公开(公告)号：US10163746B2

公开(公告)日：2018-12-25

申请号：US15003473

申请日：2016-01-21

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Jong In Ryu ,  Ki Joo Sim ,  Do Jae Yoo ,  Ki Ju Lee ,  Jin Su Kim

IPC: H01L23/31 ,  H01L23/29 ,  H01L21/56 ,  H01L21/768 ,  H01L23/538 ,  H01L21/268 ,  H01L23/16 ,  H01L23/00 ,  H01L21/48

Abstract: A semiconductor package and manufacturing method thereof includes a chip member installed on an upper surface, a lower surface, or both of a substrate. The semiconductor package and manufacturing method thereof also include a mold part stacked embedding the chip member, a connection member disposed at a center portion of the mold part, and a solder part formed on a portion of the connection member.

公开(公告)号：US09585260B2

公开(公告)日：2017-02-28

申请号：US14260007

申请日：2014-04-23

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jae Hyun Lim ,  Jong In Ryu ,  Sun Ho Kim ,  Eun Jung Jo ,  Kyu Hwan Oh ,  Do Jae Yoo

IPC: H05K1/11 ,  H05K3/34 ,  H05K3/28 ,  H05K3/40 ,  H01L23/00 ,  H05K3/00 ,  H05K3/32

CPC classification number: H05K3/3478 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19106 ,  H05K1/111 ,  H05K1/115 ,  H05K3/0052 ,  H05K3/284 ,  H05K3/321 ,  H05K3/4015 ,  H05K2201/09409 ,  H05K2201/09436 ,  H05K2201/10318 ,  H05K2201/10424 ,  H05K2201/10787 ,  H05K2203/0228 ,  H05K2203/1316 ,  H01L2924/00012

Abstract: There are provided an electronic component module capable of increasing a degree of integration by mounting electronic components on both surfaces of a substrate, and a manufacturing method thereof. The electronic component module according to an exemplary embodiment of the present disclosure includes: a substrate; a plurality of electronic components mounted on both surfaces of the substrate; connection conductors each having one end bonded to one surface of the substrate using an conductive adhesive; and a molded portion having the connection conductor embedded therein and formed on one surface of the substrate, wherein the connection conductor may have at least one blocking member preventing a spread of the conductive adhesive.

Abstract translation: 提供一种能够通过将电子部件安装在基板的两个表面上而提高集成度的电子部件模块及其制造方法。 根据本公开的示例性实施例的电子部件模块包括：基板; 安装在所述基板的两个表面上的多个电子部件; 连接导体各自具有使用导电粘合剂结合到基板的一个表面的一端; 以及模制部分，其具有嵌入其中并且形成在基板的一个表面上的连接导体，其中连接导体可以具有防止导电粘合剂扩散的至少一个阻挡构件。

公开(公告)号：US09496219B2

公开(公告)日：2016-11-15

申请号：US13935148

申请日：2013-07-03

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Do Jae Yoo ,  Jung Ho Yoon ,  Chul Gyun Park ,  Myeong Woo Han ,  Jung Aun Lee

IPC: H01L23/02 ,  H01L23/12 ,  H01L23/48 ,  H01L23/52 ,  H01L23/40 ,  H01L23/522 ,  H01L23/498 ,  H01L21/56 ,  H01L23/538 ,  H01L23/66 ,  H01L23/00 ,  H01L21/00 ,  H05K1/18 ,  H01L25/065 ,  H01L25/16

CPC classification number: H01L23/66 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/56 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/78 ,  H01L23/3142 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5226 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/73 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/16 ,  H01L2223/6616 ,  H01L2223/6677 ,  H01L2223/6683 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01029 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/3011 ,  H05K1/185 ,  H05K2203/061 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A semiconductor package including an antenna formed integrally therewith. The semiconductor package includes: a semiconductor chip; a sealing part sealing the semiconductor chip; a substrate part formed on at least one surface of the sealing part; and an antenna part formed on the sealing part and electrically connected to the semiconductor chip.

