公开(公告)号：US09664999B2

公开(公告)日：2017-05-30

申请号：US15245499

申请日：2016-08-24

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chih-Tsung Shih ,  Tien-Hsi Lee ,  Chia-Jen Chen ,  Shang-Chieh Chien ,  Shinn-Sheng Yu ,  Jeng-Horng Chen ,  Anthony Yen

IPC: G03F1/64 ,  G03F1/62 ,  B29C71/02 ,  G03F7/20

CPC classification number: G03F1/64 ,  B29C71/02 ,  B29C2071/022 ,  G03F1/62 ,  G03F7/2002

Abstract: The present disclosure relates to an extreme ultraviolet (EUV) pellicle having a pellicle film connected to a pellicle frame. In some embodiments, the EUV pellicle has a substrate, and an adhesive material disposed onto the substrate. A pellicle frame is connected to the substrate by way of the adhesive material. The pellicle frame is configured to mount the substrate to an extreme ultraviolet (EUV) reticle.

公开(公告)号：US20160363857A1

公开(公告)日：2016-12-15

申请号：US15245499

申请日：2016-08-24

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chih-Tsung Shih ,  Tien-Hsi Lee ,  Chia-Jen Chen ,  Shang-Chieh Chien ,  Shinn-Sheng Yu ,  Jeng-Horng Chen ,  Anthony Yen

IPC: G03F1/64

CPC classification number: G03F1/64 ,  B29C71/02 ,  B29C2071/022 ,  G03F1/62 ,  G03F7/2002

Abstract: The present disclosure relates to an extreme ultraviolet (EUV) pellicle having a pellicle film connected to a pellicle frame. In some embodiments, the EUV pellicle has a substrate, and an adhesive material disposed onto the substrate. A pellicle frame is connected to the substrate by way of the adhesive material. The pellicle frame is configured to mount the substrate to an extreme ultraviolet (EUV) reticle.

Abstract translation: 本发明涉及一种具有与防护薄膜组件框架连接的防护薄膜的极紫外（EUV）防护薄膜组件。 在一些实施方案中，EUV防护薄膜具有基材和设置在基材上的粘合剂材料。 防护薄膜组件框架通过粘合剂材料连接到基底。 防护薄膜框架被配置为将基板安装到极紫外（EUV）掩模版上。

公开(公告)号：US09256123B2

公开(公告)日：2016-02-09

申请号：US14259194

申请日：2014-04-23

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chih-Tsung Shih ,  Tien-Hsi Lee ,  Chia-Jen Chen ,  Shang-Chieh Chien ,  Shinn-Sheng Yu ,  Jeng-Horng Chen ,  Anthony Yen

IPC: G03F1/64 ,  G03F7/20 ,  B29C71/02

CPC classification number: G03F1/64 ,  B29C71/02 ,  B29C2071/022 ,  G03F1/62 ,  G03F7/2002

Abstract: The present disclosure relates to a method of forming an EUV pellicle having an pellicle film connected to a pellicle frame without a supportive mesh, and an associated apparatus. In some embodiments, the method is performed by forming a cleaving plane within a substrate at a position parallel to a top surface of the substrate. A pellicle frame is attached to the top surface of the substrate. The substrate is cleaved along the cleaving plane to form a pellicle film comprising a thinned substrate coupled to the pellicle frame. Prior to cleaving the substrate, the substrate is operated upon to reduce structural damage to the top surface of substrate during formation of the cleaving plane and/or during cleaving the substrate. Reducing structural damage to the top surface of the substrate improves the durability of the thinned substrate and removes a need for a support structure for the pellicle film.

Abstract translation: 本发明涉及一种形成具有连接到没有支撑网的防护薄膜框架的防护薄膜组件的EUV防护薄膜组件的方法，以及相关联的装置。 在一些实施例中，该方法通过在平行于衬底顶表面的位置处在衬底内形成切割平面来进行。 防护薄膜组件框架附接到基板的顶表面。 基底沿着切割平面切割以形成防护薄膜，该薄膜包含连接到防护薄膜框架上的薄化基底。 在切割基板之前，操作基板以在形成切割平面期间和/或在分离基板期间减少对基板顶表面的结构损伤。 降低对基板顶表面的结构损伤提高了薄板基板的耐久性，并且消除了对防护薄膜的支撑结构的需要。