公开(公告)号：US20140167237A1

公开(公告)日：2014-06-19

申请号：US13950205

申请日：2013-07-24

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Do Jae Yoo ,  Tae Hyun Kim ,  Kwang Soo Kim ,  Joon Seok Chae

IPC: H01L23/495 ,  H01L23/48

CPC classification number: H01L24/73 ,  H01L23/053 ,  H01L23/24 ,  H01L23/3735 ,  H01L23/49811 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/73265 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Disclosed herein is a power module package, including: a substrate; semiconductor chips mounted on one surface of the substrate; external connection terminals connected to one surface of the substrate; and a connecting member having one end contacting the semiconductor chips and the other end contacting the external connection terminals and electrically and mechanically connecting between the semiconductor chips and the external connection terminals.

Abstract translation: 本文公开了一种功率模块封装，包括：基板; 安装在基板的一个表面上的半导体芯片; 连接到基板的一个表面的外部连接端子; 以及连接构件，其一端接触半导体芯片，另一端接触外部连接端子，并且在半导体芯片和外部连接端子之间电气和机械连接。

公开(公告)号：US20140003013A1

公开(公告)日：2014-01-02

申请号：US13846626

申请日：2013-03-18

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Do Jae Yoo ,  Sun Woo Yun ,  Joon Seok Chae ,  Kwang Soo Kim

IPC: H01L23/00 ,  H05K1/18

CPC classification number: H01L24/80 ,  H01L23/24 ,  H01L23/3735 ,  H01L23/42 ,  H01L23/49811 ,  H01L23/49861 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/072 ,  H01L2224/29101 ,  H01L2224/2929 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/12042 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15787 ,  H01L2924/16151 ,  H01L2924/181 ,  H05K1/181 ,  H05K3/4015 ,  H05K2201/10295 ,  H05K2201/10393 ,  H05K2201/10962 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/14 ,  H01L2924/0665

Abstract: Disclosed herein is a power module package including an external connection terminal; a substrate in which a fastening unit allowing one end of the external connection terminal to be insertedly fastened thereinto is buried at a predetermined depth in a thickness direction; and a semiconductor chip mounted on one surface of the substrate.

Abstract translation: 这里公开了一种功率模块封装，其包括外部连接端子; 将允许外部连接端子的一端插入其中的紧固单元埋设在厚度方向上的预定深度的基板; 以及安装在基板的一个表面上的半导体芯片。