摘要:
An oscillating structure includes a supporting member, a first oscillating member, second oscillating member, a first resilient supporting member configured to connect the supporting member and the first oscillating member and to support the first oscillating member for oscillatory motion around the supporting member as a central axis, and a second resilient supporting member configured to connect the first oscillating member and the second oscillating member and to support the second oscillating member movably relative to the first oscillating member, wherein the direction in which the first resilient supporting member extends from the supporting member to the first oscillating member and the direction in which the second resilient supporting member extends from the first oscillating member to the second oscillating member are opposite to each other.
摘要:
An inspection apparatus for inspecting output signal of a semiconductor device is provided with a monitor device configured to sense a signal on the monitor line and a plurality of inspection circuits connected to the monitor line. Each inspection circuit is provided with a semiconductor device support allowing a semiconductor device to be set thereon and including a signal terminal to which a signal is input from the set semiconductor device, a first resistor connected between the signal terminal and the monitor line, a selector terminal, and a first diode connected between the signal terminal and the selector terminal so that a cathode of the first diode is connected to a selector terminal side.
摘要:
An oscillating device includes an oscillator, an elastic supporting member for movably supporting the oscillator, a first supporting frame for supporting the elastic supporting member, and a second supporting frame extending along the elastic supporting member with a spacing maintained therebetween, the second supporting member extending from the first supporting frame, wherein the second supporting frame is provided in a cantilever shape relative to the first supporting frame.
摘要:
A potential measurement apparatus is provided which can suitably maintain the oscillation state of an oscillator including a detection electrode and stably measure the potential of a measurement object. The potential measurement apparatus includes a bearing part, an elastic supporting part supported by the bearing part, an oscillator movably supported by the elastic supporting part, detection electrodes installed in the oscillator, a drive mechanism driving the oscillator and a signal detection unit. The signal detection unit is connected to the detection electrodes to detect electrical signals appearing in the detected electrodes. A stress detecting element for generating an electric signal according to the stress of the elastic suspension part 142 is provided.
摘要:
A potential sensor is provided in which the adhesion of toner particles to the potential sensor is reduced or prevented from occurring, reducing or preventing the occurrence of a situation that accurate detection cannot be performed. The potential sensor has a movable member, detecting electrodes formed on the movable member, a support which movably supports the movable member, a driving mechanism which drives the movable member, and a stationary member which supports the support. Between the movable member and the stationary member, a first gap is so formed as to make the movable member 101 movable. The first gap has a part that is not larger in width than the maximum size of toner particles when the movable member is not elastically deformed and is at a neutral position.
摘要:
A potential measuring apparatus has a detection electrode on which an electric charge is induced according to a potential of a detection object, and a modulator for altering the generated quantity of the electric charge. The detection electrode has at least one depressed portion on a surface opposite to the detection object.
摘要:
An electric potential measuring apparatus including a substrate disposed facing a measurement object, a detecting electrode provided insulated from the substrate, and a capacity modulating unit for modulating a coupling capacity between the detecting electrode and the measurement object. In the electric potential measuring apparatus, a region with a dielectric constant less than a dielectric constant of the substrate is formed in the substrate to achieve an increase in resistivity of a portion of the substrate between detecting electrodes, or a decrease in a stray capacity between the detecting electrode and the substrate.
摘要:
Disclosed in a non-contacting electric potential sensor capable of being readily reduced in its size, which includes a detecting electrode, an electrically-conductive movable shutter, and a driving unit for driving the electrically-conductive movable shutter. The detecting electrode is to be placed facing a measurement object whose electric potential is to be measured. The electrically-conductive movable shutter is disposed so as to be movably located in a spacing formed between the detecting electrode and the measurement object when the detecting electrode is placed facing the measurement object, so that an exposure degree of the detecting electrode against the measurement object can be controlled. The driving unit includes a current injecting unit for selectively injecting current into the electrically-conductive movable shutter in a direction approximately perpendicular to a moving direction of the electrically-conductive movable shutter.
摘要:
In a method of fabricating an array of microstructures, a substrate with an electrically-conductive portion is provided, an insulating mask layer is formed on the electrically-conductive portion of the substrate, a plurality of openings are formed in the insulating mask layer to expose the electrically-conductive portion, and a first plated or electrodeposited layer is deposited in the openings and on the insulating mask layer by electroplating or electrodeposition. A second plated layer is further formed on the first plated or electrodeposited layer and on the electrically-conductive portion by electroless plating to reduce a size distribution of microstructures over the array.
摘要:
A fabrication method of fabricating an array of microstructures is provided. The method includes the step of preparing a substrate with a surface including a usable region and a dummy region continuously set around the usable region, at least the usable region and the dummy region of the substrate are electrically conductive and have a conductive portion. The method also includes the steps of forming a first insulating layer on the conductive portion, and forming a plurality of openings in the first insulating layer, the openings being arranged in a predetermined array pattern. Additionally, the method includes the step of performing one of electroplating and electrodeposition using the conductive portion as an electrode to form a first plated or electrodeposited layer in the openings and on the first insulating layer in both the usable region and the dummy region.