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1.发明申请公开(公告)号：US20210262884A1
公开(公告)日：2021-08-26
申请号：US17168059
申请日：2021-02-04
Applicant: STMICROELECTRONICS S.r.l.
Inventor： Mikel AZPEITIA URQUIA , Giorgio ALLEGATO
Abstract: A semiconductor device for ambient sensing including: a cap traversed by a hole; and a main body mechanically coupled to the cap so as to delimit a cavity, which is interposed between the main body and the cap. The main body includes a semiconductor body and a coupling structure, which is interposed between the semiconductor body and the cap and laterally delimits a channel, which fluidically couples the cavity and the hole. The channel performs a mechanical filtering that is finer than the mechanical filtering performed by the hole.
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2.发明申请公开(公告)号：US20200092659A1
公开(公告)日：2020-03-19
申请号：US16693003
申请日：2019-11-22
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Matteo PERLETTI , Federico VERCESI , Silvia ADORNO , Giorgio ALLEGATO
Abstract: A method for manufacturing a filtering module comprising the steps of: forming a multilayer body comprising a filter layer of semiconductor material and having a thickness of less than 10 μm, a first structural layer coupled to a first side of the filter layer, and a second structural layer coupled to a second side, opposite to the first side, of the filter layer; forming a recess in the first structural layer, which extends throughout its thickness; removing selective portions, exposed through the recess, of the filter layer to form a plurality of openings, which extend throughout the thickness of the filter layer; and completely removing the second structural layer to connect fluidically the first and second sides of the filter layer, thus forming a filtering membrane designed to inhibit passage of contaminating particles.
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公开(公告)号：US20200033591A1
公开(公告)日：2020-01-30
申请号：US16591854
申请日：2019-10-03
Applicant: STMicroelectronics S.r.l.
Inventor： Giorgio ALLEGATO , Sonia COSTANTINI , Federico VERCESI , Roberto CARMINATI
Abstract: A method for making a micro-electro mechanical (MEMS) device includes forming a MEMS mirror stack on a handle layer, and applying a first bonding layer to the MEMS mirror stack. The method continues with disposing a substrate on the first bonding layer such that the MEMS mirror stack is mechanically anchored to the substrate and so as to seal against ingress of environmental contaminants, removing the handle layer, and applying a second bonding layer to the MEMS mirror stack. A cap layer is disposed on the second bonding layer such that the cap layer is mechanically anchored to the MEMS mirror stack and so as to seal against ingress of environmental contaminants.
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4.发明申请公开(公告)号：US20170088416A1
公开(公告)日：2017-03-30
申请号：US15083034
申请日：2016-03-28
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Alessandro TOCCHIO , Carlo VALZASINA , Luca GUERINONI , Giorgio ALLEGATO
CPC classification number: B81B7/0048 , B81B2201/0235 , B81B2201/0242 , B81B2207/012 , B81B2207/096 , B81C1/00325 , B81C2203/0792 , H01L23/055 , H01L23/13 , H01L23/16 , H01L2224/32145 , H01L2224/48145 , H01L2224/48235 , H01L2224/73265 , H01L2924/1433 , H01L2924/1461 , H01L2924/15153 , H01L2924/15313 , H01L2924/16195 , H01L2924/16251 , H01L2924/3511 , H01L2924/00012
Abstract: An encapsulated device of semiconductor material wherein a chip of semiconductor material is fixed to a base element of a packaging body through at least one pillar element having elasticity and deformability greater than the chip, for example a Young's modulus lower than 300 MPa. In one example, four pillar elements are fixed in proximity of the corners of a fixing surface of the chip and operate as uncoupling structure, which prevents transfer of stresses and deformations of the base element to the chip.
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公开(公告)号：US20230324678A1
公开(公告)日：2023-10-12
申请号：US18206363
申请日：2023-06-06
Applicant: STMicroelectronics S.r.l.
Inventor： Giorgio ALLEGATO , Sonia COSTANTINI , Federico VERCESI , Roberto CARMINATI
CPC classification number: G02B26/105 , B81C1/00317 , G02B26/0833 , B81C2203/0109 , B81B2201/042 , B81C2203/019 , B81C1/00523
Abstract: A method of making a MEMS device including forming a mirror stack on a handle layer, applying a first bonding layer to the mirror stack, and disposing a substrate on the first bonding layer. The handle layer is removed and a second bonding layer is applied. A cap layer is disposed on the second bonding layer. The mirror stack is formed by disposing a silicon layer on the handle layer, disposing a first insulating layer on the silicon layer, etching portions of the first insulating layer, and depositing a first conductive layer on the first insulating layer. The formation also includes depositing a second insulating layer on the first conductive layer, a portion of the second insulating layer to expose a portion of the first conductive layer exposed, and forming a conductive pad on the exposed portion of the first conductive layer.
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Patent Agency Ranking
公开(公告)号：US20210363000A1
公开(公告)日：2021-11-25
申请号：US17320993
申请日：2021-05-14
Applicant: STMicroelectronics S.r.l.
