公开(公告)号：US20110167215A1

公开(公告)日：2011-07-07

申请号：US12310727

申请日：2009-02-26

申请人： Yoshiaki Eguchi ,  Masayuki Yamamoto

发明人： Yoshiaki Eguchi ,  Masayuki Yamamoto

IPC分类号： G06F12/00 ,  G06F12/02 ,  G06F12/10

CPC分类号： G06F11/2094 ,  G06F11/1076 ,  G06F2211/1028

摘要： A pool that is a storage area group composed of a plurality of real pages based on a plurality of RAID groups is managed. The storage system carries out the rebuild processing that includes the steps of copying each of data that has been stored into all allocated real pages among all real pages based on a specific RAID group to an unallocated real page based on at least one RAID group separate from the specific RAID group, allocating a real page of each copy destination to each virtual page of an allocated destination of an allocated real page of each copy source, and canceling an allocation of an allocated real page of each copy source to a virtual page.

摘要翻译： 管理作为由多个RAID组构成的多个实际页面的存储区域组的池。 存储系统执行重建处理，其包括以下步骤：基于特定RAID组将存储在所有分配的真实页面中的所有已分配的真实页面的数据复制到未分配的真实页面上的步骤，所述至少一个RAID组基于与 特定RAID组，将每个复制目的地的真实页面分配给每个复制源的分配的实际页面的分配的目的地的每个虚拟页面，以及将每个复制源的分配的真实页面的分配取消到虚拟页面。

公开(公告)号：US07938930B2

公开(公告)日：2011-05-10

申请号：US11389122

申请日：2006-03-27

申请人： Masaki Sakata ,  Masayuki Yamamoto

发明人： Masaki Sakata ,  Masayuki Yamamoto

IPC分类号： B29C63/00

CPC分类号： B29C63/0013 ,  H01L21/67132 ,  H01L21/6835 ,  H01L2221/6834 ,  H01L2221/6839 ,  Y10T29/49126 ,  Y10T156/1179 ,  Y10T156/19

摘要： An aligned workpiece is mounted on and held by a holding table, and a support board separating mechanism separates a support board from a semiconductor wafer. Herein, a double-faced adhesive tape is left on one of the support board and the semiconductor wafer. Either the support board or the semiconductor wafer on which the double-faced adhesive tape is left is transported to an adhesive tape peeling mechanism while being held by the holding table, and the double-faced adhesive tape is peeled off and removed from the surface of thereof. The separated semiconductor wafer and support board are collected independently.

摘要翻译： 对准的工件安装在保持台上并由保持台保持，并且支撑板分离机构将支撑板与半导体晶片分离。 这里，双面胶带留在支撑板和半导体晶片之一上。 将双面胶带留在其上的支撑板或半导体晶片被保持台传送到胶带剥离机构，双面胶带从表面剥离 其中。 分离的半导体晶片和支撑板被独立地收集。

公开(公告)号：US07937614B2

公开(公告)日：2011-05-03

申请号：US12687367

申请日：2010-01-14

申请人： Masayuki Yamamoto ,  Takashi Oeda

发明人： Masayuki Yamamoto ,  Takashi Oeda

IPC分类号： G06F11/00

CPC分类号： G06F3/0665 ,  G06F3/0605 ,  G06F3/067 ,  G06F11/0727 ,  G06F11/0775 ,  G06F11/0781 ,  G06F11/079 ,  H04L41/0213 ,  H04L41/046 ,  H04L41/065 ,  H04L41/08 ,  H04L41/12 ,  H04L41/22

摘要： A SAN manager acquires configuration information from devices constituting a SAN and produces a corresponding relationship between a host computer and a virtual volume (virtual volume mapping) and a corresponding relationship between the host computer and a real volume (real volume mapping). Based on those pieces of mapping information, the SAN manager outputs a corresponding relationship between virtual and real volumes. Meanwhile, the failure notification messages received from the in-SAN devices are construed to detect and output an influence of the failure upon the access to a real or virtual volume. Furthermore, when receiving a plurality of failure notifications from the devices connected to the SAN, the plurality of failure notifications are outputted with an association based on the corresponding relationship between real and virtual volumes.

