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公开(公告)号：US11318465B2
公开(公告)日：2022-05-03
申请号：US16438796
申请日：2019-06-12
Applicant: Shanghai Tianma Micro-Electronics Co.,Ltd.
Inventor： Baiquan Lin , Kerui Xi , Junting Ouyang , Jinyu Li , Xiaohe Li
IPC: B01L3/00 , B01F33/3031
Abstract: An electrowetting panel includes a base substrate; an electrode array layer, including a plurality of electrodes arranged into an array; an insulating hydrophobic layer; a microfluidic channel layer located on the base substrate. Each electrode of the plurality of electrodes is connected to a driving circuit, and a droplet can move along a first direction by applying an electric voltage on each electrode. The insulating hydrophobic layer is located on the electrode array layer, and the microfluidic channel layer is located on the insulating hydrophobic layer. The electrodes includes a plurality of driving electrodes and a plurality of detecting electrodes. Along the first direction, a number N of the driving electrodes is located between every two adjacent detecting electrodes, where N is a natural number. The electrowetting panel also includes a detecting chip electrically connected to the detecting electrodes.
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公开(公告)号：US20220077596A1
公开(公告)日：2022-03-10
申请号：US17530425
申请日：2021-11-18
Inventor： Kerui Xi , Xuhui Peng , Feng Qin , Tingting Cui , Zhenyu Jia
Abstract: Disclosed antenna unit includes first substrate and second substrate opposite to each other, phase shifting units and driver circuit. Region facing the first substrate and the second substrate form phase shifting region. In first direction, the first substrate formed with first step region, and used for connecting radio-frequency signal terminal; in second direction, the second substrate formed with second step region, and included angle between the first direction and the second direction greater than or equal to 0° and smaller than 180°. At least part of the first step region does not overlap at least part of the second step region. Phase shifting units used for radiating radio-frequency signal and distributed in phase shifting region, each phase shifting unit. At least part of the driver circuit disposed in the second step region and the driver circuit electrically connected to each phase shifting unit to adjust radio-frequency signal.
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公开(公告)号：US20210351150A1
公开(公告)日：2021-11-11
申请号：US16917155
申请日：2020-06-30
Inventor： Feng Qin , Kerui Xi , Tingting Cui , Jie Zhang , Xuhui Peng
Abstract: Provided are a semiconductor package and a method for fabricating the semiconductor package. The method includes followings steps: a first workpiece is provided, where the first workpiece includes a first substrate and multiple first rewiring structures arranged on the first substrate at intervals, and each first rewiring structure includes at least two first rewiring layers; an encapsulation layer is formed on the first rewiring structures, where the encapsulation layer is provided with multiple first through holes, and the first through holes exposes one first rewiring layer; at least two second rewiring layers are disposed on a side of the encapsulation layer facing away from the first rewiring layer; multiple semiconductor elements are provided, where the semiconductor elements are arranged on a side of the first rewiring structures facing away from the encapsulation layer, where the first rewiring layers are electrically connected to pins of the semiconductor elements.
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34.发明授权公开(公告)号：US10650716B2
公开(公告)日：2020-05-12
申请号：US15826176
申请日：2017-11-29
Applicant: Shanghai Tianma Micro-Electronics Co., Ltd.
Abstract: A gate shift register unit comprises an activation signal terminal, a deactivation signal terminal, a reset signal terminal, a first level signal terminal, a second level signal terminal, a first control terminal, a first clock signal terminal, a second clock signal terminal, an output terminal, a first node, a second node, a first node control unit, a second node control unit, a reset unit, and an output unit. The first node control unit is connected to the first control terminal, the activation signal terminal, the first level signal terminal, the second level signal terminal, the deactivation signal terminal, the first node, and the second node, and configured to transfer a signal at the first level signal terminal or the second level signal terminal to the first node under a control of potential signals at the activation signal terminal, the deactivation signal terminal, the first control terminal, and the second node.
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35.发明申请公开(公告)号：US20190392771A1
公开(公告)日：2019-12-26
申请号：US16188528
申请日：2018-11-13
Applicant: Shanghai Tianma Micro-Electronics Co., Ltd.
Inventor： Zuzhao Xu , Kerui Xi , Baiquan Lin , Xiaohe Li , Jine Liu , Feng Qin , Qiongqin Mao , Tinghai Wang , Mingwei Zhang
IPC: G09G3/34
Abstract: Provided are an array substrate, an electronic paper display panel and a drive method thereof and a display device. A display area includes a plurality of sub-display areas, a plurality of data lines in each sub-display area are electrically insulated from each other, corresponding data lines in different sub-display areas are electrically connected to each other, and a control signal line is configured to control display time of each sub-display area. When a control chip and a flexible circuit board are employed, only a small number of control chips and flexible circuit boards may drive the plurality of sub-display areas to display pictures.
