公开(公告)号：US6062241A

公开(公告)日：2000-05-16

申请号：US78537

申请日：1998-05-13

申请人： Kiyohisa Tateyama ,  Tatsuya Iwasaki

发明人： Kiyohisa Tateyama ,  Tatsuya Iwasaki

IPC分类号： B65G49/07 ,  B25B11/00 ,  B25J15/06 ,  H01L21/677 ,  H01L21/683 ,  B08B3/00

CPC分类号： B25B11/007 ,  B25J15/0616 ,  H01L21/6838 ,  Y10S134/902

摘要： According to the present invention, there is provided a substrate conveying device for loading/unloading a substrate to/from a processing section, including an arm for holding the substrate, an arm drive mechanism for driving the arm such as to load/unload the substrate to/from the processing section, a first suction pad provided on the arm, for suctioning the substrate, a second suction pad provided on the arm at a position adjacent to that of the first suction pad, for suctioning the substrate, and a projecting member provided between the first and second suction pads of the arm, so as to control a posture of the substrate to be suctioned one of the first and second suction pads as the projecting member abuts the lower surface of the substrate.

摘要翻译： 根据本发明，提供了一种用于将基板装载到/从处理部分卸载基板的基板输送装置，包括用于保持基板的臂，用于驱动臂的臂驱动机构，以装载/卸载基板 设置在所述臂上的用于吸引所述基板的第一吸盘，与所述第一吸垫相邻的位置设置在所述臂上的用于吸引所述基板的第二吸盘，以及突出构件 设置在所述臂的所述第一和第二吸附垫之间，以便当所述突出构件抵靠所述基板的下表面时，控制所述第一和第二吸附垫中的一个的基板的姿势。

公开(公告)号：US6056828A

公开(公告)日：2000-05-02

申请号：US353048

申请日：1999-07-13

申请人： Kiyohisa Tateyama

发明人： Kiyohisa Tateyama

IPC分类号： B65G49/07 ,  G03F7/20 ,  H01L21/677 ,  H01L21/683 ,  B08B13/00

CPC分类号： H01L21/67748 ,  G03F7/7075 ,  H01L21/67742 ,  H01L21/6838 ,  Y10S134/902 ,  Y10S414/137 ,  Y10S414/141

摘要： According to the present invention, there is provided a substrate conveying apparatus for loading/unloading a substrate to/from a processing section, including an arm for holding the substrate on an upper surface thereof, an arm drive mechanism for driving the arm such as to load/unload the substrate to/from the processing section, first and second suction members each having an opening communicating to a suction hole of the suction passage, for supporting the substrate by at least an edge portion of the opening, and a switching mechanism for selectively switching a mode between the support of the substrate by the first suction member and that by the second suction member.

摘要翻译： 根据本发明，提供了一种用于向/从处理部分装载/卸载基板的基板输送装置，包括用于将基板保持在其上表面上的臂，用于驱动臂的臂驱动机构， 将基板装载/卸载处理部分，第一和第二抽吸部件各自具有与吸入通道的吸入孔相通的开口，用于通过开口的至少边缘部分支撑基板;以及切换机构， 通过第一抽吸构件和由第二抽吸构件选择性地切换衬底的支撑之间的模式。

公开(公告)号：US5993552A

公开(公告)日：1999-11-30

申请号：US904850

申请日：1997-08-01

申请人： Takeshi Tsukamoto ,  Kiyohisa Tateyama ,  Kazuhiko Murata

发明人： Takeshi Tsukamoto ,  Kiyohisa Tateyama ,  Kazuhiko Murata

IPC分类号： G03F7/16 ,  H01L21/00 ,  B05B13/02 ,  B08B3/00

CPC分类号： H01L21/6715 ,  G03F7/162

摘要： A processing apparatus comprises a resist coating machine for coating resist on the surface of a substrate, a resist removing machine for removing the unnecessary resist stuck to the peripheral portion of the substrate carried out of the resist coating machine, and a transport arm for transporting the substrate from the resist coating machine to the resist removing machine, wherein the resist removing machine comprises a substrate table on which the substrate brought in by the transport arm is placed, a nozzle for spraying a solvent on the peripheral portion to remove the unnecessary resist stuck to the peripheral portion of the substrate on the substrate table; a discharge machine for discharging the solvent used to dissolve and remove the unnecessary resist and the dissolved and removed resist, and an exhaust machine for exhausting the atmosphere under the substrate table downward.

