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31.发明授权公开(公告)号：US11688561B2
公开(公告)日：2023-06-27
申请号：US17325357
申请日：2021-05-20
发明人： Young Heon Lee , Beom Joon Cho , Gyeong Ju Song
CPC分类号： H01G4/30 , H01G2/065 , H01G4/012 , H01G4/1209 , H01G4/228
摘要： An electronic component includes: a capacitor body; a pair of external electrodes disposed on opposite end surfaces of the capacitor body, respectively; and a pair of metal frames respectively including a pair of connected portions connected to the pair of external electrodes, respectively, and a pair of mounted portions bent at and extending from one ends of the pair of connected portions, respectively, wherein corners of end portions of the pair of mounted portions facing each other have a curved surface.
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公开(公告)号：US20230154677A1
公开(公告)日：2023-05-18
申请号：US18098280
申请日：2023-01-18
发明人： Sang Yeop Kim , Beom Joon Cho , Gyeong Ju Song
CPC分类号： H01G2/06 , H01G4/2325 , H01G4/30
摘要： An electronic component includes a multilayer capacitor including a body and an external electrode disposed externally on the body; a metal frame coupled to the multilayer capacitor; and an adhesive layer disposed between the external electrode and the metal frame and including a solder layer and a conductive resin layer.
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公开(公告)号：US11640876B2
公开(公告)日：2023-05-02
申请号：US17244264
申请日：2021-04-29
发明人： Beom Joon Cho , Min Kyeong Sim
摘要： An electronic component includes at least one first multilayer capacitor and at least one second multilayer capacitor alternatively laminated in a first direction perpendicular to one surface of the first multilayer capacitor, such that an external electrode of the first multilayer capacitor is connected to an external electrode of the second multilayer capacitor. In the first multilayer capacitor, a plurality of internal electrodes are laminated in a first direction, and in the second multilayer capacitor, a plurality of internal electrodes are laminated in a second direction perpendicular to the first direction.
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公开(公告)号：US11355288B2
公开(公告)日：2022-06-07
申请号：US16914942
申请日：2020-06-29
发明人： Ki Young Kim , Jae Young Na , Beom Joon Cho , Ji Hong Jo , Woo Chul Shin
摘要： An electronic component is provided, and the electronic component includes: a capacitor array in which a plurality of multilayer capacitors are stacked, the plurality of multilayer capacitors including a body, and first and second external electrodes; first and second metal frames including first and second support portions bonded to the first and second external electrodes of the capacitor array, first and second mounting portions located below the first and second external electrodes and having first and second protrusions protruding downwardly, and first and second connection portions connecting the first and second support portions to the first and second mounting portions, respectively; and a capsule portion encapsulating the capacitor array to expose the first mounting portion of the first metal frame and the second mounting portion of the second metal frame, and having a lower surface provided with a plurality of protruding portions are formed at predetermined intervals.
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公开(公告)号：US20220130614A1
公开(公告)日：2022-04-28
申请号：US17333817
申请日：2021-05-28
发明人： Gyeong Ju Song , Beom Joon Cho , Seung Min Ahn
摘要： There are provided an electronic component and a board including the same. The electronic component includes: a capacitor body; a pair of external electrodes respectively disposed on both ends of the capacitor body; and a pair of metal frames including a pair of connection portions connected to the pair of external electrodes, respectively, and a pair of mounting portions connected to the pair of connection portions, respectively. A bottom surface of one of the pair of mounting portions has roughness.
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公开(公告)号：US11004613B2
公开(公告)日：2021-05-11
申请号：US16190919
申请日：2018-11-14
发明人： Beom Joon Cho
摘要： An electronic component includes: a capacitor array including a plurality of multilayer capacitors consecutively disposed in a horizontal direction, first and second metal frames disposed on both side surfaces of the capacitor array and connected to first and second external electrodes, respectively. The first and second metal frames respectively include first and second horizontal bonding portions bonded to upper portions of first and second band portions, first and second horizontal mounting portions disposed to oppose the first and second horizontal bonding portions in a vertical direction, and first and second vertical portions connecting the first and second horizontal bonding portions and the first and second horizontal mounting portions and having at least one first and second cutout portions in a horizontal direction, respectively. The first and second horizontal mounting portions are spaced apart from the plurality of multilayer capacitors.
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公开(公告)号：US10971304B2
公开(公告)日：2021-04-06
申请号：US16170682
申请日：2018-10-25
发明人： Beom Joon Cho , Sang Soo Park , Jae Young Na , Woo Chui Shin
摘要： An electronic component includes a body; external electrodes respectively disposed on opposing surfaces of the body in a first direction thereof; and a pair of metal frames connected to the external electrodes, respectively, in which each of the metal frames includes a support portion bonded to the external electrodes, and a mounting portion extending in the first direction from a lower end of the support portion and spaced apart from the body and the external electrodes, and a length of the mounting portion in a second direction perpendicular to the first direction is greater than a length of the body in the second direction.
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公开(公告)号：US10861648B2
公开(公告)日：2020-12-08
申请号：US16698200
申请日：2019-11-27
发明人： Beom Joon Cho , Sang Soo Park , Ki Young Kim , Woo Chul Shin
摘要： An electronic component includes: a capacitor array including a plurality of multilayer capacitors which are sequentially arranged in a first direction, and first and second metal frames disposed on both side surfaces of the capacitor array and connected to first and second external electrodes of the plurality of multilayer capacitors, respectively; the first and second metal frames include first and second support portions, and first and second mounting portions, respectively; and the first and second mounting portions include first and second portions opposing each other toward the center of the capacitor array, and third and fourth portions positioned outside the first and second portions, respectively, and a length of each of the first and second portions is shorter than a length of each of the third and fourth portions.
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公开(公告)号：US10770236B2
公开(公告)日：2020-09-08
申请号：US16201607
申请日：2018-11-27
发明人： Ki Young Kim , Beom Joon Cho , Sang Soo Park , Woo Chul Shin
摘要： A multilayer ceramic electronic component array includes: a plurality of multilayer ceramic electronic components; a first terminal structure electrically connected to first external electrodes of each of the plurality of multilayer ceramic electronic components; a second terminal structure electrically connected to second external electrodes of each of the plurality of multilayer ceramic electronic components; a first conductive bonding member bonding the first external electrodes of each of the plurality of multilayer ceramic electronic components and the first terminal structure; a second conductive bonding member bonding the second external electrodes of each of the plurality of multilayer ceramic electronic components and the second terminal structure; and a ceramic bonding member contacting first surfaces of each of the ceramic bodies of each of the plurality of multilayer ceramic electronic components and disposed to extend to second surfaces of each of the ceramic bodies.
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公开(公告)号：US20200161056A1
公开(公告)日：2020-05-21
申请号：US16272752
申请日：2019-02-11
发明人： Ki Young Kim , Woo Chul Shin , Beom Joon Cho , Sang Soo Park
摘要： An electronic component includes a capacitor array having a plurality of multilayer capacitors consecutively arranged in a first direction, the plurality of multilayer capacitors each comprising a body, and first and second external electrodes respectively comprising first and second head portions, and first and second band portions respectively extending from the first and second head portions to portions of upper and lower surfaces and portions of side surfaces of the body, a first metal frame coupled to the plurality of first band portions by binding the first band portions in belt form so as to be connected to the plurality of first external electrodes, and a second metal frame coupled to the plurality of second band portions by binding the second band portions in belt form so as to be connected to the plurality of second external electrodes.
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