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公开(公告)号:US20080048692A1
公开(公告)日:2008-02-28
申请号:US11977324
申请日:2007-10-24
Applicant: K. Gleason , Tim Lesher , Eric Strid , Mike Andrews , John Martin , John Dunklee , Leonard Hayden , Amr Safwat
Inventor: K. Gleason , Tim Lesher , Eric Strid , Mike Andrews , John Martin , John Dunklee , Leonard Hayden , Amr Safwat
IPC: G01R1/067
CPC classification number: G01R1/06772 , G01R1/06711 , G01R1/06755 , G01R1/06777
Abstract: A probe measurement system for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies.
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公开(公告)号:US20080045028A1
公开(公告)日:2008-02-21
申请号:US11975244
申请日:2007-10-18
Applicant: Leonard Hayden , John Martin , Mike Andrews
Inventor: Leonard Hayden , John Martin , Mike Andrews
IPC: H01R43/00 , H01L21/302
CPC classification number: G01R1/06772 , G01R1/07342 , Y10T29/49121 , Y10T29/49147 , Y10T29/49204 , Y10T29/49208
Abstract: The present invention relates to a probe for testing of integrated circuits or other microelectronic devices.
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公开(公告)号:US20060214677A1
公开(公告)日:2006-09-28
申请号:US11442503
申请日:2006-05-25
Applicant: Leonard Hayden , Scott Rumbaugh , Mike Andrews
Inventor: Leonard Hayden , Scott Rumbaugh , Mike Andrews
IPC: G01R31/02
CPC classification number: G01R1/06766 , G01R1/06738 , G01R1/06772
Abstract: A direct current and a modulation signal are simultaneously applied to contact pads on a device under test, such as a laser diode, with a probe that reduces signal distortion and power dissipation by transmitting a modulated signal through an impedance matching resistor and transmitting of a direct current over a second signal path that avoids the impedance matching resistor.
Abstract translation: 直流电流和调制信号同时施加到被测器件(例如激光二极管)上的接触焊盘,探头通过传输调制信号通过阻抗匹配电阻器和直接传输来降低信号失真和功耗 电流超过阻抗匹配电阻的第二信号通路。
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公开(公告)号:US07046023B2
公开(公告)日:2006-05-16
申请号:US10928688
申请日:2004-08-26
Applicant: Leonard Hayden , Scott Rumbaugh , Mike Andrews
Inventor: Leonard Hayden , Scott Rumbaugh , Mike Andrews
IPC: G01R31/02
CPC classification number: G01R1/06766 , G01R1/06738 , G01R1/06772
Abstract: A direct current and a modulation signal are simultaneously applied to contact pads on a device under test, such as a laser diode. A probe and method of probing reduces signal distortion and power dissipation by transmitting a modulated signal to the device-under-test through an impedance matching resistor and transmitting of a direct current to the device-under-test over a second signal path that avoids the impedance matching resistor.
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公开(公告)号:US06806724B2
公开(公告)日:2004-10-19
申请号:US10712579
申请日:2003-11-12
Applicant: Leonard Hayden , Scott Rumbaugh , Mike Andrews
Inventor: Leonard Hayden , Scott Rumbaugh , Mike Andrews
IPC: G01R3102
CPC classification number: G01R1/06766 , G01R1/06738 , G01R1/06772
Abstract: A direct current and a modulation signal are simultaneously applied to contact pads on a wafer to test certain devices, such as a laser diode. A probe, probing system, and method of probing reduces signal distortion and power dissipation by transmitting a modulated signal to the device-under-test through an impedance matching resistor and transmitting of a direct current to the device-under-test over a signal path that avoids the impedance matching resistor.
Abstract translation: 直流电流和调制信号同时施加到晶片上的接触焊盘,以测试某些器件,例如激光二极管。 探头,探测系统和探测方法通过阻抗匹配电阻将调制信号传送到被测器件,并通过信号通道将直流电流传输到被测器件,从而降低信号失真和功耗 避免了阻抗匹配电阻。
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公开(公告)号:US07761983B2
公开(公告)日:2010-07-27
申请号:US11975244
申请日:2007-10-18
Applicant: Leonard Hayden , John Martin , Mike Andrews
Inventor: Leonard Hayden , John Martin , Mike Andrews
CPC classification number: G01R1/06772 , G01R1/07342 , Y10T29/49121 , Y10T29/49147 , Y10T29/49204 , Y10T29/49208
Abstract: The present invention relates to a method of assembling a probe for testing of integrated circuits or other microelectronic devices.
