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公开(公告)号:US20230249960A1
公开(公告)日:2023-08-10
申请号:US18134381
申请日:2023-04-13
Applicant: STMicroelectronics S.r.l.
Inventor: Nicolo' BONI , Roberto CARMINATI , Massimiliano MERLI
CPC classification number: B81B3/0072 , B81B3/0021 , G02B26/0858 , G03B21/008 , H04N9/3152 , H10N30/20 , B81B2201/042
Abstract: This disclosure pertains to a microelectromechanical systems (MEMS) device with a tiltable structure, a fixed supporting structure, and an actuation structure with driving arms connected to the tiltable structure by elastic decoupling elements. Described herein, particularly, is a planar stop structure between the driving arms and the tiltable structure, which functions to limit movement in the tiltable plane. This stop structure includes a first projection/abutment surface pair formed by a projection extending from a driving arm and an abutment surface formed by a recess in the tiltable structure. The projection and abutment surface are adjacent and spaced apart in the device's rest condition.
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32.
公开(公告)号:US20220380199A1
公开(公告)日:2022-12-01
申请号:US17752016
申请日:2022-05-24
Applicant: STMicroelectronics S.r.l.
Inventor: Nicolo' BONI , Gabriele GATTERE , Manuel RIANI , Roberto CARMINATI
IPC: B81B3/00
Abstract: A MEMS actuator includes a mobile mass suspended over a substrate in a first direction and extending in a plane that defines a second direction and a third direction perpendicular thereto. Elastic elements arranged between the substrate and the mobile mass have a first compliance in a direction parallel to the first direction that is lower than a second compliance in a direction parallel to the second direction. Piezoelectric actuation structures have a portion fixed with respect to the substrate and a portion that deforms in the first direction in response to an actuation voltage. Movement-transformation structures coupled to the piezoelectric actuation structures include an elastic movement-conversion structure arranged between the piezoelectric actuation structures and the mobile mass. The elastic movement-conversion structure is compliant in a plane formed by the first and second directions and has first and second principal axes of inertia transverse to the first and second directions.
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公开(公告)号:US20220373785A1
公开(公告)日:2022-11-24
申请号:US17745186
申请日:2022-05-16
Applicant: STMicroelectronics S.r.l.
Inventor: Nicolo' BONI , Gianluca MENDICINO , Enri DUQI , Roberto CARMINATI , Massimiliano MERLI
Abstract: A microelectromechanical mirror device has, in a die of semiconductor material: a fixed structure defining a cavity; a tiltable structure carrying a reflecting region elastically suspended above the cavity; at least a first pair of driving arms coupled to the tiltable structure and carrying respective piezoelectric material regions which may be biased to cause a rotation thereof around at least one rotation axis; elastic suspension elements coupling the tiltable structure elastically to the fixed structure and which are stiff with respect to movements out of the horizontal plane and yielding with respect to torsion; and a piezoresistive sensor configured to provide a detection signal indicative of the rotation of the tiltable structure. At least one test structure is integrated in the die to provide a calibration signal indicative of a sensitivity variation of the piezoresistive sensor in order to calibrate the detection signal.
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34.
公开(公告)号:US20220350134A1
公开(公告)日:2022-11-03
申请号:US17729558
申请日:2022-04-26
Applicant: STMicroelectronics S.r.l.
Inventor: Roberto CARMINATI , Nicolo' BONI , Irene MARTINI , Massimiliano MERLI , Laura OGGIONI
Abstract: A process for manufacturing a microelectromechanical mirror device includes, in a semiconductor wafer, defining a support frame, a plate connected to the support frame so as to be orientable around at least one rotation axis, and cantilever structures extending from the support frame and coupled to the plate so that bending of the cantilever structures causes rotations of the plate around the at least one rotation axis. The process further includes forming piezoelectric actuators on the cantilever structures, forming pads on the support frame, and forming spacer structures protruding from the support frame more than both the pads and the stacks of layers forming the piezoelectric actuators.
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35.
公开(公告)号:US20220011567A1
公开(公告)日:2022-01-13
申请号:US17369145
申请日:2021-07-07
Applicant: STMicroelectronics S.r.l.
