CHIP TRANSFER APPARATUS
    31.
    发明公开

    公开(公告)号:US20230154769A1

    公开(公告)日:2023-05-18

    申请号:US17736352

    申请日:2022-05-04

    CPC classification number: H01L21/67121 H01L21/67333 B65G51/02

    Abstract: A chip transfer apparatus includes: a chip storage module in which a plurality of micro-semiconductor chips and a suspension including impurities are stored; a chip filtration module separating a first suspension including the plurality of micro-semiconductor chips and a second suspension including the impurities in the suspension; and a chip supply module configured to supply the first suspension onto the transfer substrate such that the first suspension is introduced from the chip filtration module and the plurality of micro-semiconductor chips are flowable on the transfer substrate.

    MICRO-LIGHT-EMITTING DIODE DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME

    公开(公告)号:US20220077120A1

    公开(公告)日:2022-03-10

    申请号:US17174934

    申请日:2021-02-12

    Abstract: The present disclosure provides a micro-light-emitting diode display apparatus and a method of manufacturing the same. Provided is a micro-light-emitting diode (LED) display apparatus including a plurality of pixels, the micro-LED display apparatus including a driving circuit substrate, a first electrode provided on the driving circuit substrate, one or more micro-light-emitting diodes (LEDs) provided on the first electrode, an insulating layer provided on the one or more micro-LEDs, a via pattern provided in the insulating layer, electrical contacts provided in the via pattern, and a second electrode provided on the electrical contacts, wherein the via pattern exposes a portion of the one or more micro-LEDs.

    TOUCH-FINGERPRINT COMPLEX SENSOR AND METHOD OF FABRICATING THE SAME

    公开(公告)号:US20210319200A1

    公开(公告)日:2021-10-14

    申请号:US16809164

    申请日:2020-03-04

    Abstract: A touch-fingerprint complex sensor includes a fingerprint substrate provided in a fingerprint area and a touch area, common electrodes provided above the fingerprint substrate in a direction that is normal to an upper surface of the fingerprint substrate, fingerprint electrodes provided between the fingerprint substrate and the common electrodes in the direction, and touch electrodes provided below the common electrodes and the fingerprint substrate in the direction, wherein a first subset of the common electrodes, and the fingerprint electrodes are provided in the fingerprint area, and a second subset of the common electrodes, and the touch electrodes are provided in the touch area.

    FINGERPRINT RECOGNIZING SENSOR AND TOUCH SCREEN DEVICE INCLUDING THE SAME

    公开(公告)号:US20200310571A1

    公开(公告)日:2020-10-01

    申请号:US16902941

    申请日:2020-06-16

    Abstract: Provided are a transparent fingerprint recognition sensor and a touch screen device including the transparent fingerprint recognition sensor. The transparent fingerprint recognition sensor includes: a substrate; a plurality of first electrodes disposed on the substrate in a sensing area; an insulating layer disposed on the substrate and covering the plurality of first electrodes; a plurality of second electrodes disposed within the insulating layer in the sensing area; a plurality of first signal lines disposed within the insulating layer in the bezel area; and a plurality of second signal lines disposed on a top surface of the insulating layer, in the bezel area.

    ULTRASONIC TRANSDUCERS AND METHODS OF MANUFACTURING THE SAME
    39.
    发明申请
    ULTRASONIC TRANSDUCERS AND METHODS OF MANUFACTURING THE SAME 有权
    超声波传感器及其制造方法

    公开(公告)号:US20160051226A1

    公开(公告)日:2016-02-25

    申请号:US14665213

    申请日:2015-03-23

    CPC classification number: H04R31/006 B06B1/0292

    Abstract: An ultrasonic transducer module may comprise: an ultrasonic transducer comprising a substrate, a thin film separated from the substrate, a support portion for supporting the thin film, and a first electrode pad on the substrate; and/or a circuit board comprising a main body, an opening in the main body for accommodating the thin film, and a second electrode pad attached to the first electrode pad. An ultrasonic transducer may comprise: a substrate; a plurality of first electrode layers on the substrate, with spaces between the first electrode layers; an insulating layer between the substrate and the first electrode layers; a support portion on the first electrode layers; a thin film supported by the support portion, with cavities between each of the first electrode layers and the thin film; and/or a second electrode layer on the thin film.

    Abstract translation: 超声换能器模块可以包括:超声波换能器,包括基底,与基底分离的薄膜,支撑薄膜的支撑部分和在基底上的第一电极垫; 和/或电路板,包括主体,用于容纳薄膜的主体中的开口,以及附接到第一电极焊盘的第二电极焊盘。 超声换能器可以包括:基底; 在所述基板上的多个第一电极层,在所述第一电极层之间具有空间; 在所述基板和所述第一电极层之间的绝缘层; 第一电极层上的支撑部分; 由所述支撑部支撑的薄膜,在所述第一电极层和所述薄膜中的每一个之间具有空腔; 和/或薄膜上的第二电极层。

    ULTRASONIC TRANSDUCERS
    40.
    发明申请
    ULTRASONIC TRANSDUCERS 审中-公开
    超声波传感器

    公开(公告)号:US20160051225A1

    公开(公告)日:2016-02-25

    申请号:US14660167

    申请日:2015-03-17

    Abstract: An ultrasonic transducer may comprise: a substrate; a barrier wall on the substrate; a diaphragm fixed to the barrier wall and defining a cavity, together with the barrier wall and the substrate; a pair of electrodes, facing each other with the cavity therebetween, configured to receive a driving voltage for driving the diaphragm; and/or a plurality of posts in the cavity and having a height smaller than that of the barrier wall.

    Abstract translation: 超声换能器可以包括:基底; 衬底上的阻挡壁; 隔膜固定到阻挡壁并与阻挡壁和基底一起限定空腔; 一对彼此面对的电极,被配置为接收用于驱动隔膜的驱动电压; 和/或所述腔中的多个柱,并且具有比所述阻挡壁的高度更小的高度。

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