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    Package-on-package (POP) type semiconductor packages
    31.
    发明授权
    Package-on-package (POP) type semiconductor packages 有权

    公开(公告)号：US11610871B2

    公开(公告)日：2023-03-21

    申请号：US16874722

    申请日：2020-05-15

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Minho Lee ,  Jaewook Yoo

    IPC: H01L25/10 ,  H01L23/498 ,  H01L23/544 ,  H01L23/13 ,  H01L23/31 ,  H01L21/48 ,  H01L25/00 ,  H01L25/065 ,  H01L25/07 ,  H01L25/075 ,  H01L25/04 ,  H01L25/16 ,  B81C99/00

    Abstract: Provided are package-on-package (POP)-type semiconductor packages including a lower package having a first size and including a lower package substrate in which a lower semiconductor chip is, an upper redistribution structure on the lower package substrate and the lower semiconductor chip, and alignment marks. The packages may also include an upper package having a second size smaller than the first size and including an upper package substrate and an upper semiconductor chip. The upper package substrate may be mounted on the upper redistribution structure of the lower package and electrically connected to the lower package, and the upper semiconductor chip may be on the upper package substrate. The alignment marks may be used for identifying the upper package, and the alignment marks may be below and near outer boundaries of the upper package on the lower package.

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