公开(公告)号：US11482653B2

公开(公告)日：2022-10-25

申请号：US16264043

申请日：2019-01-31

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dong Kuk Lee ,  Dae Young Lee ,  Moon Sub Kim ,  Sung Jin Ahn ,  Seung Hwan Lee ,  Dong Kyun Yim ,  Woo Seok Jang

IPC: H01L33/62 ,  H01L33/50 ,  H01L33/52 ,  H01L33/00 ,  H01L33/38 ,  H01L33/32

Abstract: A light emitting diode apparatus is provided. The light emitting diode apparatus includes a wavelength conversion layer, a light emitting diode layer, a light transmission layer, and a sheath layer. The wavelength conversion layer has a first refractive index. The light emitting diode layer includes a base layer arranged on the wavelength conversion layer, and a light emitting structure layer arranged on the base layer. The light transmission layer is arranged on the wavelength conversion layer, surrounds a sidewall of the light emitting diode layer and contacts the sidewall of the light emitting diode layer, and has a second refractive index. The sheath layer is arranged to cover the light emitting diode layer and the light transmission layer, and has a third refractive index less than the second refractive index.

公开(公告)号：US10361351B2

公开(公告)日：2019-07-23

申请号：US15922578

申请日：2018-03-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Chang Hoon Kwak ,  Sung Jin Ahn ,  Hak Hwan Kim ,  Jin Hwan Kim ,  Jin Kweon Chung ,  Min Jung Kim

IPC: H01L33/62 ,  H01L33/50 ,  H01L23/488 ,  H01L23/29 ,  H01L33/36

Abstract: A semiconductor light-emitting diode (LED) package is provided and includes a semiconductor LED chip having a surface on which a first electrode and a second electrode are formed; a first solder bump formed on the first electrode and a second solder bump formed on the second electrode, the first solder bump and the second solder bump protruding from the surface of the semiconductor LED chip; and a resin layer having a bottom portion that surrounds a first side surface of the first solder bump and a second side surface of the second solder bump and covers the surface of the semiconductor LED chip.

公开(公告)号：USD729770S1

公开(公告)日：2015-05-19

申请号：US29459756

申请日：2013-07-03

Applicant: Samsung Electronics Co., Ltd.

Designer： Jaewook Yoo ,  Bongkun Shin ,  Sung Jin Ahn

公开(公告)号：USD729769S1

公开(公告)日：2015-05-19

申请号：US29459650

申请日：2013-07-02

Applicant: Samsung Electronics Co., Ltd.

Designer： Jaewook Yoo ,  Bongkun Shin ,  Sung Jin Ahn