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公开(公告)号：US20240076211A1
公开(公告)日：2024-03-07
申请号：US18344393
申请日：2023-06-29
发明人： Jungha PARK , Gimun GWAK , Sungjin KIM , Junggeun LEE , Jongho LEE
IPC分类号： C02F1/469
CPC分类号： C02F1/4695 , C02F2201/46115 , C02F2201/46135 , C02F2201/4614 , C02F2209/40 , C02F2209/44
摘要： Disclosed is a water purifier that includes a deionization device for purifying water with electric power, and a controller electrically connected to the deionization. The deionization device includes a housing and a plurality of electric filters arranged in a plurality of isolation rooms formed in the housing. The controller operates the plurality of electric filters by dividing the plurality of electric filters into a plurality of electric adsorption filters which adsorb ionic materials and at least one electric resting filter which remains in a standby state during a water purification operation, and restart the water purification operation or perform a recycling operation to recycle the plurality of electric filters, depending on whether a restart command for the water purification operation is input within a preset waiting time from a point in time when the water purification operation is stopped.
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公开(公告)号：US20220130802A1
公开(公告)日：2022-04-28
申请号：US17571796
申请日：2022-01-10
发明人： Joonho JUN , Un-Byoung KANG , Sunkyoung SEO , Jongho LEE , Young Kun JEE
IPC分类号： H01L25/065 , H01L23/00
摘要： A semiconductor package may include first and second substrates, which are vertically stacked, a semiconductor device layer on a bottom surface of the second substrate to face a top surface of the first substrate, upper chip pads and an upper dummy pad on the top surface of the first substrate, penetration electrodes, which each penetrate the first substrate and are connected to separate, respective upper chip pads, lower chip pads on a bottom surface of the semiconductor device layer and electrically connected to separate, respective upper chip pads, and a lower dummy pad on the bottom surface of the semiconductor device layer and electrically isolated from the upper dummy pad. A distance between the upper and lower dummy pads in a horizontal direction that is parallel to the first substrate may be smaller than a diameter of the lower dummy pad.
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公开(公告)号：US20220013496A1
公开(公告)日：2022-01-13
申请号：US17168238
申请日：2021-02-05
发明人： Jinwoo PARK , Unbyoung KANG , Jongho LEE , Teakhoon LEE
IPC分类号： H01L25/065 , H01L23/367 , H01L23/16 , H01L23/31 , H01L23/00
摘要： A package structure includes a lower substrate, substrate connection terminals on the lower substrate, a semiconductor package on the substrate connection terminals, the semiconductor package including a package substrate and a first encapsulant covering the package substrate, first underfills between the lower substrate and the semiconductor package, the first underfills covering corner portions of the semiconductor package, as viewed in a plan view, and covering at least one of the substrate connection terminals, and a second underfill between the lower substrate and the semiconductor package, the second underfill covering a side surface of the semiconductor package in a plan view.
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公开(公告)号：US20220010993A1
公开(公告)日：2022-01-13
申请号：US17309521
申请日：2019-11-29
发明人： Jungsoo LIM , Kyoungmok KIM , Seulkiro KIM , Sunhee PARK , Hyesoon YANG , Kisup LEE , Sinyoung LEE , Jongho LEE , Mingyu JUNG , Jeongsu HAN
摘要： Disclosed is an air conditioner for creating a comfortable indoor environment. The air conditioner includes an indoor unit configured to have a carbon dioxide remover for filtering carbon dioxide from indoor air to supply clean air into a room, and discharging the filtered carbon dioxide to the outside, an outdoor unit configured to have an oxygen generator for separating oxygen from outdoor air introduced from the outside to supply the separated oxygen into the room, and discharging residues from which the oxygen is separated to the outside; and a processor configured to control the carbon dioxide remover and the oxygen generator to discharge the filtered carbon dioxide and the residues to the outdoor together. According to the disclosure, by first removing the carbon dioxide from the room and then discharging the carbon dioxide and the residues while operating the oxygen generator, a piping installation operation by a simple piping structure as well as an efficient operation is possible.
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公开(公告)号：US20210214242A1
公开(公告)日：2021-07-15
申请号：US17150089
申请日：2021-01-15
发明人： Jungha PARK , Jongho LEE , Yeonwoo CHO , Sungpil CHOI
摘要： A water purifier is provided. The water purifier includes a raw water flow path provided to introduce raw water from an outside, a clean water flow path connected to the raw water flow path, pre-treatment filters arranged in parallel on the clean water flow path to filter the raw water, and a water purifying filter arranged on the clean water flow path to receive clean water discharged from the pre-treatment filters.
