公开(公告)号：US09006909B2

公开(公告)日：2015-04-14

申请号：US13733537

申请日：2013-01-03

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Chih-Horng Chang ,  Sheng-Yu Wu ,  Pei-Chun Tsai ,  Tin-Hao Kuo ,  Chen-Shien Chen

IPC: G03F1/00

CPC classification number: H05K3/3452 ,  H01L23/49827 ,  H01L23/49894 ,  H01L2224/16225 ,  H05K3/28 ,  H05K2201/10674 ,  H05K2203/0594 ,  Y10T428/24802

Abstract: A device is provided. The device may comprise an integrated circuit package. The integrated circuit package may comprise a first layer and a solder mask. The first layer may comprise a top surface wherein the solder mask is disposed on the top surface of the first layer. The solder mask may comprise a vertical edge. The vertical edge may form an angle between the top surface of the first layer and the vertical edge of not less than 90 degrees. The angle may be not less than 120 degrees or not less than 150 degrees.

Abstract translation: 提供了一种设备。 该装置可以包括集成电路封装。 集成电路封装可以包括第一层和焊接掩模。 第一层可以包括顶表面，其中焊料掩模设置在第一层的顶表面上。 焊接掩模可以包括垂直边缘。 垂直边缘可以在第一层的顶表面和垂直边缘之间形成不小于90度的角度。 该角度可以不小于120度或不小于150度。

公开(公告)号：US08823170B2

公开(公告)日：2014-09-02

申请号：US13706436

申请日：2012-12-06

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Sheng-Yu Wu ,  Pei-Chun Tsai ,  Chih-Horng Chang ,  Tin-Hao Kuo ,  Chen-Shien Chen

IPC: H01L23/48 ,  H01L21/50 ,  H01L23/498

CPC classification number: H01L21/50 ,  H01L23/49838 ,  H01L23/49894 ,  H01L2224/16

Abstract: A structure comprises a substrate comprising a plurality of traces on top of the substrate, a plurality of connectors formed on a top surface of a semiconductor die, wherein the semiconductor die is formed on the substrate and coupled to the substrate through the plurality of connectors and a dummy metal structure formed at a corner of a top surface of the substrate, wherein the dummy metal structure has two discontinuous sections.

Abstract translation: 一种结构包括：衬底，其包括在所述衬底的顶部上的多个迹线，形成在半导体管芯的顶表面上的多个连接器，其中所述半导体管芯形成在所述衬底上并通过所述多个连接器耦合到所述衬底;以及 形成在基板的顶面的角部的虚设金属结构，其中，所述虚设金属结构具有两个不连续部。

公开(公告)号：US20140186591A1

公开(公告)日：2014-07-03

申请号：US13733537

申请日：2013-01-03

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor： Chih-Horng Chang ,  Sheng-Yu Wu ,  Pei-Chun Tsai ,  Tin-Hao Kuo ,  Chen-Shien Chen

IPC: G03F1/00

CPC classification number: H05K3/3452 ,  H01L23/49827 ,  H01L23/49894 ,  H01L2224/16225 ,  H05K3/28 ,  H05K2201/10674 ,  H05K2203/0594 ,  Y10T428/24802

Abstract: A device is provided. The device may comprise an integrated circuit package. The integrated circuit package may comprise a first layer and a solder mask. The first layer may comprise a top surface wherein the solder mask is disposed on the top surface of the first layer. The solder mask may comprise a vertical edge. The vertical edge may form an angle between the top surface of the first layer and the vertical edge of not less than 90 degrees. The angle may be not less than 120 degrees or not less than 150 degrees.

Abstract translation: 提供了一种设备。 该装置可以包括集成电路封装。 集成电路封装可以包括第一层和焊接掩模。 第一层可以包括顶表面，其中焊料掩模设置在第一层的顶表面上。 焊接掩模可以包括垂直边缘。 垂直边缘可以在第一层的顶表面和垂直边缘之间形成不小于90度的角度。 该角度可以不小于120度或不小于150度。

公开(公告)号：US20140179062A1

公开(公告)日：2014-06-26

申请号：US14189584

申请日：2014-02-25

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Chih-Horng Chang ,  Tin-Hao Kuo ,  Tsung-Fu Tsai ,  Min-Feng Ku

IPC: H01L21/82

CPC classification number: H01L23/3121 ,  H01L21/304 ,  H01L21/56 ,  H01L21/561 ,  H01L21/565 ,  H01L21/78 ,  H01L21/82 ,  H01L23/293 ,  H01L23/3135 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/564 ,  H01L24/97 ,  H01L25/0657 ,  H01L2224/16225 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00

Abstract: A device includes a first package component, and a second package component underlying, and bonded to, the first package component. A molding material is disposed under the first package component and molded to the first and the second package components, wherein the molding material and the first package component form an interface. An isolation region includes a first edge, wherein the first edge of the isolation region contacts a first edge of the first package component and a first edge of the molding material. The isolation has a bottom lower than the interface.

Abstract translation: 一种装置包括第一包装部件和第二包装部件，所述第一包装部件和第二包装部件下面并结合到第一包装部件。 成型材料设置在第一包装部件下方并被模制到第一和第二包装部件上，其中成型材料和第一包装部件形成界面。 隔离区域包括第一边缘，其中隔离区域的第一边缘接触第一封装部件的第一边缘和模制材料的第一边缘。 隔离层的底部低于界面。