Process for generating a hard mask for the patterning of a layer
    32.
    发明授权
    Process for generating a hard mask for the patterning of a layer 有权
    用于产生用于层的图案化的硬掩模的工艺

    公开(公告)号:US07223525B2

    公开(公告)日:2007-05-29

    申请号:US10970483

    申请日:2004-10-21

    申请人: Matthias Lipinski

    发明人: Matthias Lipinski

    CPC分类号: H01L21/0332 H01L21/31144

    摘要: A process for generating a hard mask for the patterning of a first layer includes applying a second layer, which includes carbon, to the first layer that is to be patterned. A third layer, which includes silicon and carbon, is spun onto the second layer and an organic antireflection coating layer that is to be used with an overlying photoresist layer patternable using 193 nm technology, is appllied to the spun-on third layer.

    摘要翻译: 用于产生用于第一层的图案化的硬掩模的工艺包括将第二层(包括碳)施加到待图案化的第一层。 包括硅和碳的第三层被旋涂到第二层上,并且与使用193nm技术可图案化的上覆光致抗蚀剂层一起使用的有机抗反射涂层被应用于纺丝第三层。

    Process for generating a hard mask for the patterning of a layer, and hard mask for the patterning of a layer
    33.
    发明申请
    Process for generating a hard mask for the patterning of a layer, and hard mask for the patterning of a layer 有权
    用于生成用于层的图案化的硬掩模的工艺,以及用于层的图案化的硬掩模

    公开(公告)号:US20050106478A1

    公开(公告)日:2005-05-19

    申请号:US10970483

    申请日:2004-10-21

    申请人: Matthias Lipinski

    发明人: Matthias Lipinski

    CPC分类号: H01L21/0332 H01L21/31144

    摘要: A process for generating a hard mask for the patterning of a first layer includes applying a second layer, which includes carbon, to the first layer that is to be patterned. A third layer, which includes silicon and carbon, is spun onto the second layer and an organic antireflection coating layer is applied to the spun-on third layer.

    摘要翻译: 用于产生用于第一层的图案化的硬掩模的工艺包括将第二层(包括碳)施加到待图案化的第一层。 包括硅和碳的第三层被旋转到第二层上,并且将有机抗反射涂层施加到纺丝的第三层上。

    Tungsten hard mask
    36.
    发明授权
    Tungsten hard mask 失效
    钨硬面罩

    公开(公告)号:US06815364B2

    公开(公告)日:2004-11-09

    申请号:US09967795

    申请日:2001-09-28

    IPC分类号: H01L21302

    摘要: Disclosed is a method of tungsten-based hard mask etching of a wafer, comprising providing a patterned tungsten-based hard mask atop a metal-based surface of said wafer, etching through said pattern with a plasma etch that is selective for said metal-based surface with respect to tungsten, and executing a flash etch selective for tungsten, said etch of at least a minimum duration effective in removing substantially all defects caused by tungsten particulate contaminating said wafer. In another aspect of the first embodiment, said tungsten-based hard mask comprises a material selected from tungsten or an alloy thereof. In another aspect of the first embodiment, said metal based surface comprises a material selected from aluminum or an alloy thereof.

    摘要翻译: 公开了一种对晶片进行钨基硬掩模蚀刻的方法,包括在所述晶片的基于金属的表面顶部提供图案化的钨基硬掩模,通过所述图案蚀刻,所述等离子体刻蚀对所述金属基有选择性 相对于钨的表面,以及执行对钨的选择性的闪光蚀刻,所述蚀刻至少有效地消除由污染所述晶片的钨颗粒引起的所有缺陷的至少最小持续时间。 在第一实施例的另一方面,所述钨基硬掩模包括选自钨或其合金的材料。 在第一实施例的另一方面,所述金属基表面包括选自铝或其合金的材料。