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公开(公告)号：US20200324231A1
公开(公告)日：2020-10-15
申请号：US16846963
申请日：2020-04-13
发明人： Wan-Ku KANG , Jung-Geun LEE , Jongho LEE , Moohyung LEE , Yeonwoo CHO
摘要： A filter assembly includes a filter holder into which a part of the filter is insertable, and a lock mounted to the filter holder and configured to lock and release the filter to and from the filter holder. The lock includes a guide coupled to the filter holder and configured to be linearly movable to transmit a force in a direction into which the filter is inserted, a pusher configured to transmit a force in a direction opposite to the direction, into which the filter is inserted, by an elastic member, a stopper rotatably received in the pusher to be arranged between the pusher and the guide, and configured to linearly move the filter holder by being linearly moved by the guide and the pusher, and a cam configured to lock and release the filter to and from the filter holder by guiding rotation and linear movement of the stopper.
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公开(公告)号：US20200027855A1
公开(公告)日：2020-01-23
申请号：US16281496
申请日：2019-02-21
发明人： Sanghoon LEE , Jiwon SHIN , Hyunggil BAEK , Minkeun KWAK , Jongho LEE
IPC分类号： H01L23/00
摘要： A method for bonding a semiconductor package includes loading a semiconductor chip on a substrate, and bonding the semiconductor chip to the substrate by using a bonding tool, the bonding tool including a pressing surface for pressing the semiconductor chip, and an inclined surface extending from one side of the pressing surface. Bonding the semiconductor chip to the substrate includes deforming a bonding agent disposed between the substrate and the semiconductor chip by pressing the bonding tool, and deforming the bonding agent includes generating a fillet by protruding a portion of the bonding agent beyond the semiconductor chip, and growing the fillet in such a way that a top surface of the fillet is grown in an extending direction of the inclined surface.
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公开(公告)号：US20230322602A1
公开(公告)日：2023-10-12
申请号：US18206172
申请日：2023-06-06
发明人： Jungha PARK , Jongho LEE , Sungpil CHOI , Junggeun LEE
CPC分类号： C02F9/20 , C02F1/42 , C02F1/44 , C02F1/461 , C02F2201/005 , C02F2201/007 , C02F2209/006 , C02F2209/10 , C02F2301/043 , C02F2303/16
摘要： A water purifier comprising a pre-treatment filter connectable to an inlet flow path; an auxiliary filter including a filter cap and a filter body, connectable to a first connection flow path; a membrane filter including a filter cap and a filter body, so that water discharged from the auxiliary filter is introduced through a second connection flow path; a post-treatment filter including a filter cap and a filter body, so that water discharged from the membrane filter is introduced through a third connection flow path; a branch flow path that branches off from an upstream side of the first connection flow path and merges on a downstream side of the first connection flow path; an electrolysis module arrangeable along the branch flow path; and an opening/closing valve arrangeable along the first connection flow path so that water flows to the first connection flow path or the branch flow path.
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公开(公告)号：US20220037261A1
公开(公告)日：2022-02-03
申请号：US17349174
申请日：2021-06-16
发明人： Ju-Il CHOI , Gyuho KANG , Un-Byoung KANG , Byeongchan KIM , Junyoung PARK , Jongho LEE , Hyunsu HWANG
IPC分类号： H01L23/538 , H01L23/498 , H01L23/00 , H01L23/31 , H01L25/10
摘要： A semiconductor package including a redistribution substrate including an insulating layer and redistribution patterns in the insulating layer may be provided. Each of the redistribution patterns may include a via portion, a pad portion vertically overlapping the via portion, and a line portion extending from the pad portion. The via portion, the pad portion, and the line portion may be connected to each other to form a single object. A level of a bottom surface of the pad portion may be lower than a level of a bottom surface of the line portion. A width of the line portion may have a largest value at a level between a top surface of the line portion and the bottom surface of the line portion.
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10.发明申请公开(公告)号：US20180128891A1
公开(公告)日：2018-05-10
申请号：US15807800
申请日：2017-11-09
发明人： Jin-hee JEONG , Jongho LEE
IPC分类号： G01R33/56
CPC分类号： G01R33/5602 , G01R33/4835 , G01R33/561
摘要： Provided are a magnetic resonance imaging (MRI) apparatus and method for obtaining a plurality of MR images having different contrasts by using a single pulse sequence. The MRI apparatus includes a controller configured to control a pulse sequence of one cycle to be applied to a plurality of slices of an object, wherein the one cycle includes a first obtaining section during which a first inversion radio frequency (RF) pulse is applied to a first slice of the object and a second obtaining section during which a second inversion RF pulse is applied to a second slice of the object adjacent to the first slice, and to sequentially obtain a first MR signal for capturing a first MR image of the first slice, a second MR signal for capturing at least one second MR image of the second slice adjacent to the first slice, and a third MR signal for capturing at least one third MR image of the first slice, during the first obtaining section.
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