Abstract translation: 本发明涉及组装用于集成电路或其他微电子器件的测试的探针的方法。
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公开(公告)号:US07688097B2
公开(公告)日:2010-03-30
申请号:US11796237
申请日:2007-04-26
Applicant: Leonard Hayden , John Martin , Mike Andrews
Inventor: Leonard Hayden , John Martin , Mike Andrews
CPC classification number: G01R1/06772 , G01R1/07342 , Y10T29/49121 , Y10T29/49147 , Y10T29/49204 , Y10T29/49208
Abstract: The present invention relates to a probe tip assembly for testing of integrated circuits or other microelectronic devices. The probe tip assembly may include a plurality of independently flexible contact fingers extending from a support, each contact finger spaced apart from the other contact fingers, and each contact finger terminating in free space at an end distal from the support. A probe may be constructed by attaching the free ends of the contact fingers to electrical contacts on a circuit board and then removing the support from the contact fingers.
Abstract translation: 本发明涉及一种用于测试集成电路或其他微电子器件的探针头组件。 探针针尖组件可以包括从支撑件延伸的多个独立地柔性的接触指状物,每个接触指状物与其它接触指状物间隔开,并且每个接触指状物在远离支撑物的一端处于自由空间中。 可以通过将接触指的自由端附接到电路板上的电触点,然后从接触指中移除支撑件来构造探针。
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公开(公告)号:US07482823B2
公开(公告)日:2009-01-27
申请号:US11977282
申请日:2007-10-24
Applicant: K. Reed Gleason , Tim Lesher , Eric W. Strid , Mike Andrews , John Martin , John Dunklee , Leonard Hayden , Amr M. E. Safwat
Inventor: K. Reed Gleason , Tim Lesher , Eric W. Strid , Mike Andrews , John Martin , John Dunklee , Leonard Hayden , Amr M. E. Safwat
IPC: G01R31/02
CPC classification number: G01R1/06772 , G01R1/06711 , G01R1/06755 , G01R1/06777
Abstract: A probe for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies may include a dielectric substrate that supports a signal path interconnecting test instrumentation and a probe tip and a ground path that shields both the signal path and the probe tip.
Abstract translation: 用于测量高频下的集成电路或其他微电子器件的电特性的探针可以包括支持互连测试仪器的信号路径的电介质衬底以及屏蔽信号路径和探针尖端的探针尖端和接地路径。
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公开(公告)号:US07453276B2
公开(公告)日:2008-11-18
申请号:US11901626
申请日:2007-09-18
Applicant: Leonard Hayden , Scott Rumbaugh , Mike Andrews
Inventor: Leonard Hayden , Scott Rumbaugh , Mike Andrews
IPC: G01R31/02
CPC classification number: G01R1/06766 , G01R1/06738 , G01R1/06772
Abstract: A direct current and a modulation signal are simultaneously applied to contact pads on a device under test, such as a laser diode, with a probe that reduces signal distortion and power dissipation by transmitting a modulated signal through an impedance matching resistor and transmitting of a direct current over a second signal path that avoids the impedance matching resistor.
Abstract translation: 直流电流和调制信号同时施加到被测器件(例如激光二极管)上的接触焊盘,探头通过传输调制信号通过阻抗匹配电阻器和直接传输来降低信号失真和功耗 电流超过阻抗匹配电阻的第二信号通路。
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公开(公告)号:US07417446B2
公开(公告)日:2008-08-26
申请号:US11975937
申请日:2007-10-22
Applicant: Leonard Hayden , Scott Rumbaugh , Mike Andrews
Inventor: Leonard Hayden , Scott Rumbaugh , Mike Andrews
IPC: G01R31/02
CPC classification number: G01R1/06766 , G01R1/06738 , G01R1/06772
Abstract: A direct current and a modulation signal are simultaneously applied to contact pads on a device under test, such as a laser diode, with a probe that reduces signal distortion and power dissipation by transmitting a modulated signal through an impedance matching resistor and transmitting of a direct current over a second signal path that avoids the impedance matching resistor.
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