Inventor： Giorgio ALLEGATO , Lorenzo CORSO , Ilaria GELMI , Carlo VALZASINA
Abstract: A process for manufacturing a MEMS device includes forming a first structural layer of a first thickness on a substrate. First trenches are formed through the first structural layer, and masking regions separated by first openings are formed on the first structural layer. A second structural layer of a second thickness is formed on the first structural layer in direct contact with the first structural layer at the first openings and forms, together with the first structural layer, thick structural regions having a third thickness equal to the sum of the first and the second thicknesses. A plurality of second trenches are formed through the second structural layer, over the masking regions, and third trenches are formed through the first and the second structural layers by removing selective portions of the thick structural regions.
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7.发明公开公开(公告)号：US20240154599A1
公开(公告)日：2024-05-09
申请号：US18505574
申请日：2023-11-09
Applicant: STMICROELECTRONICS S.r.l.
Inventor： Federico VERCESI , Lorenzo CORSO , Giorgio ALLEGATO , Gabriele GATTERE
CPC classification number: H03H9/1021 , B81B7/0038 , B81C1/00285 , H03H3/02 , H03H9/17 , B81B2201/0271 , B81B2203/0118 , B81B2203/0315 , B81B2203/04 , B81B2207/07 , B81C2201/0105 , B81C2203/0118 , H03H2003/022 , H03H2003/027 , H03H2009/155
Abstract: A microelectromechanical resonator device has: a main body, with a first surface and a second surface, opposite to one another along a vertical axis, and made of a first layer and a second layer, arranged on the first layer; a cap, having a respective first surface and a respective second surface, opposite to one another along the vertical axis, and coupled to the main body by bonding elements; and a piezoelectric resonator structure formed by: a mobile element, constituted by a resonator portion of the first layer, suspended in cantilever fashion with respect to an internal cavity provided in the second layer and moreover, on the opposite side, with respect to a housing cavity provided in the cap; a region of piezoelectric material, arranged on the mobile element on the first surface of the main body; and a top electrode, arranged on the region of piezoelectric material, the mobile element constituting a bottom electrode of the piezoelectric resonator structure.
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8.发明公开公开(公告)号：US20240140783A1
公开(公告)日：2024-05-02
申请号：US18489729
申请日：2023-10-18
Applicant: STMICROELECTRONICS S.r.l.
Inventor： Mark Andrew SHAW , Lorenzo CORSO , Matteo GARAVAGLIA , Giorgio ALLEGATO
CPC classification number: B81B7/0074 , B81C1/0023 , B81B2207/012 , B81C2203/0792
Abstract: A device and method for manufacturing a device comprising two semiconductor dice. The device is formed by a first die and a second die. The first die is of semiconductor material and integrates electronic components. The second die has a main surface, forms patterned structures, and is bonded to the first die. Internal electrical coupling structures electrically couple the main surface of the first die to the second die. External connection regions extend on the main surface of the first die. A package packages the first die, the second die and the internal electrical coupling structures and partially surrounds the external connection regions, the external connection regions partially protruding from the package.
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9.发明公开公开(公告)号：US20240051817A1
公开(公告)日：2024-02-15
申请号：US18363599
申请日：2023-08-01
Applicant: STMICROELECTRONICS S.r.l.
Inventor： Federico VERCESI , Gabriele GATTERE , Giorgio ALLEGATO , Mikel AZPEITIA URQUIA , Alessandro DANEI
IPC: B81B7/00 , B81B7/02 , H03K17/975
CPC classification number: B81B7/0058 , B81B7/02 , H03K17/975 , H01H2231/028 , B81B2203/04
Abstract: A microelectromechanical button device is provided with a detection structure having: a substrate of semiconductor material with a front surface and a rear surface; a buried electrode arranged on the substrate; a mobile electrode, arranged in a structural layer overlying the substrate and elastically suspended above the buried electrode at a separation distance so as to form a detection capacitor; and a cap coupled over the structural layer and having a first main surface facing the structural layer and a second main surface that is designed to be mechanically coupled to a deformable portion of a case of an electronic apparatus of a portable or wearable type. The cap has, on its first main surface, an actuation portion arranged over the mobile electrode and configured to cause, in the presence of a pressure applied on the second main surface, a deflection of the mobile electrode and its approach to the buried electrode, with a consequent capacitive variation of the detection capacitor, which is indicative of an actuation of the microelectromechanical button device.
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10.发明申请公开(公告)号：US20210099154A1
公开(公告)日：2021-04-01
申请号：US17031181
申请日：2020-09-24
Applicant: STMICROELECTRONICS S.r.l.
Inventor： Federico VERCESI , Lorenzo CORSO , Giorgio ALLEGATO , Gabriele GATTERE
Abstract: A microelectromechanical resonator device has: a main body, with a first surface and a second surface, opposite to one another along a vertical axis, and made of a first layer and a second layer, arranged on the first layer; a cap, having a respective first surface and a respective second surface, opposite to one another along the vertical axis, and coupled to the main body by bonding elements; and a piezoelectric resonator structure formed by: a mobile element, constituted by a resonator portion of the first layer, suspended in cantilever fashion with respect to an internal cavity provided in the second layer and moreover, on the opposite side, with respect to a housing cavity provided in the cap; a region of piezoelectric material, arranged on the mobile element on the first surface of the main body; and a top electrode, arranged on the region of piezoelectric material, the mobile element constituting a bottom electrode of the piezoelectric resonator structure.
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