公开(公告)号：US20220324738A1

公开(公告)日：2022-10-13

申请号：US17853272

申请日：2022-06-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Wanku KANG ,  Junggeun LEE ,  Jongho LEE ,  Yeonwoo CHO

IPC: C02F9/00

Abstract: A water purifier is disclosed. The water purifier according to a concept of the disclosure includes: a first module including a filter unit including a plurality of filters; a second module including a controller configured to control the first module, the second module coupled with the first module; and a water supply module including a display connected to the second module and displaying operation information of the water purifier, and a water supply nozzle receiving purified water from the first module and discharging the purified water to outside, wherein the controller is configured to control the display to display a purified water supply mode corresponding to the first module coupled with the second module.

公开(公告)号：US20220298026A1

公开(公告)日：2022-09-22

申请号：US17833029

申请日：2022-06-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yeonwoo CHO ,  Jungha PARK ,  Junggeun LEE ,  Wanku KANG ,  Sunghyun KIM ,  Jongho LEE

IPC: C02F1/00 ,  C02F1/32 ,  C02F1/461

Abstract: A water purifier including a raw water flow path, a first valve provided in a water purification path, a second valve provided in a wash water flow path, a purified water valve provided in a purified water supply tube, a flow sensor provided in a cooking water supply tube and sensing a flow amount of liquid flowing in the cooking water supply tube, a drainage valve provided in a drainage flow path branched from the cooking water supply tube and a controller for draining the liquid remaining in the cooking water supply tube, when a flow amount value sensed by the flow sensor for a preset period of time is less than or equal to a certain value, by controlling opening/closing of the purified water valve, the first valve, the second valve, and the drainage valve.

公开(公告)号：US20210384101A1

公开(公告)日：2021-12-09

申请号：US17408988

申请日：2021-08-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hee-Jeong KIM ,  Juhyun LYU ,  Un-Byoung KANG ,  Jongho LEE

IPC: H01L23/373 ,  H01L23/31 ,  H01L23/367

Abstract: Disclosed is a semiconductor package comprising first and second semiconductor structures spaced apart on a first substrate, a heat sink covering the first and second semiconductor structure and the first substrate, and a thermal interface material layer between the heat sink and the first and second semiconductor structures. The first semiconductor structure includes a first sidewall adjacent to the second semiconductor structure and a second sidewall opposite the first sidewall. The thermal interface material layer includes a first segment between the first and second semiconductor structures and a second segment protruding beyond the second sidewall. A first distance from a top surface of the first substrate to a lowest point of a bottom surface of the first segment is less than a second distance from the top surface of the first substrate to a lowest point of a bottom surface of the second segment.

公开(公告)号：US20210230015A1

公开(公告)日：2021-07-29

申请号：US17159529

申请日：2021-01-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Wanku KANG ,  Minkyu KIM ,  Junggeun LEE ,  Jongho LEE

IPC: C02F1/00 ,  B01D35/30

Abstract: Provided is a water purifier capable of freely changing a water outlet position, the water purifier including a water purifier body, a water outlet unit connected to the water purifier body, and including a manipulator configured to control the water purifier body and a water outlet nozzle configured to supply clean water to an outside of the water purifier body in connection with the manipulator, and a rotating device provided between the water purifier body and the water outlet unit and configured to rotate the water outlet unit, wherein the rotating device includes a fixed bracket and a rotating bracket provided to rotate relative to the fixed bracket to rotate the water outlet unit.

公开(公告)号：US20210034354A1

公开(公告)日：2021-02-04

申请号：US16981489

申请日：2019-03-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jongho LEE ,  Heechae YOON ,  Byungchul KIM ,  Jiseong LEE ,  Junghoon CHO

IPC: G06F8/65 ,  G06F8/71 ,  G06F9/4401 ,  G06F12/06

Abstract: An electronic device according to various embodiments of the present invention comprises: a first memory including a boot area, a kernel area, and a recovery area; a second memory configured to load data corresponding to at least one from among the boot area, the kernel area, and the recovery area included in the first memory; a communication module; and a processor electrically connected to the communication module, the first memory, and the second memory. The first memory includes instructions that cause, when executed, the processor to: download data in the first memory through the communication module; when there is a request for updating the downloaded data, perform rebooting; when performing the rebooting, confirm whether a new version of recovery data is included in the downloaded data; and when the new version of recovery data is included in the data, update the downloaded data on the basis of the new version of recovery data. Thus, by reducing procedures unnecessarily repeated in the process of updating data, it is possible to rapidly and easily update data. Additionally, other embodiments are possible.

公开(公告)号：US20200020606A1

公开(公告)日：2020-01-16

申请号：US16223642

申请日：2018-12-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hee-Jeong Kim ,  Juhyun LYU ,  Un-Byoung KANG ,  Jongho LEE

IPC: H01L23/373 ,  H01L23/367 ,  H01L23/31

Abstract: Disclosed is a semiconductor package comprising first and second semiconductor structures spaced apart on a first substrate, a heat sink covering the first and second semiconductor structure and the first substrate, and a thermal interface material layer between the heat sink and the first and second semiconductor structures. The first semiconductor structure includes a first sidewall adjacent to the second semiconductor structure and a second sidewall opposite the first sidewall. The thermal interface material layer includes a first segment between the first and second semiconductor structures and a second segment protruding beyond the second sidewall. A first distance from a top surface of the first substrate to a lowest point of a bottom surface of the first segment is less than a second distance from the top surface of the first substrate to a lowest point of a bottom surface of the second segment.