Abstract translation: 一种半导体封装，包括与其一体形成的天线。 半导体封装包括：半导体芯片; 密封半导体芯片的密封部分; 形成在所述密封部的至少一个表面上的基板部; 以及形成在所述密封部上并与半导体芯片电连接的天线部。

公开(公告)号：US09202798B2

公开(公告)日：2015-12-01

申请号：US13846626

申请日：2013-03-18

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Do Jae Yoo ,  Sun Woo Yun ,  Joon Seok Chae ,  Kwang Soo Kim

IPC: H01L23/00 ,  H05K1/18 ,  H05K3/40 ,  H01L25/07 ,  H01L23/373 ,  H01L23/42 ,  H01L23/498 ,  H01L23/24

CPC classification number: H01L24/80 ,  H01L23/24 ,  H01L23/3735 ,  H01L23/42 ,  H01L23/49811 ,  H01L23/49861 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/072 ,  H01L2224/29101 ,  H01L2224/2929 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/12042 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15787 ,  H01L2924/16151 ,  H01L2924/181 ,  H05K1/181 ,  H05K3/4015 ,  H05K2201/10295 ,  H05K2201/10393 ,  H05K2201/10962 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/14 ,  H01L2924/0665

Abstract: Disclosed herein is a power module package including an external connection terminal; a substrate in which a fastening unit allowing one end of the external connection terminal to be insertedly fastened thereinto is buried at a predetermined depth in a thickness direction; and a semiconductor chip mounted on one surface of the substrate.

Abstract translation: 这里公开了一种功率模块封装，其包括外部连接端子; 将允许外部连接端子的一端插入其中的紧固单元埋设在厚度方向上的预定深度的基板; 以及安装在所述基板的一个表面上的半导体芯片。

公开(公告)号：US09105601B2

公开(公告)日：2015-08-11

申请号：US14106107

申请日：2013-12-13

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Tae Hyun Kim ,  Do Jae Yoo ,  Bum Seok Suh

IPC: H01L23/40 ,  H01L23/492 ,  H01L23/64 ,  H01L23/373 ,  H01L23/433 ,  H01L23/495 ,  H01L23/498 ,  H01L23/053 ,  H01L23/31

CPC classification number: H01L23/3735 ,  H01L23/053 ,  H01L23/3121 ,  H01L23/4334 ,  H01L23/49531 ,  H01L23/49575 ,  H01L23/49811 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: Disclosed herein is a power module package including: a substrate including a metal layer, a first insulation layer formed on the metal layer, a first circuit pattern formed on the first insulation layer and including a first pad and a second pad spaced apart from the first pad, a second insulation layer formed on the first insulation layer to cover the first circuit pattern, and a second circuit pattern formed on the second insulation layer and including a third pad formed on a location corresponding to the first pad and a fourth pad spaced apart from the third pad; a semiconductor chip mounted on the second circuit pattern; one end being electrically connected to the semiconductor chip, and another end protruding from the outside, wherein the first pad and the third pad, and the second pad and the fourth pad have different polarities.

Abstract translation: 本文公开了一种功率模块封装，包括：基板，包括金属层，形成在金属层上的第一绝缘层，形成在第一绝缘层上的第一电路图案，并且包括第一焊盘和与第一绝缘层间隔开的第二焊盘 衬垫，形成在第一绝缘层上以覆盖第一电路图案的第二绝缘层和形成在第二绝缘层上的第二电路图案，并且包括形成在与第一焊盘相对应的位置上的第三焊盘和间隔开的第四焊盘 从第三垫; 安装在第二电路图案上的半导体芯片; 一端电连接到半导体芯片，另一端从外部突出，其中第一焊盘和第三焊盘以及第二焊盘和第四焊盘具有不同的极性。

公开(公告)号：USD708578S1

公开(公告)日：2014-07-08

申请号：US29456642

申请日：2013-05-31

Applicant: Samsung Electro-Mechanics Co., Ltd.

Designer： Do Jae Yoo ,  Sun Ho Kim ,  Kwang Soo Kim ,  Bum Seok Suh

公开(公告)号：US09748179B2

公开(公告)日：2017-08-29

申请号：US14810947

申请日：2015-07-28

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Do Jae Yoo ,  Kyu Hwan Oh ,  Jong In Ryu ,  Jae Hyun Lim

IPC: H01L21/00 ,  H01L23/552 ,  H01L21/56 ,  H01L25/00 ,  H01L25/065 ,  H01L23/498 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L23/552 ,  H01L21/561 ,  H01L21/565 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/16 ,  H01L24/81 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/97 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2224/81

Abstract: The package includes: a substrate having at least one circuit layer; at least one electronic component mounted on at least one surface of the substrate; a molded part formed on the surface of the substrate to enclose the electronic component; at least one via formed in the molded part to be electrically connected to the circuit layer of the substrate; and a pattern connected to one end of a plated tail connected to the circuit layer connected to the via and exposed to the exterior of the substrate.