Inventor: Roberto CARMINATI , Nicolo' BONI , Massimiliano MERLI , Enri DUQI
Abstract: A MEMS micromirror device is formed in a package including a containment body and a lid transparent to a light radiation. The package forms a cavity housing a tiltable platform having a reflecting surface. A metastructure is formed on the lid and/or on the reflecting surface and includes a plurality of diffractive optical elements.
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36.
公开(公告)号:US20210229984A1
公开(公告)日:2021-07-29
申请号:US17155429
申请日:2021-01-22
Applicant: STMicroelectronics S.r.l.
Inventor: Enri DUQI , Nicolo' BONI , Lorenzo BALDO , Massimiliano MERLI , Roberto CARMINATI
Abstract: To manufacture an oscillating structure, a wafer is processed by: forming torsional elastic elements; forming a mobile element connected to the torsional elastic elements; processing the first side of the wafer to form a mechanical reinforcement structure; and processing the second side of said wafer by steps of chemical etching, deposition of metal material, and/or deposition of piezoelectric material. Processing of the first side of the wafer is carried out prior to processing of the second side of the wafer so as not to damage possible sensitive structures formed on the first side of the wafer.
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公开(公告)号:US20210188622A1
公开(公告)日:2021-06-24
申请号:US17126929
申请日:2020-12-18
Applicant: STMicroelectronics S.r.l.
Inventor: Nicolo' BONI , Roberto CARMINATI , Massimiliano MERLI
Abstract: A micro-electro-mechanical device is formed by a fixed structure having a cavity. A tiltable structure is elastically suspended over the cavity and has a main extension in a tiltable plane and is rotatable about a rotation axis parallel to the tiltable plane. A piezoelectric actuation structure includes first and second driving arms carrying respective piezoelectric material regions and extending on opposite sides of the rotation axis. The first and the second driving arms are rigidly coupled to the fixed structure and are elastically coupled to the tiltable structure. During operation, a stop structure limits movements of the tiltable structure with respect to the actuation structure along a planar direction perpendicular to the rotation axis. The stop structure has a first planar stop element formed between the first driving arm and the tiltable structure and a second planar stop element formed between the second driving arm and the tiltable structure.
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38.
公开(公告)号:US20200310110A1
公开(公告)日:2020-10-01
申请号:US16830920
申请日:2020-03-26
Applicant: STMicroelectronics S.r.l.
Inventor: Roberto CARMINATI , Nicolo' BONI , Massimiliano MERLI
Abstract: A MEMS device is formed in a die of semiconductor material having a cavity defined therein and having an anchorage portion. A tiltable structure is elastically suspended over the cavity and has a main extension in a horizontal plane. First and second supporting arms extend between the anchorage portion and opposite sides of the tiltable structure. First and second resonant piezoelectric actuation structures are intended to be biased to thereby cause rotation of the tiltable structure about a rotation axis. The first supporting arm is formed by first and second torsion springs, which are rigid to movements out of the horizontal plane and compliant to torsion about the rotation axis and are coupled together at a constraint region. The first and second resonant piezoelectric actuation structures extend between the anchorage portion and the constraint structure, on first and second sides of the first supporting arm.
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公开(公告)号:US20200033591A1
公开(公告)日:2020-01-30
申请号:US16591854
申请日:2019-10-03
Applicant: STMicroelectronics S.r.l.
Inventor: Giorgio ALLEGATO , Sonia COSTANTINI , Federico VERCESI , Roberto CARMINATI
Abstract: A method for making a micro-electro mechanical (MEMS) device includes forming a MEMS mirror stack on a handle layer, and applying a first bonding layer to the MEMS mirror stack. The method continues with disposing a substrate on the first bonding layer such that the MEMS mirror stack is mechanically anchored to the substrate and so as to seal against ingress of environmental contaminants, removing the handle layer, and applying a second bonding layer to the MEMS mirror stack. A cap layer is disposed on the second bonding layer such that the cap layer is mechanically anchored to the MEMS mirror stack and so as to seal against ingress of environmental contaminants.
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