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公开(公告)号：US20230164438A1
公开(公告)日：2023-05-25
申请号：US17968330
申请日：2022-10-18
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Su Bong JANG , Sang Jong LEE , Hee Soo YOON , Tae Ho YUN
CPC classification number: H04N5/23287 , H04N5/2253 , H04N5/2254 , H04N5/2252
Abstract: A camera module includes a housing, a carrier movable in a first direction and disposed in the housing, a first body movably disposed inside the carrier, an image sensor disposed on the first body and having an imaging surface facing in the first direction, and supporting balls disposed between the carrier and the first body. The first body moves perpendicular to the first direction in a state supported by the supporting balls with respect to the carrier.
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公开(公告)号：US20230156334A1
公开(公告)日：2023-05-18
申请号：US17965224
申请日：2022-10-13
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Su Bong JANG , Sang Jong LEE , Hee Soo YOON , Tae Ho YUN , Seung Jae SONG
CPC classification number: H04N5/23287 , H01F7/081 , G02B7/021
Abstract: A sensor shifting module includes a fixed body, a first movable body movably disposed on the fixed body and coupled to an image sensor having an imaging plane oriented in a first direction, and a first driver configured to rotate the first movable body about an axis orthogonal to the first direction with respect to the fixed body, wherein the first driver includes a tilt guide ball disposed between the fixed body and the first movable body to provide a tilt center for the first movable body with respect to the fixed body.
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公开(公告)号：US20230156333A1
公开(公告)日：2023-05-18
申请号：US17961859
申请日：2022-10-07
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Su Bong JANG , Sang Jong LEE , Hee Soo YOON , Tae Ho YUN , Seung Jae SONG
CPC classification number: H04N5/23287 , H04N5/2253 , H01F7/08
Abstract: A sensor shifting module is provided. The module includes a fixed body, a movable body movably disposed inside the fixed body and including an image sensor having an imaging plane oriented in a first direction, and a driving unit moving the movable body in a direction, perpendicular to the first direction, with respect to the fixed body, and rotating the movable body about an axis parallel to the first direction. The driving unit includes a driving coil coupled to one of the fixed body and the movable body, and a driving yoke coupled to the other of the fixed body and the movable body, the driving yoke faces the driving coil in a direction perpendicular to the first direction. When a current is applied to the driving coil, the movable body moves in a direction perpendicular to the first direction, or rotates about an axis parallel to the first direction.
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公开(公告)号：US20230156328A1
公开(公告)日：2023-05-18
申请号：US17966154
申请日：2022-10-14
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Su Bong JANG , Sang Jong LEE , Hee Soo YOON , Tae Ho YUN
CPC classification number: H04N5/232127 , H04N5/2253 , H04N5/2254 , H04N5/23287
Abstract: A camera module is provided. The camera module includes a housing; a carrier, disposed in the housing, and configured to move in a first direction; an image sensor movably disposed in the carrier and having an imaging plane oriented in the first direction; and an autofocusing driver including an autofocusing actuator configured to move the carrier in the first direction with respect to the housing and a ball member disposed between the carrier and the housing.
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公开(公告)号：US20220247897A1
公开(公告)日：2022-08-04
申请号：US17508157
申请日：2021-10-22
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Tae Ho YUN , Sang Jong LEE
Abstract: A camera module includes: a lens module including one or more lenses disposed along an optical axis; a driving magnet disposed on the lens module and extending along the optical axis; and a driving coil configured to receive the driving magnet therein, and to interact with the driving magnet to drive the lens module in an optical axis direction.
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Patent Agency Ranking
公开(公告)号：US20210263260A1
公开(公告)日：2021-08-26
申请号：US17075896
申请日：2020-10-21
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Su Bong JANG , Sang Jong LEE , Nam Ki PARK , Young Bok YOON , Hee Soo YOON
Abstract: A camera module includes a fixed portion, a movable portion configured to be moved relative to the fixed portion in an optical axis direction, at least two position detection sensors, and a magnet disposed to oppose the at least two position detection sensors in a direction intersecting the optical axis direction. The magnet includes an N-pole and an S-pole on a surface opposing the at least two position detection sensors and a neutral zone between the N-pole and the S-pole. The at least two position detection sensors are disposed such that at least one position detection sensor opposes one of the N-pole and the S-pole and at least one other positon detection sensor opposes the neutral zone when the movable portion is moved in the optical axis direction.
