公开(公告)号：US20170222094A1

公开(公告)日：2017-08-03

申请号：US15502188

申请日：2015-08-04

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Luca Haiberger ,  Matthias Sperl

IPC: H01L33/48 ,  H01L33/54 ,  H01L33/62 ,  H01L33/00

CPC classification number: H01L33/486 ,  H01L21/568 ,  H01L24/96 ,  H01L33/0095 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/04105 ,  H01L2224/18 ,  H01L2224/19 ,  H01L2224/24 ,  H01L2224/82 ,  H01L2924/1301 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/1815 ,  H01L2933/0033

Abstract: An electronic component, an optoelectronic component, a component arrangement, and a method for producing an electronic component are disclosed. In an embodiment, the method includes forming a sacrificial structure on a top side of a carrier by a photolithographic process from a photoresist layer, arranging an electronic semiconductor chip on the carrier after exposing the photoresist layer, molding a molded body around the sacrificial structure and around the electronic semiconductor chip such that a surface of the electronic semiconductor chip is at least partly not covered by the molded body, detaching the molded body from the carrier and removing the sacrificial structure, wherein removing the sacrificial structure results in a cutout being formed in the molded body.