘要： Fabricating conductive lines in an integrated circuit includes providing a conductive metal in a multi-layer structure, performing a first sputter etch of the conductive metal using methanol plasma, and performing a second sputter etch of the conductive metal using a second plasma, wherein a portion of the conductive metal that remains after the second sputter etch forms the conductive lines. Alternatively, fabricating conductive lines includes providing a conductive metal as an intermediate layer in a multi-layer structure, etching the multi-layer structure to expose the conductive metal, performing a first etch of the conductive metal using methanol plasma, performing a second sputter etch of the conductive metal using a second plasma, wherein a portion of the conductive metal that remains after the second sputter etch forms the conductive lines, forming a liner that surrounds the conductive lines, and depositing a dielectric layer on the multi-layer structure.

    摘要翻译： 在集成电路中制造导线包括提供多层结构中的导电金属，使用甲醇等离子体执行导电金属的第一溅射蚀刻，以及使用第二等离子体执行导电金属的第二溅射蚀刻，其中部分 在第二次溅射蚀刻后残留的导电金属形成导电线。 或者，制造导线包括以多层结构提供作为中间层的导电金属，蚀刻多层结构以暴露导电金属，使用甲醇等离子体执行导电金属的第一蚀刻，执行第二溅射蚀刻 使用第二等离子体的导电金属，其中在第二溅射蚀刻之后保留的导电金属的一部分形成导电线，形成围绕导电线的衬垫，以及在多层结构上沉积介电层。

    Smarter operating systems: file system events
    34.
    发明授权
    Smarter operating systems: file system events 有权

    公开(公告)号：US09733922B2

    公开(公告)日：2017-08-15

    申请号：US14791529

    申请日：2015-07-06

    申请人： International Business Machines Corporation

    发明人： Eric J. Barkie ,  Benjamin L. Fletcher ,  Andrew P. Wyskida

    IPC分类号： G06F9/445

    CPC分类号： G06F8/65 ,  G06F8/61

    摘要： An on device client that augments operating system functionality may monitor for an event from an operating system running on a processor of a device. Responsive to determining that the event is indicative of an installation of an application on the device, the on device client may generate a table associated with the application. The table comprises locations of file system entities associated with the application. The table is stored in a memory device. Responsive to determining that the event is indicative of a modification to the application installed on the device, the on device client may trigger one or more automatic processor actions to keep the modification consistent across the file system entities of the application.

    USER AUTHENTICATION RELYING ON RECURRING PUBLIC EVENTS FOR SHARED SECRETS
    37.
    发明申请
    USER AUTHENTICATION RELYING ON RECURRING PUBLIC EVENTS FOR SHARED SECRETS 审中-公开
    用户认可依赖于共同秘密的公开活动

    公开(公告)号：US20170054704A1

    公开(公告)日：2017-02-23

    申请号：US15343294

    申请日：2016-11-04

    申请人： International Business Machines Corporation

    发明人： Eric J. Barkie ,  Benjamin L. Fletcher ,  Andrew P. Wyskida

    IPC分类号： H04L29/06

    CPC分类号： H04L63/067 ,  H04L63/065 ,  H04L63/083 ,  H04L63/10

    摘要： An access manager manages access to a resource. At a first time, the access manager designates a variable attribute associated with a recurring public event as a shared secret between the access manager and a user. At a second time occurring after the first time, the access manager receives a shared key from the user. As received, the shared key is based on a value of the variable attribute associated with the recurring public event at a most recent recurrence of the recurring public event relative to the second time. The access manager evaluates the shared key. In response to the evaluation, the access manager grants or denies the user access to the resource.

