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公开(公告)号：US20230402435A1
公开(公告)日：2023-12-14
申请号：US18234798
申请日：2023-08-16
Applicant: Samsung Electronics Co., Ltd
Inventor： Seogwoo HONG , Junsik Hwang , Kyungwook Hwang
IPC: H01L25/075 , H01L27/12 , H01L33/50 , H01L33/62
CPC classification number: H01L25/0753 , H01L27/1214 , H01L33/50 , H01L33/62 , H01L2933/0066
Abstract: The present disclosure provides a micro-light-emitting diode display apparatus and a method of manufacturing the same. Provided is a micro-light-emitting diode (LED) display apparatus including a plurality of pixels, the micro-LED display apparatus including a driving circuit substrate, a first electrode provided on the driving circuit substrate, one or more microlight-emitting diodes (LEDs) provided on the first electrode, an insulating layer provided on the one or more micro-LEDs, a via pattern provided in the insulating layer, electrical contacts provided in the via pattern, and a second electrode provided on the electrical contacts, wherein the via pattern exposes a portion of the one or more micro-LEDs.
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公开(公告)号：US20220246801A1
公开(公告)日：2022-08-04
申请号：US17519754
申请日：2021-11-05
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Seogwoo HONG , Hyunjoon KIM , Joonyong PARK , Kyungwook HWANG , Junsik HWANG
Abstract: Provided is a light-emitting device including a body including a first semiconductor layer, an active layer, and a second semiconductor layer, a first electrode and a second electrode provided on a first surface of the body, the first electrode and the second electrode being in contact with the first semiconductor layer and the second semiconductor layer, respectively, and a third electrode and a fourth electrode provided on a second surface of the body, the third electrode and the fourth electrode being in contact with the first semiconductor layer and the second semiconductor layer, respectively.
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公开(公告)号：US20200050815A1
公开(公告)日：2020-02-13
申请号：US16398543
申请日：2019-04-30
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Seogwoo HONG , Jinmyoung KIM
Abstract: A touch-fingerprint complex sensor is provided for detecting a touch and a fingerprint of a user, using a touch pad including a touch region and a fingerprint recognizing region. The touch-fingerprint complex sensor includes a plurality of first electrodes disposed on a substrate, and arranged in parallel in a first direction, a plurality of second electrodes disposed on the substrate, and arranged in parallel in a second direction crossing the first direction, and an insulating layer disposed between the plurality of first electrodes and the plurality of second electrodes. A cross-sectional distance between the plurality of first electrodes and the plurality of second electrodes at intersections of the plurality of first electrodes and the plurality of second electrodes in the touch region excluding the fingerprint recognizing region is greater than that at intersections of the plurality of first electrodes and the plurality of second electrodes in the fingerprint recognizing region.
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公开(公告)号：US20190042021A1
公开(公告)日：2019-02-07
申请号：US15971030
申请日：2018-05-04
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Seogwoo HONG , Jinmyoung KIM
Abstract: Provided are a transparent fingerprint recognition sensor and a touch screen device including the transparent fingerprint recognition sensor. The transparent fingerprint recognition sensor includes: a substrate; a plurality of first electrodes disposed on the substrate in a sensing area; an insulating layer disposed on the substrate and covering the plurality of first electrodes; a plurality of second electrodes disposed within the insulating layer in the sensing area; a plurality of first signal lines disposed within the insulating layer in the bezel area; and a plurality of second signal lines disposed on a top surface of the insulating layer, in the bezel area.
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5.发明申请公开(公告)号：US20170212359A1
公开(公告)日：2017-07-27
申请号：US15269136
申请日：2016-09-19
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Hyunjoon KIM , Joonyong PARK , Bongsu SHIN , Dongouk KIM , Jihyun BAE , Dongsik SHIM , SungHoon LEE , Jaeseung CHUNG , Seogwoo HONG
CPC classification number: G02B27/2214 , G02B6/005 , G03H1/0808 , G03H1/2294 , G03H2210/30 , G03H2226/02 , G06F17/142 , H04N13/31 , H04N13/32 , H04N13/351 , H04N13/356 , H04N13/366
Abstract: A directional backlight unit, a three-dimensional (3D) image display apparatus, and a 3D image displaying method are provided. The directional backlight unit includes a light guide plate having an emission surface on which a plurality of grating elements including first and second groups of grating elements are provided. The plurality of grating elements are arranged such that light beams emitted from the first and second groups of grating elements commonly propagate through a plurality of pixel points and respectively form first and second groups of view points of which corresponding regions do not overlap with each other.
