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1.发明授权Work bonding and supporting method and work bonding and supporting apparatus using the same 失效工作粘合和支撑方法以及使用其的工作粘合和支撑装置公开(公告)号：US08281838B2
公开(公告)日：2012-10-09
申请号：US13339657
申请日：2011-12-29
IPC分类号： B32B37/00
CPC分类号： B29C63/02 , B29C63/0013 , B29L2031/3406 , H01L21/67132 , Y10T156/12 , Y10T156/1343 , Y10T156/1348
摘要： Tape heating means is allowed to come close to an adhesive tape for support and, in a heating state, the adhesive tape for support is stretched and tensioned with proper tension in a tape width direction and a transport direction. A heated work is bonded to an adhesive face of the tensioned adhesive tape for support, thereby supporting the work.
摘要翻译： 允许带状加热装置靠近用于支撑的胶带，并且在加热状态下，用于支撑的粘合带在带宽度方向和输送方向上以适当的张力拉伸和张紧。 将加热的工件粘合到用于支撑的张紧胶带的粘合面上，从而支撑工件。
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公开(公告)号：US20090272496A1
公开(公告)日：2009-11-05
申请号：US12429419
申请日：2009-04-24
IPC分类号： B32B43/00
CPC分类号： H01L21/67132 , H01L21/67092 , Y10T156/12 , Y10T156/1343
摘要： A chuck table is configured with a table main body having a wafer placement part holding a wafer placed thereon, and an annular tape support frame provided outside the wafer placement part with a cutter blade traveling groove being interposed therebetween. The tape support frame has, at a top face thereof, a plurality of linear grooves arranged in parallel in a tape joining direction, a large number of linear tape support parts each located between the linear grooves, and an annular tape support part supporting the protective tape at an outer side of the cutter blade traveling groove.
摘要翻译： 卡盘台配置有具有保持放置在其上的晶片的晶片放置部的台主体，以及设置在晶片放置部外侧的切割刀片行进槽的环状带支撑框架。 带支撑框架在其顶面处具有沿着带接合方向平行布置的多个直线槽，多个线性带支撑部分各自位于线性槽之间，并且环形带支撑部分支撑保护性 胶带在切割刀片行进槽的外侧。
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3.发明申请Method for cutting protective tape of semiconductor wafer and apparatus for cutting the protective tape 失效用于切割半导体晶片的保护带的方法和用于切割保护带的设备公开(公告)号：US20080113492A1
公开(公告)日：2008-05-15
申请号：US11979932
申请日：2007-11-09
IPC分类号： H01L21/304 , B26D5/08
CPC分类号： B26F1/3846 , H01L21/67132 , Y10T83/141 , Y10T83/162 , Y10T83/173 , Y10T83/8776
摘要： A cutter blade movably in a radial direction of a wafer is pressed for biasing to an outer circumferential edge of the semiconductor wafer. Simultaneously, the pushing biasing force of the cutter blade is controlled constant with automatic regulation corresponding to a traveling speed variation of the cutter blade, so that effect of a centrifugal force that works at the time of rotating travel of the cutter blade may not vary a pushing biasing force of the cutter blade. As a result, a contact pressure of the cutter blade to the outer circumferential edge of the semiconductor wafer is maintained stable.
摘要翻译： 在晶片的径向方向上可移动的切割刀片被按压以偏压到半导体晶片的外圆周边缘。 同时，切割刀片的推动偏置力被控制为与切割刀片的行进速度变化相对应的自动调节恒定，使得在切割刀片的旋转行进时工作的离心力的效果可以不变化 推动切割刀片的偏压力。 结果，切割刀片与半导体晶片的外周边缘的接触压力保持稳定。
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4.发明授权公开(公告)号：US08110058B2
公开(公告)日：2012-02-07
申请号：US11699414
申请日：2007-01-30
IPC分类号： B32B37/00
CPC分类号： B29C63/02 , B29C63/0013 , B29L2031/3406 , H01L21/67132 , Y10T156/12 , Y10T156/1343 , Y10T156/1348
摘要： Tape heating means is allowed to come close to an adhesive tape for support and, in a heating state, the adhesive tape for support is stretched and tensioned with proper tension in a tape width direction and a transport direction. A heated work is bonded to an adhesive face of the tensioned adhesive tape for support, thereby supporting the work.