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公开(公告)号：US20210173225A1
公开(公告)日：2021-06-10
申请号：US17069910
申请日：2020-10-14
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Sang Jong LEE , Nam Ki PARK , Young Bok YOON , Seung Hee HONG , Hee Soo YOON , Su Bong JANG
IPC: G02B27/64
Abstract: A camera module includes a housing, a frame disposed in an interior space of the housing, a movable body, a lens holder, first and second optical image stabilization (OIS) actuators. The movable body is configured to move in a first direction, perpendicular to an optical axis. The lens holder is configured to move in a second direction perpendicular to the first direction. The first OIS actuator is configured to move the movable body in the first direction. The second OIS actuator is configured to move the lens holder in the second direction. The frame includes a first opening through which a first OIS coil and a first OIS magnet of the first OIS actuator are disposed to face each other, and a second opening through which a second OIS coil and a second OIS magnet of the second OIS actuator are disposed to face each other.
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公开(公告)号：US20190259529A1
公开(公告)日：2019-08-22
申请号：US16178452
申请日：2018-11-01
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Tai Yon CHO , Chang Hak CHOI , Byeong Cheol MOON , Sang Jong LEE , Hee Soo YOON , Tae Jun CHOI , Seung Hee OH , Su Bong JANG
Abstract: A coil component includes: a body having a first surface and a second surface opposing each other in a thickness direction of the body and a wall surface connecting the first and second surfaces; a coil part including coil patterns and including at least one turn centered on the thickness direction; external electrodes disposed on the first surface of the body and electrically connected to the coil part; a shielding layer including a cap portion disposed on the second surface of the body and side wall portions disposed on the wall surface of the body and each having a first end connected to the cap portion; an insulating layer disposed between the body and the shielding layer; and a gap portion bounded by a second end of the shielding layer opposing the first end and the first surface of the body to expose portions of the wall surface.
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公开(公告)号：US20190156977A1
公开(公告)日：2019-05-23
申请号：US16032745
申请日：2018-07-11
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Min Ki JUNG , Hee Soo YOON , Sang Jong LEE , Seung Hee HONG
Abstract: A coil component includes a body including an internal coil and including an upper surface and a lower surface opposing each other in a thickness direction thereof; a first external electrode connected to one end of the internal coil; and a second external electrode connected to the other end of the internal coil. The first external electrode and the second external electrode may be formed on the same one side portion of the lower surface of the body.
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公开(公告)号：US20180138029A1
公开(公告)日：2018-05-17
申请号：US15673149
申请日：2017-08-09
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Han KIM , Mi Ja HAN , Dae Hyun PARK , Sang Jong LEE , Seong Hee CHOI
IPC: H01L21/02 , H01L21/56 , H01L21/48 , H01L21/768 , H01L23/00
CPC classification number: H01L21/0231 , H01L21/486 , H01L21/568 , H01L21/76841 , H01L21/76897 , H01L23/49816 , H01L23/5384 , H01L23/5389 , H01L23/552 , H01L24/19 , H01L2224/16225 , H01L2224/19 , H01L2224/32225 , H01L2224/73204 , H01L2924/10252 , H01L2924/10253 , H01L2924/10329 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00012 , H01L2924/00
Abstract: A fan-out semiconductor package includes: a first connection member having a through-hole; a semiconductor chip disposed in the through-hole of the first connection member and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the first connection member and the inactive surface of the semiconductor chip; and a second connection member disposed on the first connection member and the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pads. The first connection member includes a first electromagnetic interference (EMI) blocking part surrounding side surfaces of the semiconductor chip, the second connection member includes a second EMI blocking part surrounding the redistribution layer, and the first EMI blocking part and the second EMI blocking part are connected to each other.
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