MODULAR LIQUID COOLING FOR MULTI-NODE COMPUTING SYSTEMS

    公开(公告)号:US20240389276A1

    公开(公告)日:2024-11-21

    申请号:US18350173

    申请日:2023-07-11

    Abstract: A computing system includes a chassis, a water circulation network coupled to the chassis, a power distribution network coupled to the chassis, and one or more sleds removably coupled to the chassis. The water circulation network includes a cold water distribution network and a hot water collection network. Each sled of the one or more sleds includes a corresponding cold plate. Each sled is configured to slide along the chassis in two slide directions including a slide-close direction to reach a closed position and a slide-open direction to vacate the closed position. When in the closed position, each sled is configured to (a) bridge the hot water collection network and the cold water distribution network via the corresponding cold plate and (b) couple to the power distribution network.

    MOUNTING SYSTEM FOR AN ELECTRONIC DEVICE
    32.
    发明公开

    公开(公告)号:US20240192739A1

    公开(公告)日:2024-06-13

    申请号:US18117099

    申请日:2023-03-03

    CPC classification number: G06F1/185

    Abstract: A mounting system for an electronic device is disclosed. The mounting system includes a mounting plate; a plurality of fasteners for coupling the mounting plate with the electronic device; a single main gear mounted on the mounting plate; a plurality of secondary gears coupled, respectively, to the plurality of fasteners; and a plurality of intermediate gears mounted on the mounting plate and rotationally coupled between the single main gear and the plurality of secondary gears. Rotation of each of the plurality of secondary gears causes a fastening movement of a respective one of the plurality of fasteners. Simultaneous rotation of the plurality of intermediate gears causes the plurality of secondary gears to rotate simultaneously in response to a single rotational force being received by the main gear. The simultaneous rotation of the plurality of intermediate gears causes a simultaneous fastening movement of the plurality of secondary gears.

    Force Convection Driven By Propeller Applied In Single-Phase Immersion Cooling

    公开(公告)号:US20240164054A1

    公开(公告)日:2024-05-16

    申请号:US18154791

    申请日:2023-01-13

    Abstract: A single-phase immersion cooling system includes an immersion cooling tank having a component area, which is separate from a main chamber and is configured to receive a heat-generating electronic device. A coolant circulates along a flow path, in a chamber path through the main chamber and a component path through the component area. A rotating propeller is mounted within the immersion cooling tank, causing a driven flow path in the component area. The driven flow path is configured to cause contact between the coolant in the driven flow path and the heat-generating electronic device when the heat-generating electronic device is received within the component area. The coolant in the driven flow path circulates at a faster speed than the coolant in the chamber path.

    MULTI-STAGE LIQUID COOLING SYSTEM
    35.
    发明公开

    公开(公告)号:US20240057284A1

    公开(公告)日:2024-02-15

    申请号:US18055650

    申请日:2022-11-15

    Abstract: A system for cooling a heat-generating electronic component includes a first stage, a second stage, and a heat exchanger. The first stage has a first cooling path that circulates a first cooling fluid past the heat-generating electronic component to cause the first cooling fluid to absorb heat from the heat-generating electronic component and the temperature of the first cooling fluid to increase. The second stage circulates a second cooling fluid to increase a pressure of the second cooling fluid, remove heat from the second cooling fluid to decrease a temperature of the second cooling fluid, and decrease the pressure of the second cooling fluid to further decrease the temperature of the second cooling fluid. The heat exchanger is fluidly connected to the first stage and the second stage, and causes the second cooling fluid to flow past and absorb heat from the first cooling fluid.

    Eccentric Heat Dissipation For Fin Cold Plate

    公开(公告)号:US20230262926A1

    公开(公告)日:2023-08-17

    申请号:US17660631

    申请日:2022-04-25

    CPC classification number: H05K7/20263 H05K7/20254 H05K7/20772

    Abstract: A cooling system for a heat-generating electronic device includes a cold plate module, a flow channel, and a fin arrangement. The cold plate module includes a base plate and a top cover. The flow channel is for a liquid coolant and extends between an inlet connector and an outlet connector. The liquid coolant flows along a flow direction. The fin arrangement is located between the base plate and the top cover. The fin arrangement is thermally coupled to the flow channel and is eccentrically located relative to the cold plate module.

