Organic light-emitting diodes comprising carbene-transition metal complex emitter, and at least one compound selected from disilylcarbazoles, disilyldibenzofurans, disilyldibenzothiophenes, disilyldibenzophospholes, disilyldibenzothiophene s-oxides and disilyldibe
    31.
    发明授权
    Organic light-emitting diodes comprising carbene-transition metal complex emitter, and at least one compound selected from disilylcarbazoles, disilyldibenzofurans, disilyldibenzothiophenes, disilyldibenzophospholes, disilyldibenzothiophene s-oxides and disilyldibe 有权
    包含卡宾 - 过渡金属络合物发射体的有机发光二极管和至少一种选自二甲硅烷基咔唑,二甲苯基二苯并呋喃,二甲苯基二苯并噻吩,二甲苯基二苯并磷酸,二甲苯基二苯并噻吩S-氧化物和二甲苯基二

    公开(公告)号:US08373159B2

    公开(公告)日:2013-02-12

    申请号:US12667619

    申请日:2008-06-25

    IPC分类号: H01L51/00

    摘要: The present invention relates to an organic light-emitting diode comprising an anode An and a cathode Ka and a light-emitting layer E which is arranged between the anode An and the cathode Ka and comprises at least one carbene complex and if appropriate at least one further layer, where the light-emitting layer E and/or the at least one further layer comprises at least one compound selected from disilylcarbazoles, disilyldibenzofurans, disilyldibenzothiophenes, disilyldibenzophospholes, disilyldibenzothiophene S-oxides and disilyldibenzothiophene S,S-dioxides, to a light-emitting layer comprising at least one of the aforementioned compounds and at least one carbene complex, to the use of the aforementioned compounds as matrix material, hole/exciton blocker material, electron/exciton blocker material, hole injection material, electron injection material, hole conductor material and/or electron conductor material, and to a device selected from the group consisting of stationary visual display units, mobile visual display units and illumination units comprising at least one inventive organic light-emitting diode; to selected disilylcarbazoles, disilyldibenzofurans, disilyldibenzothiophenes, disilyldibenzophospholes, disilyldibenzothiophene S-oxides and disilyldibenzothiophene S,S-dioxides, and to processes for their preparation.

    摘要翻译: 本发明涉及一种包含阳极An和阴极Ka的有机发光二极管和布置在阳极An和阴极Ka之间并包含至少一个卡宾络合物的发光层E,如果合适的话,至少一个 其中发光层E和/或至少一个另外的层包含至少一种选自二甲硅烷基咔唑,二甲苯基二苯并呋喃,二甲苯基二苯并噻吩,二甲苯基二苯并磷酸,二甲苯基二苯并噻吩S-氧化物和二甲苯基二苯并噻吩S,S-二氧化物的化合物, 使用上述化合物作为基质材料,空穴/激子阻断剂材料,电子/激子阻断剂材料,空穴注入材料,电子注入材料,空穴导体,包含至少一种前述化合物和至少一种卡宾络合物的发光层 材料和/或电子导体材料,以及选自静态视觉二极管的器件 显示单元,移动视觉显示单元和包括至少一个本发明的有机发光二极管的照明单元; 选择二甲硅烷基咔唑,二甲苯基二苯并呋喃,二甲苯基二苯并噻吩,二甲苯基二苯并磷杂环,二甲苯基二苯并噻吩S-氧化物和二甲苯基二苯并噻吩S,S-二氧化物及其制备方法。

    Card connector assembly
    36.
    发明授权
    Card connector assembly 失效
    卡连接器组件

    公开(公告)号:US6132243A

    公开(公告)日:2000-10-17

    申请号:US169555

    申请日:1998-10-09

    摘要: Disclosed is a card connector comprising a double-deck shell assembly having upper and lower shell compartments for accommodating memory devices in the form of cards, and a pin connector assembly having connection pins adapted to be received in receptacles of each memory device inserted in the associated shell compartment. The pin connector assembly is adapted to be soldered directly to a printed circuit board, and the shell assembly is adapted to be assembled to the connector assembly thus fixed on the printed circuit board. Also disclosed is an assembly method for such a card connector.

    摘要翻译: 公开了一种卡连接器,其包括双层壳体组件,其具有用于容纳卡形式的存储器件的上壳体壳体和下壳体隔室,以及具有连接销的销连接器组件,该连接销适于容纳在插入相关联的每个存储器件的插座中 外壳隔间。 针连接器组件适于直接焊接到印刷电路板上,并且外壳组件适于组装到如此固定在印刷电路板上的连接器组件。 还公开了一种用于这种卡连接器的装配方法。

    Card connector with improved grounding terminal
    37.
    发明授权
    Card connector with improved grounding terminal 失效
    具有改进接地端子的卡连接器

    公开(公告)号:US6048214A

    公开(公告)日:2000-04-11

    申请号:US169814

    申请日:1998-10-09

    摘要: Disclosed is an improved card connector comprising a shell assembly and a pin connector assembly. The pin connector assembly includes an insulating housing having a plurality of signal terminals and grounding terminals mounted therein. Connection pins of the signal terminals are arranged in upper and lower rows in the insulating housing. The grounding terminals are arranged parallel to the connection pins at upper and lower levels. The upper and lower grounding terminals are electrically coupled by way of coupling contacts, and a single row of DIP-type solder tails extending from the lower grounding terminals can be soldered to selected conductors on a printed circuit board to couple both grounding terminals to the ground circuit of the circuit board.

    摘要翻译: 公开了一种改进的卡连接器,其包括壳体组件和销连接器组件。 针连接器组件包括具有安装在其中的多个信号端子和接地端子的绝缘壳体。 信号端子的连接引脚布置在绝缘壳体中的上下排中。 接地端子平行于上下两端的连接引脚。 上下接地端子通过耦合触点电耦合,并且从下接地端子延伸的单排DIP型焊尾可以焊接到印刷电路板上的选定导体,以将两个接地端子耦合到地 电路板的电路。