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Patent Agency Ranking
公开(公告)号：US12211460B2
公开(公告)日：2025-01-28
申请号：US18408053
申请日：2024-01-09
Applicant: Shanghai Tianma Micro-Electronics Co., Ltd.
Inventor： Haotian Lu , Linzhi Wang , Baiquan Lin , Zhen Liu , Kerui Xi , Kaidi Zhang , Yifan Xing , Xin Xu , Huijun Jin
IPC: G09G5/00 , G02F1/167 , G02F1/1685 , G09G3/34
Abstract: Provided are a driver board, a display panel, and a display apparatus. The driver board includes a driver circuit. The driver circuit includes N pixel electrodes, N pixel switches, a data switch, and a storage capacitor, N is a positive integer, and N≥2. The storage capacitor includes a reference electrode and a counter electrode. A control terminal of the pixel switch receives a gating signal, a first terminal of the pixel switch is connected to the counter electrode, and a second terminal of the pixel switch is connected to the pixel electrode. The driver board further includes data lines, and each data line is connected to the counter electrode via the data switch.
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公开(公告)号：US12160051B2
公开(公告)日：2024-12-03
申请号：US17790712
申请日：2020-10-30
Applicant: Shanghai Tianma Micro-Electronics Co., Ltd.
Inventor： Zhenyu Jia , Kerui Xi , Baiquan Lin , Xuhui Peng
Abstract: A liquid crystal antenna is described. The liquid crystal antenna includes liquid crystal phase shifter units arranged in an array; a first feeding network line corresponding to an ith scanning line and extending along a first direction, and/or, a second feeding network line corresponding to an jth data line and extending along a second direction. The first feeding network line is provided between the ith scanning line and an (i+1)th scanning line, and a scanning line protrusion protrudes toward a side facing away from the first feeding network line corresponding to the ith scanning line. The second feeding network line is provided between the jth data line and a (j+1)th data line, and a data line protrusion protrudes toward a side facing away from the second feeding network line corresponding to the jth data line.
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公开(公告)号：US11929313B2
公开(公告)日：2024-03-12
申请号：US17532248
申请日：2021-11-22
Applicant: Shanghai Tianma Micro-Electronics Co., Ltd.
Inventor： Mingyu Wang , Kerui Xi , Xuhui Peng , Feng Qin , Jie Zhang
CPC classification number: H01L23/49816 , H01L23/15 , H01L23/32 , H01L23/49838 , H01L24/16 , H01L24/73 , H01L24/81 , H01L31/02002 , H04N23/54 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204
Abstract: A chip package structure, manufacturing method thereof, and module are described. In an embodiment, the chip package structure includes: a substrate, a wiring layer, a chip, and a second conductive bump, wherein, in an embodiment, the substrate includes a first region and a second region surrounding the first region, and the wiring layer is located on side of the substrate and includes metal wire, wherein at least part of a metal wire is in contact with the substrate in direction perpendicular to the substrate, and the metal wire overlaps with the second region, wherein the chip is located on side of the wiring layer facing away from the substrate, and the chip corresponds to the first region. In an embodiment, a first conductive bump is provided on side of the chip facing away from the substrate and is electrically connected to the metal wire.
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公开(公告)号：US11909118B2
公开(公告)日：2024-02-20
申请号：US17547647
申请日：2021-12-10
Applicant: Shanghai Tianma Micro-Electronics Co., Ltd.
Inventor： Zhenyu Jia , Kerui Xi , Baiquan Lin , Linzhi Wang , Qinyi Duan , Zuocai Yang , Feng Qin
CPC classification number: H01Q21/0075 , H01Q3/44 , H01Q9/0457 , H01Q21/0087 , H01Q21/065
Abstract: Provided is an antenna. The antenna includes a first metal electrode, a second metal electrode, and a dielectric functional layer. The first metal electrode and the second metal electrode are located on two opposite sides of the dielectric functional layer, respectively; and the first metal electrode includes a plurality of transmission electrodes. The antenna further includes a flexible coplanar waveguide and a feed network. The flexible coplanar waveguide is electrically connected to the feed network and configured to feed an electrical signal to the feed network.
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公开(公告)号：US11907491B2
公开(公告)日：2024-02-20
申请号：US17956663
申请日：2022-09-29
Applicant: Shanghai Tianma Micro-Electronics Co., Ltd.
Inventor： Shun Gong , Linzhi Wang , Kerui Xi , Jiansheng Zhong
CPC classification number: G06F3/0448 , G06F3/0443 , G06F3/0446 , G06V40/1306
Abstract: A sensing unit and a sensing device are provided. The sensing unit includes a substrate; a plurality of thin-film transistors and a plurality of sensing electrodes disposed on a side of the substrate; and a ring electrode disposed on a first electrode layer. The first electrode layer is located on a side of a thin-film transistor of the plurality of thin-film transistors away from the substrate. The plurality of sensing electrodes are disposed on the first electrode layer, and the ring electrode is disposed around the plurality of sensing electrodes.
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