公开(公告)号：US09722103B2

公开(公告)日：2017-08-01

申请号：US14752830

申请日：2015-06-26

申请人： Richard Hamilton Sewell

发明人： Richard Hamilton Sewell

IPC分类号： H01L21/00 ,  H01L31/0224 ,  H01L31/18 ,  H01L31/05

CPC分类号： H01L31/022425 ,  H01L31/022441 ,  H01L31/0516 ,  H01L31/18 ,  Y02E10/50 ,  Y02P70/521

摘要： Thermal compression bonding approaches for foil-based metallization of solar cells, and the resulting solar cells, are described. For example, a method of fabricating a solar cell includes placing a metal foil over a metalized surface of a wafer of the solar cell. The method also includes locating the metal foil with the metalized surface of the wafer. The method also includes, subsequent to the locating, applying a force to the metal foil such that a shear force appears between the metal foil and the metallized surface of the wafer to electrically connect a substantial portion of the metal foil with the metalized surface of the wafer.

公开(公告)号：US09536632B2

公开(公告)日：2017-01-03

申请号：US14039837

申请日：2013-09-27

申请人： Richard Hamilton Sewell

发明人： Richard Hamilton Sewell

IPC分类号： H01L31/0224 ,  H01B1/02 ,  H01L31/068 ,  H01L31/0745

CPC分类号： H01B1/023 ,  H01B1/02 ,  H01L31/022441 ,  H01L31/0682 ,  H01L31/0745 ,  Y02E10/547

摘要： A solar cell can include a substrate and a semiconductor region disposed in or above the substrate. The solar cell can also include a conductive contact disposed on the semiconductor region with the conductive contact including deformed conductive particles.

摘要翻译： 太阳能电池可以包括基板和设置在基板中或上方的半导体区域。 太阳能电池还可以包括布置在半导体区域上的导电触点，导电触点包括变形的导电颗粒。

公开(公告)号：US20160380128A1

公开(公告)日：2016-12-29

申请号：US14752830

申请日：2015-06-26

申请人： Richard Hamilton Sewell

发明人： Richard Hamilton Sewell

IPC分类号： H01L31/0224 ,  H01L31/18

CPC分类号： H01L31/022425 ,  H01L31/022441 ,  H01L31/0516 ,  H01L31/18 ,  Y02E10/50 ,  Y02P70/521

摘要： Thermal compression bonding approaches for foil-based metallization of solar cells, and the resulting solar cells, are described. For example, a method of fabricating a solar cell includes placing a metal foil over a metalized surface of a wafer of the solar cell. The method also includes locating the metal foil with the metalized surface of the wafer. The method also includes, subsequent to the locating, applying a force to the metal foil such that a shear force appears between the metal foil and the metallized surface of the wafer to electrically connect a substantial portion of the metal foil with the metalized surface of the wafer.

摘要翻译： 描述了用于太阳能电池的箔基金属化的热压接方法，以及所得到的太阳能电池。 例如，制造太阳能电池的方法包括将金属箔放置在太阳能电池的晶片的金属化表面上。 该方法还包括将金属箔与晶片的金属化表面定位。 该方法还包括在定位之后，向金属箔施加力，使得在金属箔和晶片的金属化表面之间出现剪切力，以使金属箔的大部分与金属箔的金属化表面电连接 晶圆。

公开(公告)号：US20160276504A1

公开(公告)日：2016-09-22

申请号：US15170786

申请日：2016-06-01

申请人： Richard Hamilton Sewell ,  David Aaron Randolph Barkhouse ,  Junbo Wu ,  Michael Cudzinovic ,  Paul Loscutoff ,  Joseph Behnke ,  Michel Arsène Olivier Ngamo Toko

发明人： Richard Hamilton Sewell ,  David Aaron Randolph Barkhouse ,  Junbo Wu ,  Michael Cudzinovic ,  Paul Loscutoff ,  Joseph Behnke ,  Michel Arsène Olivier Ngamo Toko

IPC分类号： H01L31/0224 ,  H01L31/02

CPC分类号： H01L31/022441 ,  H01L31/02008 ,  H01L31/0682 ,  H01L31/0745 ,  Y02E10/547 ,  Y02P70/521

摘要： Approaches for the metallization of solar cells and the resulting solar cells are described. In an example, a method of fabricating a solar cell involves forming a barrier layer on a semiconductor region disposed in or above a substrate. The semiconductor region includes monocrystalline or polycrystalline silicon. The method also involves forming a conductive paste layer on the barrier layer. The method also involves forming a conductive layer from the conductive paste layer. The method also involves forming a contact structure for the semiconductor region of the solar cell, the contact structure including at least the conductive layer.

公开(公告)号：US20150318420A1

公开(公告)日：2015-11-05

申请号：US14266043

申请日：2014-04-30

申请人： Richard Hamilton Sewell ,  Michel Arsène Olivier Ngamo Toko ,  Matthieu Moors ,  Jens Dirk Moschner

发明人： Richard Hamilton Sewell ,  Michel Arsène Olivier Ngamo Toko ,  Matthieu Moors ,  Jens Dirk Moschner

IPC分类号： H01L31/0224 ,  B32B37/06 ,  B32B38/00 ,  H01L31/18

CPC分类号： H01L31/18 ,  B32B37/06 ,  B32B38/004 ,  B32B2307/202 ,  B32B2307/40 ,  B32B2310/028 ,  B32B2310/0418 ,  B32B2311/12 ,  B32B2311/24 ,  B32B2457/12 ,  H01L31/022433 ,  H01L31/022441 ,  Y02E10/50

摘要： A solar cell can include a substrate and a semiconductor region disposed in or above the substrate. The solar cell can also include a conductive contact disposed on the semiconductor region with the conductive contact including a conductive foil bonded to the semiconductor region.

摘要翻译： 太阳能电池可以包括基板和设置在基板中或上方的半导体区域。 太阳能电池还可以包括布置在半导体区域上的导电触点，导电触点包括结合到半导体区域的导电箔。