摘要翻译： SAN管理器从构成SAN的设备中获取配置信息，并在主机与虚拟卷（虚拟卷映射）之间产生对应的关系以及主计算机与实际卷（实际卷映射）之间的对应关系。 基于这些映射信息，SAN管理器输出虚拟卷和实际卷之间的对应关系。 同时，从SAN设备接收的故障通知消息被解释为检测并输出故障对真实或虚拟卷的访问的影响。 此外，当从连接到SAN的设备接收到多个故障通知时，基于实际卷和虚拟卷之间的对应关系，通过关联来输出多个故障通知。

公开(公告)号：US07925830B2

公开(公告)日：2011-04-12

申请号：US12076141

申请日：2008-03-14

申请人： Ikuya Yagisawa ,  Naoto Matsunami ,  Akihiro Mannen ,  Masayuki Yamamoto

发明人： Ikuya Yagisawa ,  Naoto Matsunami ,  Akihiro Mannen ,  Masayuki Yamamoto

IPC分类号： G06F12/00

CPC分类号： G06F3/0661 ,  G06F3/0607 ,  G06F3/0616 ,  G06F3/0617 ,  G06F3/0629 ,  G06F3/0634 ,  G06F3/0647 ,  G06F3/065 ,  G06F3/0653 ,  G06F3/0658 ,  G06F3/0689 ,  G06F11/1456 ,  G06F11/2069 ,  G06F11/2071

摘要： A disk array includes a drive management unit, which is a program for identifying kinds of disk devices and managing different disk devices separately, and a drive management table for storing information to be utilized by the drive management unit. The disk array further includes a program for managing accumulated time of disk devices. The program includes a drive lifetime setting portion for setting lifetimes of drives, a drive start/stop portion for intentionally starting/stopping ATA disk devices, and an operation time measurement portion for measuring accumulated operation time. Since it is necessary to be conscious of difference in reliability and performance among disk devices when forming a RAID, a drive kind notification unit, which is a program for notifying of the kind of a disk device when forming the RAID, is provided.

摘要翻译： 磁盘阵列包括：驱动器管理单元，其是用于识别各种磁盘设备并分别管理不同磁盘设备的程序;以及驱动管理表，用于存储由驱动器管理单元利用的信息。 磁盘阵列还包括用于管理磁盘设备的累积时间的程序。 该程序包括用于设置驱动器的寿命的驱动器寿命设置部分，用于有意地启动/停止ATA盘设备的驱动器启动/停止部分和用于测量累积操作时间的操作时间测量部分。 由于在形成RAID时需要意识到磁盘装置之间的可靠性和性能的差异，所以提供作为用于在形成RAID时通知磁盘装置的种类的程序的驱动种类通知单元。

公开(公告)号：US07913735B2

公开(公告)日：2011-03-29

申请号：US12390661

申请日：2009-02-23

申请人： Masayuki Yamamoto ,  Saburo Miyamoto

发明人： Masayuki Yamamoto ,  Saburo Miyamoto

IPC分类号： B29C65/50

CPC分类号： H01L21/67132 ,  Y10T156/1168 ,  Y10T156/1195

摘要： An adhesive tape joining apparatus of this invention adopts an inverted “T”-shaped layout configured with a rectangular section that extends laterally when being viewed in a plane and a protrusion section that is coupled on a center of the rectangular section. An adhesive tape joining part is disposed in the protrusion section and joins an adhesive tape to a ring frame and a wafer. A transport mechanism is disposed in the rectangular section and transports the wafer, the ring frame, and the wafer held by the ring frame. An electronic substrate processing unit is disposed in at least one of two regions adjoining to the rectangular section with the protrusion section being interposed therebetween, and is coupled to the transport mechanism.