摘要翻译： 一种处理装置，包括：抗蚀剂涂布机，用于在基材表面上涂覆抗蚀剂;抗蚀剂去除机，用于除去粘附在抗蚀剂涂布机的基板周边部分上的不必要的抗蚀剂;以及传送臂， 从抗蚀剂涂布机到抗蚀剂去除机的基板，其中抗蚀剂去除机包括放置由输送臂带入的基板的基板台，用于在周边部分上喷涂溶剂以除去不必要的抗蚀剂的喷嘴 到基板上的基板的周边部分; 用于排出用于溶解和去除不需要的抗蚀剂和溶解去除的抗蚀剂的溶剂的放电机，以及用于向下排出衬底台下的气氛的排气机。

公开(公告)号：US5993518A

公开(公告)日：1999-11-30

申请号：US23184

申请日：1998-02-13

申请人： Kiyohisa Tateyama

发明人： Kiyohisa Tateyama

IPC分类号： B01D19/00

CPC分类号： B01D19/0052

摘要： A deaerating apparatus for removing a gas from a liquid, including a liquid container rotatable and storing the liquid from which the gas is to be removed, a rotating device for rotating the liquid container, a sucking device for absorbing the gas from the liquid container; a feed-out device for feeding out the liquid stored in the liquid container, a liquid introducing pipe for introducing the liquid into the liquid container, a gas exhausting pipe for exhausting the gas from the liquid container, a liquid feed-out pipe for feeding out the liquid from the liquid container, and a head member which is removably placed on the liquid container, with the head member in contact with the liquid container. With the head member separated a predetermined interval from the liquid container, the liquid container is rotated to collect the gas contained in the liquid to the center of the liquid container. Then, the gas in the liquid container is absorbed, with the liquid container semi-closed. In this manner, the gas contained in a liquid such as a resist solution, a developing solution, and a solvent can be removed sufficiently.

摘要翻译： 一种用于从液体中除去气体的脱气装置，包括可旋转的液体容器和储存要从其中排出的气体的液体，用于旋转液体容器的旋转装置，用于从液体容器吸收气体的吸入装置; 用于输出存储在液体容器中的液体的送出装置，用于将液体引入液体容器的液体导入管，用于从液体容器排出气体的排气管，用于进给的液体供给管 从液体容器排出液体，以及头部构件，其可移除地放置在液体容器上，头部构件与液体容器接触。 当头部构件与液体容器分隔预定间隔时，液体容器旋转以将包含在液体中的气体收集到液体容器的中心。 然后，液体容器中的气体被吸收，液体容器半封闭。 以这种方式，可以充分地除去包含在诸如抗蚀剂溶液，显影液和溶剂的液体中的气体。

公开(公告)号：US5945161A

公开(公告)日：1999-08-31

申请号：US993021

申请日：1997-12-18

申请人： Hiroshi Hashimoto ,  Kiyohisa Tateyama ,  Kiyomitsu Yamaguchi ,  Yoshitaka Matsuda ,  Norio Uchihira ,  Mitsuhiro Sakai ,  Fumio Satou

发明人： Hiroshi Hashimoto ,  Kiyohisa Tateyama ,  Kiyomitsu Yamaguchi ,  Yoshitaka Matsuda ,  Norio Uchihira ,  Mitsuhiro Sakai ,  Fumio Satou

