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公开(公告)号:US20230175709A1
公开(公告)日:2023-06-08
申请号:US17950767
申请日:2022-09-22
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Donghyun KIM , Jinwoo HONG , Sungwoo KIM , Jinbaek KIM , Hyojin KIM , Jaehyoung SIM , Seonghyun YOON , Sungjune CHO
IPC: F24F1/0018 , F24F1/0059
CPC classification number: F24F1/0018 , F24F1/0059
Abstract: An air conditioner including: a housing communicating with a space in which a window covering is installed, and including a suction port through which air is suctioned from the space and a discharge port through which air is discharged into an indoor area; a heat exchanger configured to exchange heat with the air suctioned through the suction port; a blower fan allowing air to be suctioned through the suction port or allowing air to be discharged through the discharge port; and a guide panel provided at the suction port to guide the window covering to prevent the window covering from covering the suction port.
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公开(公告)号:US20220164923A1
公开(公告)日:2022-05-26
申请号:US17221105
申请日:2021-04-02
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Hyunseung LEE , Donghyun KIM , Youngsu MOON , Seungho PARK , Younghoon JEONG
Abstract: An electronic apparatus is disclosed. The electronic apparatus includes a memory configured to store a plurality of neural network models, and a processor connected to the memory and control the electronic apparatus in which the processor is configured to obtain a weight map based on an object area included in an input image, and obtain a plurality of images by inputting the input image to each of the plurality of neural network models, and obtain an output image by weighting the plurality of images based on the weight map, and each of the plurality of neural network models is a model trained to upscale an image.
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公开(公告)号:US20220139900A1
公开(公告)日:2022-05-05
申请号:US17329669
申请日:2021-05-25
Applicant: Samsung Electronics Co., Ltd.
Inventor: In-Wook OH , Byungyun KANG , Donghyun KIM , Hyungjune KIM , Jaebong JUNG
IPC: H01L27/02 , H01L27/092 , H01L23/48 , H01L23/528 , H01L29/78 , H01L29/08 , H01L29/06 , H01L29/423 , H01L29/786 , H01L21/8238
Abstract: Disclosed is a semiconductor device comprising a substrate that includes a cell region and a dummy region, a first metal layer on the substrate and including a dummy line on the dummy region, a power delivery network on a bottom surface of the substrate, and a first through via that penetrates the substrate and extends from the power delivery network toward the dummy line. The first through via is electrically connected to the dummy line. The power delivery network includes a plurality of lower lines and a pad line below the lower lines. The pad line is electrically connected through the lower lines to the first through via.
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公开(公告)号:US20220011048A1
公开(公告)日:2022-01-13
申请号:US17309297
申请日:2019-12-06
Applicant: Samsung Electronics Co., Ltd.
Inventor: Junkyu JUNG , Donghyun KIM , Kangtae SEO , Yonghwa CHOI
Abstract: A heat exchanger is provided. The heat exchanger comprises: a first header comprising a first globe and a second globe; a second header disposed in parallel with the first header; a tube assembly comprising multiple first tubes for connecting the first header and the second header and causing a refrigerant introduced from the first globe to flow in a first direction toward the position of the second header, and multiple second tubes disposed continuously with the multiple first tubes so as to cause a refrigerant introduced from the second header to flow in a second direction that is opposite to the first direction; and multiple heat exchange-fins individually having multiple insertion portions, into which the multiple first tubes and the multiple second tubes are inserted, respectively, and heat exchange surfaces disposed between the multiple insertion portions. The first heat-exchange fin, which is adjacent to the first header among the multiple heat exchange fins, has a heat-exchange surface including a first surface having a louver formed thereon, and a second surface formed to be flat and adjacent to insertion portions into which multiple second tubes are inserted. The second heat-exchange fin, which is adjacent to the second header, has a heat-exchange surface including a first surface.
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35.
公开(公告)号:US20200304704A1
公开(公告)日:2020-09-24
申请号:US16896651
申请日:2020-06-09
Applicant: Samsung Electronics Co., Ltd.
Inventor: Wooyong LEE , Kyungyul SEO , Jonghun WON , Changhoon KANG , Donghyun KIM , Sungeun KIM , Daehyun SUNG
Abstract: An electronic device is provided. The electronic device includes at least one processor configured to obtain a plurality of first images as per a first frame rate using the camera based on a signal related to image recording and control the camera to perform focusing of a lens included in the camera on at least one of one or more objects in the plurality of first images while obtaining the plurality of first images, provide a first portion of the plurality of first images as a preview through the display, control the camera to lock the focusing on the at least one object, identify a designated event for slow motion recoding while obtaining the plurality of first images, based at least in part on the designated event, obtain a plurality of second images as per a second frame rate higher than the first frame rate using the camera focusing-locked on the at least one object, and provide a video related to the at least one object using a second portion of the plurality of first images and at least one of the plurality of second images.
