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    EARJACK AND ELECTRONIC DEVICE INCLUDING THE SAME
    34.
    发明申请
    EARJACK AND ELECTRONIC DEVICE INCLUDING THE SAME 有权
    包括它的耳机和电子设备

    公开(公告)号：US20150110331A1

    公开(公告)日：2015-04-23

    申请号：US14519875

    申请日：2014-10-21

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Taeyoun KWON ,  Myunggeun KOH ,  Junho LEE

    IPC: H04R1/06 ,  H04R1/08 ,  H04R1/10

    CPC classification number: H04R3/02 ,  H04R1/1091

    Abstract: An ear jack for preventing the generation of popup noise, and an electronic device including the same are provided. The ear jack includes a body including a passage into which an earphone is inserted. On an inside of the passage is disposed a microphone terminal to which a capacitor is connected, the microphone terminal for receiving microphone bias power when the earphone is connected to the ear jack, a ground terminal, a right sound terminal for outputting right sounds, a left sound terminal for outputting left sounds, and a detection terminal for detecting insertion of the earphone. The ground terminal includes a first ground terminal, according to a standard of the ear jack; and a second ground terminal for discharging an electric power of the capacitor, which is charged by the microphone bias power when the earphone is removed.

    Abstract translation: 提供一种用于防止产生弹出噪声的耳塞，以及包括该耳塞的电子装置。 耳塞包括具有插入耳机的通道的本体。 在通道的内侧设置有连接有电容器的麦克风端子，当耳机连接到耳塞时，用于接收麦克风偏置功率的麦克风端子，接地端子，用于输出正确声音的右声音端子， 用于输出左声音的左声音终端和用于检测耳机插入的检测端子。 接地端子包括根据耳塞的标准的第一接地端子; 以及用于放电电容器的电力的第二接地端子，其在去除耳机时由麦克风偏置功率充电。

    LINER STRUCTURE
    35.
    发明申请
    LINER STRUCTURE 有权

    公开(公告)号：US20250079129A1

    公开(公告)日：2025-03-06

    申请号：US18420009

    申请日：2024-01-23

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Junho LEE ,  Sangchul HAN ,  Yihwan KIM ,  Yeontae KIM

    IPC: H01J37/32

    Abstract: A liner structure may include a liner and a first block. The liner may be configured to be arranged on an inner sidewall of a reaction chamber configured to receive a heater and a substrate. The first block may be connected to the liner. The first block may include a material different from a material of the liner.

    SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
    36.
    发明申请
    SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME 有权

    公开(公告)号：US20240379604A1

    公开(公告)日：2024-11-14

    申请号：US18592908

    申请日：2024-03-01

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Jihyun LEE ,  Junho LEE

    IPC: H01L23/00 ,  H01L23/522

    Abstract: A semiconductor structure may include an insulation layer surrounding side surfaces of vias, connection pads on the vias, respectively, a first insulation member on the insulation layer and including through openings in which the connection pads respectively are disposed, and a second insulation member on the insulation layer and surrounding the first insulation member. Each corresponding connection pad among the plurality of connection pads may be on a corresponding via among the plurality of vias and in a corresponding through opening among the plurality of through openings. A height of the second insulation member may be lower than the heights of the connection pads. Outermost through openings among the through openings may include a first inner side surface defined by a side surface of the first insulation member and a second inner side surface defined by a side surface of the second insulation member.

    WIRELESS COMMUNICATION APPARATUS FOR RECEIVING DATA FROM MULTIPLE TRANSMISSION AND RECEPTION POINTS AND OPERATING METHOD OF THE SAME
    38.
    发明公开
    WIRELESS COMMUNICATION APPARATUS FOR RECEIVING DATA FROM MULTIPLE TRANSMISSION AND RECEPTION POINTS AND OPERATING METHOD OF THE SAME 审中-公开

    公开(公告)号：US20240154683A1

    公开(公告)日：2024-05-09

    申请号：US18409232

    申请日：2024-01-10

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Hongsik YOON ,  Jungmin PARK ,  Junho LEE