    摘要翻译： 访问管理器管理对资源的访问。 第一次，访问管理器将与循环公共事件相关联的变量属性指定为访问管理器和用户之间的共享秘密。 在第一次发生第二次之后，访问管理器从用户接收共享密钥。 如所收到的那样，共享密钥基于与循环公共事件相关联的可变属性的值，该值与在第二次重复出现的公共事件的最近一次重复相关。 访问管理器评估共享密钥。 响应于评估，访问管理器授予或拒绝用户对资源的访问。

    MANAGING LIMITED NETWORK ACCESS CONFIGURATION
    38.
    发明申请
    MANAGING LIMITED NETWORK ACCESS CONFIGURATION 有权
    管理有限的网络访问配置

    公开(公告)号：US20160241563A1

    公开(公告)日：2016-08-18

    申请号：US14623001

    申请日：2015-02-16

    申请人： International Business Machines Corporation

    发明人： Eric J. Barkie ,  Benjamin L. Fletcher ,  Andrew P. Wyskida

    IPC分类号： H04L29/06 ,  H04L29/12 ,  H04L12/24

    CPC分类号： H04L63/102 ,  H04L41/0803 ,  H04L41/0813 ,  H04L61/6022 ,  H04L63/02 ,  H04L63/162 ,  H04L63/164 ,  H04L67/42

    摘要： A system, a method, and a computer program product for managing network configuration by a controller. A request to connect a device to a network is received. The network is accessed by the device by a port. The controller determines the device to be authorized to connect to the network. The controller configures the port in response to determining the device as an authorized device to connect to the network. The controller configures the port according to a first set of parameters. The first set of parameters regulate communication of the device on the network. After configuring the port, the controller monitors a set of communications. The controller monitors the set of communications for an error. By monitoring the set of communications, the controller determines whether the port meets network specifications.

    摘要翻译： 一种用于由控制器管理网络配置的系统，方法和计算机程序产品。 接收到将设备连接到网络的请求。 网络由设备由端口访问。 控制器确定要被授权连接到网络的设备。 控制器配置端口以响应将设备确定为连接到网络的授权设备。 控制器根据第一组参数配置端口。 第一组参数调节网络上设备的通信。 配置端口后，控制器监视一组通信。 控制器监视一组错误的通信。 通过监控通信集，控制器确定端口是否符合网络规格。

    Sputter and surface modification etch processing for metal patterning in integrated circuits
    39.
    发明授权
    Sputter and surface modification etch processing for metal patterning in integrated circuits 有权
    集成电路中金属图案化的溅射和表面改性蚀刻处理

    公开(公告)号：US09064727B2

    公开(公告)日：2015-06-23

    申请号：US13970678

    申请日：2013-08-20

    申请人： International Business Machines Corporation

    发明人： Cyril Cabral, Jr. ,  Benjamin L. Fletcher ,  Nicholas C. M. Fuller ,  Eric A. Joseph ,  Hiroyuki Miyazoe

    IPC分类号： H01L27/092 ,  H01L21/3213 ,  H01L21/768

    CPC分类号： H01L23/535 ,  H01L21/02109 ,  H01L21/31111 ,  H01L21/32131 ,  H01L21/32136 ,  H01L21/32139 ,  H01L21/76852 ,  H01L21/76856 ,  H01L21/76885 ,  H01L21/823871 ,  H01L27/092 ,  H01L2924/0002 ,  H01L2924/00

    摘要： One embodiment of an integrated circuit includes a plurality of semiconductor devices and a plurality of conductive lines connecting the plurality of semiconductor devices, wherein at least some of the plurality of conductive lines have pitches of less than one hundred nanometers and sidewall tapers of between approximately eighty and ninety degrees. Another embodiment of an integrated circuit includes a plurality of semiconductor devices and a plurality of conductive lines connecting the plurality of semiconductor devices, wherein at least some of the plurality of conductive lines are fabricated by providing a layer of conductive metal in a multi-layer structure fabricated upon a wafer and sputter etching the layer of conductive metal using a methanol plasma, wherein a portion of the layer of conductive metal that remains after the sputter etching forms the one or more conductive lines.

    摘要翻译： 集成电路的一个实施例包括多个半导体器件和连接多个半导体器件的多条导线，其中多条导线中的至少一些具有小于百纳米的间距，以及约八十 和九十度。 集成电路的另一实施例包括多个半导体器件和连接多个半导体器件的多条导线，其中通过提供多层结构中的导电金属层来制造多条导线中的至少一些 制造在晶片上并使用甲醇等离子体溅射蚀刻导电金属层，其中在溅射蚀刻之后保留的导电金属层的一部分形成一个或多个导电线。