Patterning process and resist composition
    36.
    发明授权
    Patterning process and resist composition 有权
    图案化过程和抗蚀剂组成

    公开(公告)号:US08828647B2

    公开(公告)日:2014-09-09

    申请号:US13482650

    申请日:2012-05-29

    摘要: A negative pattern is formed by applying a resist composition onto a substrate, prebaking, exposing to high-energy radiation, baking (PEB), and developing the exposed resist film in an organic solvent developer to dissolve the unexposed region of resist film. The resist composition comprising a polymer comprising recurring units having an acid labile group-substituted carboxyl group and/or hydroxy group and recurring units having an oxirane or oxetane ring, an acid generator, and an organic solvent displays a high dissolution contrast in organic solvent development and controlled acid diffusion. A fine hole pattern featuring good size control can be formed.

    摘要翻译: 通过将抗蚀剂组合物施加到基材上,预烘烤,暴露于高能辐射,烘烤(PEB)和在有机溶剂显影剂中显影曝光的抗蚀剂膜以溶解抗蚀剂膜的未曝光区域来形成负图案。 包含具有酸不稳定基团取代的羧基和/或羟基的重复单元的聚合物和具有环氧乙烷或氧杂环丁烷环的重复单元,酸产生剂和有机溶剂的抗蚀剂组合物在有机溶剂显影中显示高溶解度对比度 并控制酸扩散。 可以形成具有良好尺寸控制的细孔图案。

    PATTERNING PROCESS
    37.
    发明申请
    PATTERNING PROCESS 有权
    绘图过程

    公开(公告)号:US20120276485A1

    公开(公告)日:2012-11-01

    申请号:US13456705

    申请日:2012-04-26

    IPC分类号: G03F7/20

    CPC分类号: G03F7/0397

    摘要: A negative pattern is formed by applying a resist composition onto a substrate, baking, exposing to high-energy radiation, baking (PEB), and developing the exposed resist film in an organic solvent developer to selectively dissolve the unexposed region of resist film. The resist composition comprising a hydrogenated ROMP polymer and a (meth)acrylate resin displays a high dissolution contrast in organic solvent development, and exhibits high dry etch resistance even when the acid labile group is deprotected through exposure and PEB.

    摘要翻译: 通过将抗蚀剂组合物涂布在基材上,烘烤,暴露于高能量辐射,烘烤(PEB)和在有机溶剂显影剂中曝光的抗蚀剂膜显影以选择性地溶解抗蚀剂膜的未曝光区域,形成负型图案。 包含氢化ROMP聚合物和(甲基)丙烯酸酯树脂的抗蚀剂组合物在有机溶剂显影中表现出高的溶解对比度,并且即使当酸不稳定基团通过曝光和PEB脱保护时也显示出高的耐干蚀刻性。