摘要:
A potential sensor including first and second detection electrodes opposed to an object of which a potential is to be measured, and a movable shutter so positioned between the detection electrodes and the potential-measured object with gaps thereto; wherein the movable shutter can assume a first state and a second state, the first detection electrode is exposed to the potential-measured object wider when the movable shutter assumes the first state than when the movable shutter assumes the second state, and the second detection electrode is exposed to the potential-measured object narrower when the movable shutter assumes the first state than when the movable shutter assumes the second state.
摘要:
A potential sensor (101) including first and second detection electrodes (121 a, b) opposed to an object of which a potential is to be measured, and a movable shutter (125) so positioned between the detection electrodes and the potential-measured object with gaps thereto; wherein the movable shutter can assume a first state and a second state, the first detection electrode is exposed to the potential-measured object wider when the movable shutter assumes the first state than when the movable shutter assumes the second state, and the second detection electrode is exposed to the potential-measured object narrower when the movable shutter assumes the first state than when the movable shutter assumes the second state.
摘要:
A potential sensor including first and second detection electrodes opposed to an object of which a potential is to be measured, and a movable shutter so positioned between the detection electrodes and the potential-measured object with gaps thereto. The movable shutter can assume a first state and a second state. The first detection electrode is exposed to the potential-measured object wider when the movable shutter assumes the second state. The second detection electrode is exposed to the potential-measured object narrower when the movable shutter assumes the first state than when the movable shutter assumes the second state.
摘要:
An oscillating device includes an oscillator, an elastic supporting member for movably supporting the oscillator, a first supporting frame for supporting the elastic supporting member, and a second supporting frame extending along the elastic supporting member with a spacing maintained therebetween, the second supporting member extending from the first supporting frame, wherein the second supporting frame is provided in a cantilever shape relative to the first supporting frame.
摘要:
An oscillating device includes an oscillator, an elastic supporting member for movably supporting the oscillator, a first supporting frame for supporting the elastic supporting member, and a second supporting frame extending along the elastic supporting member with a spacing maintained therebetween, the second supporting member extending from the first supporting frame, wherein the second supporting frame is provided in a cantilever shape relative to the first supporting frame.
摘要:
An oscillator device includes an oscillator, a resilient support member configured to support the oscillator for oscillatory motion about an oscillation central axis, a magnetic member provided on the oscillator, and a magnetic-field generating member disposed opposed to the oscillator, wherein the oscillator has a through-hole extending through the oscillator from its top surface to its bottom surface, and wherein the magnetic member is provided in the through-hole.
摘要:
An oscillator device includes an oscillator, a resilient support member configured to support the oscillator for oscillatory motion about an oscillation central axis, a magnetic member provided on the oscillator, and a magnetic-field generating member disposed opposed to the oscillator, wherein the oscillator has a through-hole extending through the oscillator from its top surface to its bottom surface, and wherein the magnetic member is provided in the through-hole.
摘要:
An inspection apparatus for inspecting output signal of a semiconductor device is provided with a monitor device configured to sense a signal on the monitor line and a plurality of inspection circuits connected to the monitor line. Each inspection circuit is provided with a semiconductor device support allowing a semiconductor device to be set thereon and including a signal terminal to which a signal is input from the set semiconductor device, a first resistor connected between the signal terminal and the monitor line, a selector terminal, and a first diode connected between the signal terminal and the selector terminal so that a cathode of the first diode is connected to a selector terminal side.
摘要:
An oscillating structure includes a supporting member, a first oscillating member, second oscillating member, a first resilient supporting member configured to connect the supporting member and the first oscillating member and to support the first oscillating member for oscillatory motion around the supporting member as a central axis, and a second resilient supporting member configured to connect the first oscillating member and the second oscillating member and to support the second oscillating member movably relative to the first oscillating member, wherein the direction in which the first resilient supporting member extends from the supporting member to the first oscillating member and the direction in which the second resilient supporting member extends from the first oscillating member to the second oscillating member are opposite to each other.
摘要:
In a method of fabricating an array of microstructures, a substrate with an electrically-conductive portion is provided, an insulating mask layer is formed on the electrically-conductive portion of the substrate, a plurality of openings are formed in the insulating mask layer to expose the electrically-conductive portion, and a first plated or electrodeposited layer is deposited in the openings and on the insulating mask layer by electroplating or electrodeposition. A second plated layer is further formed on the first plated or electrodeposited layer and on the electrically-conductive portion by electroless plating to reduce a size distribution of microstructures over the array.