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公开(公告)号:US20170125471A1
公开(公告)日:2017-05-04
申请号:US15333382
申请日:2016-10-25
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Donghyun KIM , Doowon KWON
IPC: H01L27/146
CPC classification number: H01L27/14634 , H01L27/14621 , H01L27/14627 , H01L27/1464 , H01L27/14645 , H01L27/1469
Abstract: A stack-type semiconductor device includes a lower device and an upper device disposed on the lower device. The lower device includes a lower substrate, a lower interconnection on the lower substrate, a lower pad on the lower interconnection, and a lower interlayer insulating layer covering side surfaces of the lower interconnection and the lower pad. The upper device includes an upper substrate, an upper interconnection under the upper substrate, an upper pad under the upper interconnection, and an upper interlayer insulating layer covering side surfaces of the upper interconnection and the upper pad. Each of the pads has a thick portion and a thin portion. The thin portions of the pads are bonded to each other, the thick portion of the lower pad contacts the bottom of the upper interlayer insulating layer, and the thick portion of the upper pad contacts the top of the lower interlayer insulating layer.
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37.
公开(公告)号:US20160014719A1
公开(公告)日:2016-01-14
申请号:US14860351
申请日:2015-09-21
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Donghyun KIM
CPC classification number: H04M1/0268 , G06F1/1626 , G06F1/165 , G06F1/1652 , G06F1/1694 , G09G3/2092 , G09G5/14 , H01H2219/039 , H04M1/0281 , H04M1/22 , H04M1/57 , H04M3/42042 , H04M19/04 , H04M2201/38 , H04M2250/12 , H04W4/12 , H04W68/00 , H04W68/02
Abstract: A portable terminal is provided having a front surface and a curved side surface in which the portable terminal is operated in a general mode in which an application is displayed on a main display area of the front surface, and in response to the occurrence of the event while in the general mode, the display is controlled to display event information related to the event on an auxiliary display area of the curved side surface and display the application on the main display area.
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公开(公告)号:US20250085011A1
公开(公告)日:2025-03-13
申请号:US18820964
申请日:2024-08-30
Applicant: Samsung Electronics Co., Ltd.
Inventor: Jun HWANG , Donghyun KIM , Jinwoo HONG , Hyeongkyu CHO , Sangjin TAE , Jaehun HUR
IPC: F24F11/63 , F24F120/10
Abstract: Provided is an air conditioner. The air conditioner includes a detection sensor. The air conditioner includes an air conditioning module configured to perform an air conditioning operation on a target space. The air conditioner includes a memory storing at least one instruction. The air conditioner includes at least one processor, comprising processing circuitry. At least one processor, individually and/or collectively, is configured to execute the at least one instruction to: detect a person in the target space using a sensor detection value of the detection sensor, and perform a power saving control operation to adjust at least one of wind strength or a set temperature of the air conditioning module, according to a power saving performing condition indicating a condition to perform a power saving control operation being satisfied, based on an absence time during which it is determined that a person is absent in the target space, and in the power saving control operation, set one power saving learning level from among a plurality of power saving learning levels, according to a performance history of a plurality of intermediate operation stages of the power saving control operation, adjust respective duration times of the plurality of intermediate operation stages, according to the set power saving learning level, and adjust at least one of the wind strength or the set temperature while the plurality of intermediate operation stages are being performed, according to the absence time.
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公开(公告)号:US20240401720A1
公开(公告)日:2024-12-05
申请号:US18658493
申请日:2024-05-08
Applicant: Samsung Electronics Co., Ltd.
Inventor: Hyunwoong CHOI , Hyunyoung LEE , Donghyun KIM , Pyungkang KIM , Beomsoo HWANG
IPC: F16L3/015
Abstract: An apparatus for folding a tube includes a fixed mount fixedly installed in a facility, a first connection member installed on the fixed mount, a folding unit connected to the first connection member and expanding or compressing a tube folded and spirally wound, a second connection member disposed on a side opposite to a portion to which the first connection member is connected, and connected to the folding unit, and a chemical liquid container to which the second connection member is connected. The folding unit includes a plurality of link members for connection rotatably installed on the first connection member and the second connection member and a plurality of foldable link members sequentially connected and folded from the plurality of link members for connection.
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公开(公告)号:US20240274453A1
公开(公告)日:2024-08-15
申请号:US18440649
申请日:2024-02-13
Applicant: Samsung Electronics Co., Ltd.
Inventor: Minhong YUN , Shigenobu MAEDA , Kyungtae KIM , Donghyun KIM , Sangyoon PARK
CPC classification number: H01L21/67288 , G05B13/027 , H01L21/67248 , H01L21/67253 , H01L21/67276
Abstract: A semiconductor production system includes: a first chamber that is configured to be set to a first setting value and process wafers; a second chamber that is configured to be set to a second setting value and process the wafers processed in the first chamber; and a fault detection and classification (FDC) modeling module configured to: train a first FDC machine learning model to generate, based on the first setting value and first FDC values sensed with respect to the wafers processed in the first chamber, first predicted FDC values with respect to first virtual wafers in the first chamber; and train a second FDC machine learning model to generate, based on the second setting value and second FDC values sensed with respect to the wafers processed in the second chamber, second predicted FDC values with respect to second virtual wafers in the second chamber.
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