公开(公告)号：US09508565B2

公开(公告)日：2016-11-29

申请号：US14798833

申请日：2015-07-14

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jae Hyun Lim ,  Do Jae Yoo ,  Eun Jung Jo

IPC: H01L21/66 ,  H01L21/78 ,  H01L21/768 ,  H01L23/00 ,  H01L23/31 ,  H01L21/56 ,  H01L23/14 ,  H01L23/498 ,  H01L21/48 ,  H05K1/00

CPC classification number: H01L21/561 ,  H01L21/4853 ,  H01L22/14 ,  H01L22/32 ,  H01L23/145 ,  H01L23/49811 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K1/00 ,  H01L2924/00

Abstract: The semiconductor package according to an exemplary embodiment includes: a substrate having a plurality of circuit layers and connection pads which are provided between a plurality of insulating layers; a plated tail part of which one end is electrically connected to the connection pad; a dicing part provided in contact with the other end of the plated tail part; a molded part provided on the substrate; and molded part vias provided on the connection pads and penetrating through the molded part.

Abstract translation: 根据示例性实施例的半导体封装包括：具有多个电路层的基板和设置在多个绝缘层之间的连接焊盘; 其一端电连接到连接垫的电镀尾部; 设置成与镀覆尾部的另一端接触的切割部; 设置在基板上的模制部件; 以及设置在连接垫上并穿透模制部件的模制零件通孔。

公开(公告)号：US09123683B2

公开(公告)日：2015-09-01

申请号：US13782859

申请日：2013-03-01

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Tae Hyun Kim ,  Bum Seok Suh ,  Do Jae Yoo ,  Kwang Soo Kim

IPC: H01L23/00

CPC classification number: H01L24/34 ,  H01L24/33 ,  H01L24/36 ,  H01L24/40 ,  H01L24/41 ,  H01L2224/40095 ,  H01L2224/40137 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: Disclosed herein is a unit power module including: a first semiconductor chip having one surface on which a 1-1-th electrode and a 1-2-th electrode spaced apart from the 1-1-th electrode are formed and the other surface on which a 1-3-th electrode is formed, a second semiconductor chip having one surface on which a 2-1-th electrode is formed and the other surface on which a 2-2-th electrode is formed, a first metal plate contacting the 1-1-th electrode of the first semiconductor chip and the 2-1-th electrode of the second semiconductor chip, a second metal plate contacting the 1-2-th electrode of the first semiconductor chip and spaced apart from the first metal plate, a third metal plate contacting the 1-3-th electrode of the first semiconductor chip and the 2-2-th electrode of the second semiconductor chip, and a sealing member formed to surround the first metal plate, the second metal plate, and the third metal plate.

Abstract translation: 这里公开了一种单位功率模块，包括：第一半导体芯片，其具有一个表面，其上形成有与第1-1电极间隔开的第1-1电极和第1-2电极，另一个表面在 形成有第1-3电极的第二半导体芯片，形成有第2-1电极的一个表面的第二半导体芯片和形成有第2-2电极的另一表面，第一金属板接触 第一半导体芯片的第1-1电极和第二半导体芯片的第2-1电极，与第一半导体芯片的第1-2电极接触并与第一半导体芯片间隔开的第二金属板 与第一半导体芯片的第1-3电极和第二半导体芯片的第2-2电极接触的第三金属板和形成为围绕第一金属板，第二金属板， 和第三金属板。

公开(公告)号：US20150181708A1

公开(公告)日：2015-06-25

申请号：US14268156

申请日：2014-05-02

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jong In Ryu ,  Eun Jung Jo ,  Do Jae Yoo

IPC: H05K1/11

CPC classification number: H05K1/111 ,  H05K1/181 ,  H05K2201/09409 ,  H05K2201/10189 ,  H05K2201/10515 ,  H05K2201/10545 ,  Y02P70/611

Abstract: There is provided a semiconductor package module including: a substrate having one or more connection terminals formed thereon; first electronic components mounted on a first surface of the substrate; second electronic components mounted on a second surface of the substrate; and third electronic components formed on the substrate and including connection electrodes connecting the one or more connection terminals and external terminals to each other.

Abstract translation: 提供了一种半导体封装模块，包括：基板，其上形成有一个或多个连接端子; 安装在所述基板的第一表面上的第一电子部件; 安装在所述基板的第二表面上的第二电子部件; 以及形成在所述基板上并且包括将所述一个或多个连接端子和外部端子彼此连接的连接电极的第三电子部件。