摘要翻译： 本发明的胶带接合装置采用倒置的“T”形布置，其配置有在平面中横向延伸的矩形截面，以及连接在矩形部分中心的突出部分。 粘合带接合部分设置在突出部分中，并将粘合带连接到环形框架和晶片。 传送机构设置在矩形部分中并传送由环形框架保持的晶片，环形框架和晶片。 电子基板处理单元设置在与矩形部分相邻的两个区域中的至少一个中，其中插入有突出部分，并且联接到输送机构。

公开(公告)号：US20110048609A1

公开(公告)日：2011-03-03

申请号：US12848290

申请日：2010-08-02

申请人： Saburo Miyamoto ,  Yukitoshi Hase ,  Masayuki Yamamoto

发明人： Saburo Miyamoto ,  Yukitoshi Hase ,  Masayuki Yamamoto

IPC分类号： B32B37/12 ,  B32B38/04

CPC分类号： B65H35/0013 ,  B65H37/002 ,  B65H2301/460186 ,  Y10T156/108 ,  Y10T156/1084 ,  Y10T156/1085 ,  Y10T156/1195

摘要： A joint detector detects a joint in an adhesive tape supplied from a tape supply section, and a computing unit determines a suitable cutting position of the adhesive tape for removing the joint in accordance with the detected results. A controller controls each mechanism to operate so as to satisfy the determined results by the computing unit. Thereafter, the adhesive tape including the joint is cut and removed.

摘要翻译： 联合检测器检测从带供应部分提供的粘合带中的接头，并且计算单元根据检测结果确定用于移除接头的胶带的适当切割位置。 控制器控制每个机构进行操作以满足计算单元确定的结果。 此后，将包括接头的胶带切割并除去。

公开(公告)号：US07875145B2

公开(公告)日：2011-01-25

申请号：US12569625

申请日：2009-09-29

申请人： Masayuki Yamamoto ,  Naoki Ishii

发明人： Masayuki Yamamoto ,  Naoki Ishii

IPC分类号： B32B37/10

CPC分类号： H01L21/67132 ,  Y10T156/1062 ,  Y10T156/1348

摘要： An adhesive tape is supplied to a back face side of a ring frame, joined to the ring frame with a joining roller, and cut by pivoting a cutter blade along the ring frame. Subsequently, an inspection ring of an inspecting mechanism perform suction on the adhesive tape while contacting the adhesive tape adjacent an inner periphery of the ring frame. Separation of the adhesive tape from the ring frame is determined based on variations of the suction pressure. When the separation of the adhesive tape from the ring frame is detected, the adhesive tape is joined again with the joining roller provided in the cutter mechanism.

摘要翻译： 将胶带提供到环形框架的背面侧，并通过连接辊连接到环形框架上，并且沿着环形框架枢转切割刀片进行切割。 随后，检查机构的检查环在与邻近环形框架的内周的粘合带接触的同时对粘合带进行抽吸。 基于吸入压力的变化来确定胶带与环形框架的分离。 当检测到胶带与环形框架的分离时，胶带再次与设置在切割机构中的接合辊接合。

公开(公告)号：US07849900B2

公开(公告)日：2010-12-14

申请号：US11358140

申请日：2006-02-22

申请人： Saburo Miyamoto ,  Yasuji Kaneshima ,  Masayuki Yamamoto

发明人： Saburo Miyamoto ,  Yasuji Kaneshima ,  Masayuki Yamamoto

IPC分类号： B29C65/18

CPC分类号： B29C63/0013 ,  H01L21/67132 ,  H01L2221/6839 ,  Y10T156/1105 ,  Y10T156/1168 ,  Y10T156/1179 ,  Y10T156/19 ,  Y10T156/1906 ,  Y10T156/1978

摘要： During relative and horizontal movement of a mount frame, in which a semiconductor wafer with a protective tape is supported on a ring frame through a supporting adhesive tape, and a joining member, a position of an end edge of the protective tape is detected in a non-contact manner. Based on the detection result, a joining member is stopped in the position of the end edge of the protective tape and is moved close to the semiconductor wafer to press and bring a separation tape against and into contact with an end of the protective tape. In this state, the mount frame and the joining member are relatively and horizontally moved to join the separation tape onto the protective tape. Then, the mount frame and the joining member are relatively and horizontally moved to separate the separation tape together with the protective tape from a surface of the semiconductor wafer.