    IPC: H04B7/08 ,  H04B7/022 ,  H04B7/06 ,  H04L25/02

    CPC classification number: H04B7/086 ,  H04B7/022 ,  H04B7/0617 ,  H04L25/0224

    Abstract: A wireless communication apparatus for supporting communication with multiple transmission and reception points (TRPs) includes a radio frequency integrated circuit (RFIC) configured to receive a first reference signal from a first TRP and a second reference signal from a second TRP, and processing circuitry configured to estimate channels of a plurality of subcarriers based on at least one of the first reference signal or the second reference signal, determine a beamforming parameter based on the estimated channels, the beamforming parameter being determined based on a capacity of an effective channel between the wireless communication apparatus and both the first TRP and the second TRP, and adjust a reception beam based on the beamforming parameter, and the RFIC being configured to receive a first physical downlink shared channel (PDSCH) from the first TRP through the adjusted reception beam, and receive a second PDSCH from the second TRP.

    IMAGE SENSOR AND ELECTRONIC APPARATUS INCLUDING THE SAME
    39.
    发明公开
    IMAGE SENSOR AND ELECTRONIC APPARATUS INCLUDING THE SAME 审中-公开

    公开(公告)号：US20240079430A1

    公开(公告)日：2024-03-07

    申请号：US18236122

    申请日：2023-08-21

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Choonlae CHO ,  Sangeun MUN ,  Sungmo AHN ,  Sookyoung ROH ,  Hyunsung PARK ,  Seokho YUN ,  Sangyun LEE ,  Junho LEE

    IPC: H01L27/146

    CPC classification number: H01L27/14627 ,  H01L27/14621 ,  H01L27/1463 ,  H01L27/14645

    Abstract: An image sensor includes a sensor substrate includes first, second, and third pixels respectively sensing first, second and third wavelengths of light, A color separating lens array changes phase of light of the first, second, and third wavelengths, and condenses the phase-changed light onto the first, second and third pixels, respectively. The color separating lens array includes first to third pixel corresponding regions respectively facing the first to third pixels. The first pixel corresponding region includes a plurality of first nanoposts, the second pixel corresponding region includes a plurality of second nanoposts, and the third pixel corresponding region includes a plurality of third nanoposts, a second center nanopost having a greatest cross-sectional width among the second nanoposts overlaps a center of the second pixel, and a third center nanopost having a greatest cross-sectional width among the third nanoposts does not overlap a center of the third pixel.

    IMAGE SENSOR INCLUDING PATTERNED ANTIREFLECTION LAYER AND ELECTRONIC APPARATUS INCLUDING THE SAME
    40.
    发明公开
    IMAGE SENSOR INCLUDING PATTERNED ANTIREFLECTION LAYER AND ELECTRONIC APPARATUS INCLUDING THE SAME 审中-公开

    公开(公告)号：US20240063241A1

    公开(公告)日：2024-02-22

    申请号：US18235547

    申请日：2023-08-18

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Sangeun MUN ,  Sookyoung ROH ,  Sungmo AHN ,  Hyunsung PARK ,  Seokho YUN ,  Sangyun LEE ,  Junho LEE ,  Choonlae CHO

    IPC: H01L27/146

    CPC classification number: H01L27/14627 ,  H01L27/14645

    Abstract: Provided are an image sensor including a patterned antireflection layer and an electronic apparatus including the image sensor. The image sensor includes a sensor substrate including a plurality of first pixels sensing light having a first wavelength and a plurality of second pixels sensing light having a second wavelength different from the first wavelength, a nano-photonic lens array including a plurality of nanostructures configured to condense an incident light onto the plurality of first pixels and the plurality of second pixels, and an antireflection layer disposed on a light incident surface of the nano-photonic lens array and including a plurality of holes arranged periodically and two-dimensionally, wherein the plurality of holes include a plurality of first holes arranged along a boundary between first and second pixels adjacent to each other and a plurality of second holes disposed to face an inner region of the first pixel or the second pixel.

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