IPC分类号： B05C11/08 ,  B05D1/00 ,  H01L21/00 ,  B05D3/12

CPC分类号： H01L21/6715 ,  B05C11/08 ,  B05D1/005

摘要： Disclosed is a processing apparatus comprising holding means, support means, process solution supply means, life means, and rotating means. A substrate to be processed is rotatably held by the holding means. An overhanging portion of the substrate extending over an edge of the holding means is supported by the support means to maintain a front surface of the substrate horizontally flat. A process solution is supplied from the process solution supply means onto the front surface of the substrate held by the holding means and supported by the support means. The substrate held by the holding means is vertically moved by the lift means relative to the support means. Further, the substrate moved upward relative to the support means is rotated by the rotating means.

摘要翻译： 公开了一种处理装置，包括保持装置，支撑装置，处理液供给装置，寿命装置和旋转装置。 待加工的基板被保持装置可旋转地保持。 在保持装置的边缘上延伸的衬底的悬伸部分被支撑装置支撑，以使衬底的前表面水平地保持平坦。 处理液从处理液供给装置供给到由保持装置保持的基板的前表面上并由支撑装置支撑。 由保持装置保持的基板通过提升装置相对于支撑装置垂直移动。 此外，相对于支撑装置向上移动的基板由旋转装置旋转。

公开(公告)号：US5912054A

公开(公告)日：1999-06-15

申请号：US915610

申请日：1997-08-21

申请人： Kiyohisa Tateyama

发明人： Kiyohisa Tateyama

IPC分类号： B05C5/00 ,  B05B15/02 ,  B05C11/08 ,  G03F7/16 ,  G03F7/30 ,  H01L21/027 ,  B05D1/02 ,  B05D3/12 ,  B08B7/00 ,  B05B3/00

CPC分类号： G03F7/162 ,  B05B15/0208 ,  G03F7/30 ,  B05B15/025 ,  B05C11/08

摘要： A coating apparatus has a nozzle for delivering a photo-resist liquid onto a semiconductor wafer supported by a spin chuck. The nozzle is movable between a supply position and a wait position. At the wait position, there are a roller which is rotatable in one direction and has a circumferential surface with thinner thereon, and a wiper for wiping the circumferential surface of the roller. While the nozzle is located at the wait position, a waiting mode is first performed, and a preparing mode is then performed immediately before the nozzle is moved from the wait position to the supply position. In the waiting mode, delivery of the photo-resist liquid from the nozzle is stopped and the wiper is located at a retreat position, such that a tip port of the nozzle is wetted by the thinner present on the circumferential surface of the roller. In the preparing mode, the processing liquid is delivered from the tip port of the nozzle onto the circumferential surface of the roller, and the wiper is located at a project position such that the processing liquid is removed from the circumferential surface of the roller.

摘要翻译： 涂布装置具有用于将光致抗蚀剂液体输送到由旋转卡盘支撑的半导体晶片上的喷嘴。 喷嘴可在供给位置和等待位置之间移动。 在等待位置，有一个可在一个方向上旋转并具有较薄的圆周表面的滚子，以及用于擦拭滚筒圆周表面的刮水器。 当喷嘴位于等待位置时，首先执行等待模式，然后在喷嘴从等待位置移动到供应位置之前立即执行准备模式。 在等待模式中，停止从喷嘴输送光致抗蚀剂液体，并且擦拭器位于退避位置，使得喷嘴的尖端口被存在于辊的圆周表面上的较薄的部分润湿。 在准备模式中，处理液从喷嘴的前端口传送到辊的圆周表面上，并且擦拭器位于使处理液从辊的圆周表面移除的突出位置。

公开(公告)号：US5853803A

公开(公告)日：1998-12-29

申请号：US964608

申请日：1997-11-05

申请人： Kiyohisa Tateyama ,  Kimio Motoda ,  Tatsuya Iwasaki ,  Takenobu Matsuo ,  Kazuki Denpoh ,  Eiji Yamaguchi