摘要翻译： 在具有保护带的半导体晶片通过支撑胶带被支撑在环形框架上的安装框架的相对和水平移动以及接合构件中，在保护带的端部边缘的位置被检测到 非接触式 基于检测结果，接合构件停止在保护带的端缘的位置，并且移动靠近半导体晶片，以将分离带抵靠并与保护带的端部接触。 在这种状态下，安装框架和接合构件被相对且水平地移动以将分离带连接到保护带上。 然后，安装框架和接合构件被相对且水平地移动，以将分离带与保护带一起从半导体晶片的表面分离。

公开(公告)号：US07811899B2

公开(公告)日：2010-10-12

申请号：US11949593

申请日：2007-12-03

申请人： Masayuki Yamamoto ,  Yukitoshi Hase

发明人： Masayuki Yamamoto ,  Yukitoshi Hase

IPC分类号： H01L23/58 ,  H01L21/30 ,  H01L21/46 ,  B23B41/00 ,  B23B41/02

CPC分类号： H01L21/67132 ,  B32B37/003 ,  B32B37/10 ,  B32B2457/14 ,  H01L21/67092 ,  Y10T156/10

摘要： A supporting substrate is laminated on a wafer in such a manner that the supporting substrate locked in peripheral edges with a plurality of locking claws is disposed in proximity to and facing to an adhering surface of a double-sided adhesive sheet on the workpiece, the supporting substrate is pressed by a pressing member made of an approximately hemispherical elastic body from an approximate center of a non-adhering surface of this supporting substrate, the supporting substrate is laminated by elastically deforming this pressing member on the wafer while making the supporting substrate surface contact in a flat condition.

摘要翻译： 将支撑基板层叠在晶片上，使得利用多个锁定爪锁定在周边的支撑基板设置在工件上的双面粘合片的粘附表面附近并面向工件上的双面粘合片的粘合表面，支撑基板 基板被由大致半球形的弹性体制成的按压部件从该支撑基板的非粘接面的大致中心压制，支撑基板通过使该按压部件在晶片上弹性变形而层叠，同时使支撑基板表面接触 在平坦的条件。

公开(公告)号：US07669022B2

公开(公告)日：2010-02-23

申请号：US11639790

申请日：2006-12-14

申请人： Naoko Maruyama ,  Yuichi Taguchi ,  Hiroshi Nasu ,  Masayuki Yamamoto

发明人： Naoko Maruyama ,  Yuichi Taguchi ,  Hiroshi Nasu ,  Masayuki Yamamoto

IPC分类号： G06F13/00

CPC分类号： G06F11/0796 ,  G06F11/1448 ,  G06F11/1456 ,  G06F11/1464 ,  G06F11/1466 ,  G06F11/2094

摘要： A computer system for preventing data loss that includes: a first storage system having a data storage extent for storing data sent from a host computer; a second storage system having at least one actual replicated data storage extent associated with the data storage extent; an archive appliance having a storage medium associated with the replicated data storage extent in the second storage system; and a data copy unit for controlling copy processing for reading data from the data storage extent in the first storage system and writing the read data to a first actual replicated data storage extent in the second storage system in accordance with specific configuration information. The system also has a connection switching unit for changing the specific configuration information so that a second actual replicated data storage extent, instead of the first actual replicated data storage extent, is associated with the data storage extent.

摘要翻译： 一种用于防止数据丢失的计算机系统，包括：具有用于存储从主计算机发送的数据的数据存储区域的第一存储系统; 具有与数据存储范围相关联的至少一个实际复制数据存储范围的第二存储系统; 存档装置，具有与第二存储系统中的复制数据存储区域相关联的存储介质; 以及数据复制单元，用于控制从第一存储系统中的数据存储范围读取数据的复制处理，并且根据具体配置信息将读取的数据写入第二存储系统中的第一实际复制数据存储范围。 该系统还具有用于改变特定配置信息的连接切换单元，使得第二实际复制数据存储范围而不是第一实际复制数据存储范围与数据存储范围相关联。