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公开(公告)号：US07849900B2
公开(公告)日：2010-12-14
申请号：US11358140
申请日：2006-02-22
IPC分类号： B29C65/18
CPC分类号： B29C63/0013 , H01L21/67132 , H01L2221/6839 , Y10T156/1105 , Y10T156/1168 , Y10T156/1179 , Y10T156/19 , Y10T156/1906 , Y10T156/1978
摘要： During relative and horizontal movement of a mount frame, in which a semiconductor wafer with a protective tape is supported on a ring frame through a supporting adhesive tape, and a joining member, a position of an end edge of the protective tape is detected in a non-contact manner. Based on the detection result, a joining member is stopped in the position of the end edge of the protective tape and is moved close to the semiconductor wafer to press and bring a separation tape against and into contact with an end of the protective tape. In this state, the mount frame and the joining member are relatively and horizontally moved to join the separation tape onto the protective tape. Then, the mount frame and the joining member are relatively and horizontally moved to separate the separation tape together with the protective tape from a surface of the semiconductor wafer.
摘要翻译： 在具有保护带的半导体晶片通过支撑胶带被支撑在环形框架上的安装框架的相对和水平移动以及接合构件中，在保护带的端部边缘的位置被检测到 非接触式 基于检测结果，接合构件停止在保护带的端缘的位置，并且移动靠近半导体晶片，以将分离带抵靠并与保护带的端部接触。 在这种状态下，安装框架和接合构件被相对且水平地移动以将分离带连接到保护带上。 然后，安装框架和接合构件被相对且水平地移动，以将分离带与保护带一起从半导体晶片的表面分离。
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公开(公告)号：US20090095418A1
公开(公告)日：2009-04-16
申请号：US12242453
申请日：2008-09-30
IPC分类号： B29C71/04
CPC分类号： H01L21/67132 , Y10T156/1158 , Y10T156/19
摘要： The ultraviolet ray is applied on the surface of the protective tape from an ultraviolet ray generator. In addition, the ultraviolet ray having intensity higher than that from the ultraviolet ray generator is applied on spot on the wafer edge by an irradiation gun. In this case, the ultraviolet ray intensity and the rotation speed of the holding table are controlled by a controller so that the ultraviolet irradiation amount per unit area of the wafer edge portion becomes equal to that to the joining surface of the protective tape.
摘要翻译： 紫外线从紫外线发生器施加在保护带的表面上。 此外，通过照射枪在晶片边缘上点上施加强度高于紫外线发生器的紫外线。 在这种情况下，通过控制器控制保持台的紫外线强度和旋转速度，使得晶片边缘部的每单位面积的紫外线照射量与保护带的接合面相等。
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7.发明申请Work bonding and supporting method and work bonding and supporting apparatus using the same 失效工作粘合和支撑方法以及使用其的工作粘合和支撑装置公开(公告)号：US20070181245A1
公开(公告)日：2007-08-09
申请号：US11699414
申请日：2007-01-30
CPC分类号： B29C63/02 , B29C63/0013 , B29L2031/3406 , H01L21/67132 , Y10T156/12 , Y10T156/1343 , Y10T156/1348
摘要： Tape heating means is allowed to come close to an adhesive tape for support and, in a heating state, the adhesive tape for support is stretched and tensioned with proper tension in a tape width direction and a transport direction. A heated work is bonded to an adhesive face of the tensioned adhesive tape for support, thereby supporting the work.
摘要翻译： 允许带状加热装置靠近用于支撑的胶带，并且在加热状态下，用于支撑的粘合带在带宽度方向和输送方向上以适当的张力拉伸和张紧。 将加热的工件粘合到用于支撑的张紧胶带的粘合面上，从而支撑工件。
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8.发明申请WORK BONDING AND SUPPORTING METHOD AND WORK BONDING AND SUPPORTING APPARATUS USING THE SAME 失效使用相同的工作联结和支持方法和工作联结和支持设备公开(公告)号：US20120097338A1
公开(公告)日：2012-04-26
申请号：US13339657
申请日：2011-12-29
IPC分类号： B32B38/10
CPC分类号： B29C63/02 , B29C63/0013 , B29L2031/3406 , H01L21/67132 , Y10T156/12 , Y10T156/1343 , Y10T156/1348
摘要： Tape heating means is allowed to come close to an adhesive tape for support and, in a heating state, the adhesive tape for support is stretched and tensioned with proper tension in a tape width direction and a transport direction. A heated work is bonded to an adhesive face of the tensioned adhesive tape for support, thereby supporting the work.