发明人： Kiyohisa Tateyama ,  Kimio Motoda ,  Tatsuya Iwasaki ,  Takenobu Matsuo ,  Kazuki Denpoh ,  Eiji Yamaguchi

IPC分类号： B05C11/08 ,  G03F7/16 ,  H01L21/00 ,  H01L21/687 ,  B05D3/12

CPC分类号： H01L21/67173 ,  B05C11/08 ,  G03F7/162 ,  G03F7/168 ,  H01L21/6715 ,  H01L21/68707 ,  Y10S134/902

摘要： A method of resist-processing a rectangular substrate including a resist coating step of supplying resist solution to the substrate, while rotating it, to form resist film at least on one surface of it and a resist removing step of jetting removing liquid, which can solve resist, to both surfaces of it at its side peripheral portions to remove the resist film from them.

摘要翻译： 一种抗蚀剂处理方法，包括抗蚀剂涂布步骤，该方法包括在将抗蚀剂溶液旋转的同时向其提供抗蚀剂溶液，以至少在其一个表面上形成抗蚀剂膜，以及除去液体的抗蚀剂去除步骤，其可以解决 在其侧边缘处抵抗其两个表面以从它们去除抗蚀剂膜。

公开(公告)号：US5416047A

公开(公告)日：1995-05-16

申请号：US93699

申请日：1993-07-20

申请人： Nobuo Konishi ,  Hideyuki Takamori ,  Masami Akimoto ,  Kiyohisa Tateyama ,  Masaaki Murakami ,  Norimitsu Morioka ,  Takashi Takekuma

发明人： Nobuo Konishi ,  Hideyuki Takamori ,  Masami Akimoto ,  Kiyohisa Tateyama ,  Masaaki Murakami ,  Norimitsu Morioka ,  Takashi Takekuma

IPC分类号： H01L21/00 ,  H01L21/30

CPC分类号： H01L21/67173 ,  H01L21/6715 ,  H01L21/6719 ,  Y10S430/136

摘要： A substrate solution-processing method comprising the steps of preparing a pair of spin chucks by which semiconductor wafers are supported, a housing by which the wafers supported by the spin chucks are enclosed, motor for rotating the spin chucks, a nozzle through which developing or resist solution is applied to each wafer, means for moving the nozzle between the wafers, and a waiting trench at which the nozzle is kept waiting, setting substantially same the times needed to finish the cycles of processing the wafers supported on at least two spin chucks and delaying one process cycle from the other, and keeping the nozzle waiting at the waiting trench unless developing or resist solution is applied to each wafer through the nozzle.

摘要翻译： 一种基板溶液处理方法，包括以下步骤：准备一对支撑半导体晶片的旋转卡盘，包围由旋转卡盘支撑的晶片的壳体，用于旋转旋转卡盘的马达，用于旋转旋转卡盘的马达， 将抗蚀剂溶液施加到每个晶片，用于在晶片之间移动喷嘴的装置以及喷嘴保持等待的等待沟槽，其设置与完成在至少两个旋转夹头上支撑的晶片的处理循环所需的时间基本相同 并且从另一个延迟一个处理周期，并且保持喷嘴等待在等待沟槽，除非通过喷嘴对每个晶片施加显影和抗蚀剂溶液。

