Abstract:
A pattern evaluation method includes: acquiring an image of a pattern to be evaluated, detecting edge points of the pattern from the image, creating a parameter curve having the detected edge points as control points thereof, and evaluating the pattern based on the created parameter curve.
Abstract:
The invention can be easily applied to various contacts irrespective of the length of time needed for replacing ICs with other ICs relative to the contact. An IC handler comprises contact cleaning chips made of a material including polishing particles in the same shape as an ICs wherein a transfer attachment is removed from the contacts when contact cleaning chips are conveyed to the contacts so as to contact the contacts, then the contacts are taken out.
Abstract:
In one embodiment, a pattern inspection method is disclosed. The method can include predicting an edge shape at a given future time with respect to the same inspection target pattern, setting a threshold corresponding to a required specification of the inspection target pattern, and predicting the time when the inspection target pattern fails to meet the required specification from the predicted edge shape and the threshold. The method can further include taking a plurality of images concerning the inspection target pattern at different times by use of an imaging apparatus, detecting edges of the obtained images, respectively, matching the detected edges of different imaging times, and obtaining a difference between corresponding edges to generate a difference vector after the matching. The edge shape of the future time can be predicted based on the generated difference vector and an interval between the imaging times.
Abstract:
The present invention provides a pattern shape evaluation method that can securely decide whether patterns are connected or disconnected and, further, evaluate a pattern shape qualitatively.The pattern shape evaluation method for deciding whether a pair of patterns are disconnected or connected, including: setting a measurement region in a predetermined region for an image data containing two patterns disconnected from each other or continuous one pattern; extracting a plurality of pattern contour points that make up a contour of the disconnected two patterns or the continuous one pattern in the measurement region; creating two pattern contour point sequences each of which is a set of the pattern contour points, in the pattern contour point sequence, each of distances between neighboring ones of the pattern contour points is a predetermined value or less, based on the plurality of pattern contour points; calculating an angle between a line passing through two of the pattern contour points which provide a shortest distance between the two pattern contour point sequences and a reference line arbitrarily defined with respect to the measurement region; and deciding whether the pair of patterns are disconnected or connected, based on the angle.
Abstract:
A pattern evaluation method includes: acquiring an image of a pattern to be evaluated, detecting edge points of the pattern from the image, creating a parameter curve having the detected edge points as control points thereof, and evaluating the pattern based on the created parameter curve.
Abstract:
A pattern shape evaluation method comprising detecting an edge of an evaluation target pattern from an image of the evaluation target pattern to output the edge as a first edge, detecting an edge of a reference pattern from an image of the reference pattern to output the edge as a second edge, performing a relative scan of the first edge and the second edge to superpose the first edge onto the second edge, and outputting a resulting edge as a third edge, calculating a characteristic amount indicating characteristics of the third edge from the third edge, and deriving a characteristic amount function which provides the characteristic amount against relative coordinates in the relative scan and comparing the characteristic amount function with a preset value to judge whether or not the evaluation target pattern is good.
Abstract:
An image processing apparatus which compresses an image, the apparatus includes: a storage unit which stores a code book, the code book being prepared by allocating identification codes to code blocks, the code blocks being formed by executing quantization processing regarding a plurality of first image blocks as multidimensional vectors, the plurality of first image blocks being generated by cutting, in preset sizes, first regions out of a code book preparation image containing a first edge, each of the first regions surrounding and including an edge point of the first edge, the first edge being detected from the code book preparation image; an edge detection unit which detects a second edge from a compression target image containing the second edge; an image block generation unit which cuts, in preset sizes, second regions out of the compression target image to generate a plurality of second image blocks, each of the second regions surrounding and including an edge point of the detected second edge; a search unit which searches the code book stored in the storage unit for code blocks similar to the second image blocks; and an output unit which outputs information on the identification codes of the similar code blocks which have been searched for and information on coordinates of the edge points of the second image blocks.
Abstract:
A pattern shape evaluation method includes acquiring an image of an evaluation target pattern including a plurality of element patterns; detecting edge of the evaluation target pattern from the image; classifying the detected edge of the evaluation target pattern into a plurality of evaluation target pattern edge groups; acquiring edge of a reference pattern serving as an evaluation standard for the element patterns; classifying the edge of the reference pattern into a plurality of reference pattern edge groups; selecting a reference pattern edge group to be aligned with the edge of the evaluation target pattern from the classified reference pattern edge groups; aligning the edge of the selected reference pattern edge group with the edge of the evaluation target pattern; and evaluating the shape of the evaluation target pattern by use of the result of the alignment.
Abstract:
A pattern shape evaluation method includes acquiring design data accompanied by an evaluation area in which information on a particular evaluation area within a pattern of a semiconductor device is added to the design data for the pattern, acquiring an image of the pattern, generating edge data for the pattern from the image of the pattern, aligning the design data accompanied by the evaluation area with the edge data and evaluating the shape of the pattern within the evaluation area after the alignment.
Abstract:
A pattern evaluation method includes processing image data of at least one pattern serving as an object to be evaluated and detecting coordinates of edge points of the pattern in an image of the image data, making pairs of edge points from the edge points of the pattern, setting an arbitrary axis, calculating a distances between the edge points of each pair of the pairs of edge points and an angle between a straight line connecting the edge points of the pair and the axis, preparing a distance/angle distribution map which represents distribution of the distances and angles of the pairs of edge points, extracting a characteristic point of the distance/angle distribution map and analyzing the pattern on the basis of the extracted characteristic point.