公开(公告)号：US20190150296A1

公开(公告)日：2019-05-16

申请号：US15988296

申请日：2018-05-24

Applicant: RAYTHEON COMPANY

Inventor： Andrew R. Southworth ,  Thomas V. Sikina ,  John P. Haven ,  James E. Benedict ,  Kevin Wilder

IPC: H05K3/34 ,  H05K1/02

Abstract: Electromagnetic circuit structures and methods are provided for a circuit board that includes a hole disposed through a substrate to provide access to an electrical component, such as a signal trace line (or stripline), that is at least partially encapsulated (e.g., sandwiched) between substrates. The electrical component includes a portion substantially aligned with the hole, and an electrical conductor is disposed within the hole. The electrical conductor is soldered to the portion of the electrical component.