公开(公告)号：US5239182A

公开(公告)日：1993-08-24

申请号：US868874

申请日：1992-04-16

申请人： Kiyohisa Tateyama ,  Yasuhiro Sakamoto

发明人： Kiyohisa Tateyama ,  Yasuhiro Sakamoto

IPC分类号： G01B11/26 ,  G01B21/22 ,  G01V8/12 ,  H01L21/00 ,  H01L21/67 ,  H01L21/677

CPC分类号： H01L21/67265 ,  H01L21/67796 ,  Y10S414/137

摘要： A wafer conveyor apparatus which moves a wafer moving device which moves wafers housed in a wafer cassette and performs conveyance the wafers, comprises a first arm provided with a light emitting device, a second arm provided with a light receiving device that detects light emitted from the light emitting device, and a wafer detector that has a judgment device for judging the presence or absence or a housing status of a wafer inside a wafer cassette on the basis of the output information of the light receiving device. In addition, the first arm provided to a conveyor platform and having the light emitting device provided at its distal end and the second arm provided to the conveyor platform and having the light receiving device provided at its distal end, are moved and positioned above and below an outside of an outer peripheral side of the wafer, and the first arm and the second arm are moved in a direction of the thickness of the wafer, light is irradiated from the light emitting device and the light is detected by the light receiving device to measure an apparent thickness of the wafer. Then, the apparent thickness of the wafer as obtained by measurement is compared with an actual thickness of the wafer and an inclination of a housed wafer is detected, and depending upon a detected inclination of the wafer, the wafer is either moved, the housing of the wafer corrected, or alarm processing is performed.

摘要翻译： 移动晶片移动装置的晶片传送装置，其移动容纳在晶片盒中的晶片并执行晶片的输送，包括设置有发光装置的第一臂，设置有光接收装置的第二臂，该光接收装置检测从 发光装置和晶片检测器，其具有根据光接收装置的输出信息判断晶片盒内的晶片的存在或不存在状态的判断装置。 此外，提供给输送机平台并且设置在其远端处的发光装置的第一臂和设置在输送机平台上并且具有设置在其远端处的光接收装置的第二臂被移动并定位在上方和下方 晶片的外周侧的外侧，第一臂和第二臂沿晶片的厚度方向移动，从发光器件照射光，并且光被光接收装置检测到 测量晶片的表观厚度。 然后，将通过测量获得的晶片的表观厚度与晶片的实际厚度进行比较，并且检测到所容纳的晶片的倾斜度，并且根据检测到的晶片的倾斜，晶片被移动，壳体 进行晶片校正或报警处理。

公开(公告)号：US07182531B2

公开(公告)日：2007-02-27

申请号：US11476574

申请日：2006-06-29

申请人： Kiyohisa Tateyama ,  Masafumi Nomura ,  Taketora Shinogi

发明人： Kiyohisa Tateyama ,  Masafumi Nomura ,  Taketora Shinogi

IPC分类号： G03D5/00

CPC分类号： G03D3/065 ,  G03D3/06 ,  G03F7/30 ,  G03F7/3071 ,  H01L21/6715 ,  H01L21/67253

摘要： In this developing method and apparatus, a concentration measuring unit 222 picks part of developing fluid in a blending tank 186 to measure the resist concentration by an absorption photometry and feeds the detected resist concentration to a control unit 240. The control unit 240 controls respective valves 210, 212, 216 of a TMAH concentrate solution 200, a solvent pipe 204 and a drain pipe 208 in a manner that the developing fluid in the blending tank 186 has a TMAH concentration corresponding to a measured resist-concentration value to accomplish a constant developing rate, performing component control of the developing fluid. The developing fluid transferred from the blending tank 186 to a supply tank 188 is fed to a developer nozzle DN in a developing section 126 through a developer pipe 224 owing to the drive of a pump 228. Accordingly, even if the developing fluid is reused in the developing process in multiple times, it is possible to make sure of the uniformity in development.

摘要翻译： 在该显影方法和装置中，浓度测量单元222拾取混合罐186中的显影液的一部分，通过吸收测光法测量抗蚀剂浓度，并将检测到的抗蚀剂浓度输送到控制单元240.控制单元240控制各个阀 210,212,216的TMAH浓缩液200，溶剂管204和排水管208，使得混合罐186中的显影液具有对应于测量的抗蚀剂浓度值的TMAH浓度，以实现恒定显影 速率，执行显影液的成分控制。 从混合罐186输送到供给罐188的显影液由于泵228的驱动而通过显影管224被供给到显影部126中的显影剂喷嘴DN。因此，即使显影液再利用 发展过程多次，有可能确保发展的一致性。