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Patent Agency Ranking
6.发明申请公开(公告)号：US20170059761A1
公开(公告)日：2017-03-02
申请号：US15090959
申请日：2016-04-05
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Dongsik SHIM , Hongseok LEE , Seogwoo HONG , Changsoo LEE , Hyunjoon KIM , Bongsu SHIN
CPC classification number: G02B6/005 , G02B6/0051 , G02B6/0053 , G02B6/0055 , G02B27/22
Abstract: A backlight unit using a micro optical switch and a three-dimensional (3D) image display device are provided. The backlight unit includes a light source configured to irradiate light, a light guide plate configured to guide the irradiated light, an optical switch array including micro optical switches disposed above the light guide plate for each of cells of the backlight unit, and a lens array disposed above and corresponding to the optical switch array. Each of the micro optical switches includes a substrate, a first electrode layer disposed on the substrate and including first holes, and a second electrode layer spaced apart from the first electrode layer and including second holes not facing the first holes.
Abstract translation: 提供了使用微型光学开关和三维（3D）图像显示装置的背光单元。 背光单元包括被配置为照射光的光源，被配置为引导照射的光的导光板，包括设置在导光板上方的微型光开关的光开关阵列，用于背光单元的每个单元，以及透镜阵列 设置在光开关阵列上方并对应于光开关阵列。 每个微型光学开关包括基板，设置在基板上并包括第一孔的第一电极层和与第一电极层间隔开的第二电极层，并且包括不面向第一孔的第二孔。
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7.发明申请公开(公告)号：US20160016197A1
公开(公告)日：2016-01-21
申请号：US14665555
申请日：2015-03-23
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Dongsik SHIM , Seogwoo HONG , Seokwhan CHUNG
IPC: B06B1/02
CPC classification number: B06B1/0292 , H01L2224/48091 , H01L2924/00014
Abstract: Provided are capacitive micromachined ultrasonic transducer (CMUT) modules. A CMUT module includes a CMUT chip which includes a plurality of first electrode pads on a first surface thereof; a flexible printed circuit (FPC) which is disposed on the first surface of the CMUT chip, the FPC including a plurality of first holes which are configured to expose the plurality of first electrode pads; a plurality of second electrode pads formed on the FPC so as to correspond to the plurality of first electrode pads; and a plurality of wires which connect each respective one of the plurality of first electrode pads to the corresponding one of the plurality of second electrode pads.
Abstract translation: 提供电容微加工超声波换能器（CMUT）模块。 CMUT模块包括CMUT芯片，其在其第一表面上包括多个第一电极焊盘; 柔性印刷电路（FPC），其设置在所述CMUT芯片的所述第一表面上，所述FPC包括被配置为暴露所述多个第一电极焊盘的多个第一孔; 多个第二电极焊盘，形成在所述FPC上，以对应于所述多个第一电极焊盘; 以及将多个第一电极焊盘中的每一个连接到多个第二电极焊盘中的相应一个的多条电线。
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公开(公告)号：US20250105093A1
公开(公告)日：2025-03-27
申请号：US18616721
申请日：2024-03-26
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Daehyuk SON , Sungchan KANG , Dongkyun KIM , Hotaik LEE , Seogwoo HONG
IPC: H01L23/427
Abstract: A semiconductor device may include: a semiconductor chip may include a heat radiation part; a pressure chamber formed on the heat radiation part, wherein the pressure chamber is configured to contain coolant such that an internal pressure in the pressure chamber increases as the coolant absorbs heat from the heat radiation part, and the coolant is ejected in a first direction away from the heat radiation part as the internal pressure of the pressure chamber increases; and a cooling channel providing a flow path configured such that the coolant ejected from the pressure chamber flows through the flow path and back into the pressure chamber.
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公开(公告)号：US20240203821A1
公开(公告)日：2024-06-20
申请号：US18202613
申请日：2023-05-26
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Sungchan KANG , Daehyuk SON , Seogwoo HONG
IPC: H01L23/427 , H01L25/065
CPC classification number: H01L23/427 , H01L25/0657 , H01L24/16
Abstract: A semiconductor device includes a semiconductor chip including a semiconductor integrated circuit, and a cooling channel including at least a first portion that is inside the semiconductor chip, a wall surface including a fine pattern configured to generate a capillary force that causes a liquid coolant to flow in the cooling channel, a liquid channel area in a first area of the cooling channel where the fine pattern is formed and configured to pass the liquid coolant, and a gas channel area in a second area of the cooling channel where the fine pattern is not formed and configured to pass a gaseous coolant.
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公开(公告)号：US20240006563A1
公开(公告)日：2024-01-04
申请号：US18084186
申请日：2022-12-19
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Hyunjoon KIM , Seogwoo HONG , Dongkyun KIM , Dongho KIM , Joonyong Park , Sanghoon SONG , Kyungwook Hwang , Junsik HWANG
IPC: H01L33/48 , H01L33/62 , H01L25/075
CPC classification number: H01L33/486 , H01L33/62 , H01L25/0753 , H01L2933/0066
Abstract: Disclosed are a method of transferring semiconductor chips. The method may include providing a first substrate, adhering a support substrate to the first substrate, supplying and aligning a plurality of semiconductor chips, partially adhering a second substrate to a first surface of the first substrate, separating the support substrate from the first substrate, and adhering the plurality of semiconductor chips to the second substrate by supplying a fluid to a periphery of a second surface of the first substrate and applying a pressure to the second surface.
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