    SHOCK-ABSORBING PALLETS FOR TRANSPORTING SERVERS

    公开(公告)号:US20230182956A1

    公开(公告)日:2023-06-15

    申请号:US17550574

    申请日:2021-12-14

    Abstract: Embodiments of the disclosure are directed to a transportation system for carrying servers. The transportation system includes a server rack and a shock-absorbing pallet. The shock-absorbing pallet is secured under the server rack and configured to move relative to the server rack to dampen vibration during transportation of the server rack. The shock-absorbing pallet includes a top cover, a bottom cover, one or more isolation devices, and one or supporting layers. The one or more isolation devices are disposed between the top cover and the bottom cover. Each isolation device includes a shock-absorbing component coupled to the top cover and the bottom cover. The one or more supporting layers are secured between the top cover and the bottom cover around the one or more isolation devices. The one or more supporting layers have a plurality of slots for guiding a pallet lifter therethrough.

    TIERED IMMERSION COOLING SYSTEM
    38.
    发明申请

    公开(公告)号:US20230052701A1

    公开(公告)日:2023-02-16

    申请号:US17451692

    申请日:2021-10-21

    Abstract: A tiered immersion cooling system includes a chassis, a cabinet frame slidably mounted to the chassis, an upper immersion tank, and a lower immersion tank. The cabinet frame is slidable between a first internal position and a first external position. Sliding motion of the cabinet frame is in a horizontal direction along a depth of the chassis. The upper immersion tank is slidably mounted to the chassis. The upper immersion tank is slidable with the cabinet frame in the horizontal direction. The upper immersion tank slides relative to the cabinet frame, in a vertical direction along a height of the chassis. The lower immersion tank is positioned below the upper immersion tank in the vertical direction. The lower immersion tank is mounted to slide independently from the cabinet frame, in the horizontal direction. The lower immersion tank slides between a second internal and a second external position.

    NETWORK DEVICE INCLUDING LAYERED FIBER OPTIC CABLING

    公开(公告)号:US20220196954A1

    公开(公告)日:2022-06-23

    申请号:US17203513

    申请日:2021-03-16

    Abstract: A network device comprising a chassis, a plurality of fiber optic adapters, a plurality of arrangements of interior fiber optic cables, and a plurality of stacked cable management trays. The chassis includes a front panel with a plurality of front fiber optic adapter openings. The chassis defines an interior space. The plurality of front fiber optic adapters is disposed in the front fiber optic adapter openings. The plurality of arrangements of interior fiber optic cables is disposed within the interior space. A first end of each interior fiber optic cable is directly connected to a corresponding one of the plurality of front fiber optic adapters. The plurality of stacked cable management trays each support one of the plurality of arrangements of interior fiber optic cables. The plurality of stacked cable management trays is configured to route a second end of each interior fiber optic cable to a corresponding side fiber optic adapter.

    CONNECTOR WITH A SLOT FOR A SMALL CIRCUIT BOARD

    公开(公告)号:US20210384660A1

    公开(公告)日:2021-12-09

    申请号:US16998752

    申请日:2020-08-20

    Abstract: A connector consisting of a body, a first slot, a second slot, a first terminal, and a second terminal is disclosed. The first slot is provided on the body to receive a first printed circuit board (PCB). The second slot is provided on the body to receive a second PCB. The first slot and the second slot are separate and distinct slots. When the first PCB and the second PCB are received in the first slot and the second slot, respectively, the first terminal electrically connects the first PCB and the second PCB, and the second terminal connects to only the second PCB. Providing the first slot on the connector allows adding expansion cards, control cards, and the like to enhance functionality of computing systems.

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