摘要翻译： 允许带状加热装置靠近用于支撑的胶带，并且在加热状态下，用于支撑的粘合带在带宽度方向和输送方向上以适当的张力拉伸和张紧。 将加热的工件粘合到用于支撑的张紧胶带的粘合面上，从而支撑工件。
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9.发明申请METHOD FOR CUTTING PROTECTIVE TAPE OF SEMICONDUCTOR WAFER AND PROTECTIVE TAPE CUTTING DEVICE 有权切割半导体波形保护带和保护带切割装置的方法公开(公告)号：US20090133551A1
公开(公告)日：2009-05-28
申请号：US12272586
申请日：2008-11-17
CPC分类号： H01L21/67132 , H01L21/67092 , Y10S83/922 , Y10T83/05 , Y10T83/0524 , Y10T83/0586 , Y10T83/141 , Y10T83/148 , Y10T83/541 , Y10T156/1348
摘要： A cutter blade is cut-in by being moved towards a deep part of a notch from one open end of the notch while being moved in a forward direction with respect to an outer periphery of a wafer. Immediately before a blade edge reaches the deep part of the notch, cutting movement of the cutter blade is once stopped, reversely moved to a initial piercing position, and thereafter, the cutter blade is moved towards the deep part of the notch from the other open end of the notch while being moved in a reverse direction with respect to the outer periphery of the wafer.
摘要翻译： 切割刀片通过相对于晶片的外周沿向前方向移动而从切口的一个开口端向凹槽的深部移动而被切入。 在叶片边缘到达切口的深部之前，切割刀片的切割运动一旦停止，反向移动到初始穿刺位置，然后切割刀片从另一个开口移动到切口的深部 在相对于晶片的外周沿相反方向移动的同时切口的端部。
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10.发明申请Method for cutting protective tape of semiconductor wafer and apparatus for cutting the protective tape 失效用于切割半导体晶片的保护带的方法和用于切割保护带的设备公开(公告)号：US20080184855A1
公开(公告)日：2008-08-07
申请号：US11979931
申请日：2007-11-09
IPC分类号： B26D7/14
CPC分类号： B26D7/14 , B26D7/018 , B26F1/3846 , H01L21/67132 , Y10T83/0467 , Y10T83/207 , Y10T83/323 , Y10T83/364 , Y10T156/12 , Y10T156/1343 , Y10T156/1348 , Y10T156/1352 , Y10T156/1357 , Y10T156/1361
摘要： An outer edge of a protective tape projected from a semiconductor wafer is fixed and held by a tape holding section. In the condition, a part of the projected protective tape is caught and supported with a tape supporting section with a face having lower adhesive property provided in the outside of the traveling groove for the cutter. Furthermore, the part of the protective tape having the outer edge fixed and held with the tape holding section is compulsorily deformed and inserted into a depression provided between the tape holding section and the tape supporting section. Thereby, the part of the protective tape located in a traveling groove for the cutter is tensioned outward. A cutter blade is stuck into this tensioned part, and cuts the protective tape all over the peripheries of the wafer
摘要翻译： 从半导体晶片突出的保护带的外边缘由带保持部固定并保持。 在这种情况下，投影的保护带的一部分被带状支撑部分抓住并支撑，该带支撑部分具有设置在用于切割器的移动槽的外侧的具有较低粘合性质的面。 此外，具有固定并保持在带保持部分的外边缘的保护带的部分被强制变形并插入设置在带保持部分和带支撑部分之间的凹陷中。 因此，位于用于切割器的移动槽中的保护带的部分向外张开。 切割刀片被卡在该张紧部分中，并将保护带切割在晶片的周边
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