Abstract:
A gripper applied in a transport mechanism for transporting a wafer is provided. The transport mechanism includes a bar. The gripper includes a fixing member fixed to the bar, and a carrying member. The fixing member includes two grooves adjacent to the bottom of the fixing member. Each groove includes an entrance and a retaining portion. The carrying member includes a notch and a first claw. The notch is located at the top of the carrying member and communicates two opposite sides of the carrying member. The notch includes two inner walls, each having a protrusion. The carrying member is assembled to the fixing member by sliding each protrusion along one of the grooves from the corresponding entrance and until abutting against the corresponding retaining portion. The first claw is located at a first sidewall of the carrying member. The edge of the wafer is supportable by the first claw.
Abstract:
A locking mechanism for a glider rocker having a gliding chair seat mounted on a stationary base, including an operating assembly mounted on the gliding chair seat, a pair of bearing brackets mounted on the stationary base respectively, and a pair of mounting assemblies. Each mounting assembly includes a prop, a strut, a curved elongated member, a mounting bracket, and a restoring spring connected with the curved elongated member and the prop.
Abstract:
A power control unit of a display apparatus includes an AC-to-DC converter for receiving an external AC power. A regulator receives a DC output from the converter, and is operable in one of an enabled state of outputting a target DC power when receiving a first level signal, and a disabled state of not outputting the target DC power when receiving a second level signal. An electronic switch is operable for switching from an OFF-mode, where a processor permits a delay circuit to output the second level signal to the regulator, to an ON-mode, where the electronic switch initially enables the delay circuit to output the first level signal to the regulator such that the processor receives the target DC power from the regulator and where the electronic switch outputs a trigger signal to the processor so as to enable the processor to latch the first level signal and to provide the target DC power to a display module.
Abstract:
A shallow trench isolation (STI) structure and fabricating method thereof is provided. A substrate is provided. A patterned mask layer is formed over the substrate. Using the patterned mask layer as an etching mask, the substrate is patterned to form a trench. A nitridation process is performed to form a silicon nitride liner on the surface of the trench. An insulating material is deposited to fill the trench. Since the silicon nitride liner within the STI is very thin, residual stress within the substrate is reduced, and the silicon nitride liner has very little or negligible impact on the trench aspect ratio.
Abstract:
A USB interface flash memory card reader is attached with a built-in flash memory so that the card reader itself provides a function of data storage in addition to a function of reading data in a flash memory card or writing data into the flash memory card.
Abstract:
A method of manufacturing a low-leakage, high-performance device. A substrate having a gate electrode thereon is provided. A lightly doped, high-energy implantation is conducted to form a lightly doped source/drain terminal in the substrate. An offset spacer is formed on each sidewall of the gate electrode. A heavily doped implantation is conducted to form a heavily doped source/drain terminal in the substrate. The heavily doped source/drain terminal has a depth smaller than the lightly doped source/drain terminal. A protective spacer structure is formed on each sidewall of the gate electrode. A deep-penetration source/drain implantation is carried out to form a deep source/drain terminal in the substrate.
Abstract:
A method for forming a gate that improves the quality of the gate includes sequentially forming a gate oxide layer, a polysilicon layer, a conductive layer and a masking layer on a substrate. Thereafter, the masking layer, the conductive layer, the polysilicon layer and the gate oxide layer are patterned to form the gate. Then, a passivation layer, for increasing the thermal stability and the chemical stability of the gate, is formed on the sidewall of the conductive layer by ion implantation with nitrogen cations. The nitrogen cations are doped into the substrate, under the gate oxide layer, by ion implantation, which can improve the penetration of the phosphorus ions.
Abstract:
A method for forming an amorphous silicon layer over the terminals of a MOS transistor. The method includes the steps of forming a mask layer having an opening that exposes the gate polysilicon layer over the MOS transistor. Next, using the mask layer as a mask, an inactive ion implant operation is carried out such that inactive ions are implanted into the gate polysilicon layer. Thereafter, again using the mask layer as a mask, a first heavy bombarding operation is carried out, implanting ions locally. Finally, the mask layer is removed and then a second heavy bombarding operation is carried out, implanting ions globally.
Abstract:
A new improvement for selective epitaxial growth is disclosed. In one embodiment, the present invention provides a low power metal oxide semiconductor field effect transistor (MOSFET), which includes a substrate. Next, a gate oxide layer is formed on the substrate. Moreover, a polysilicon layer is deposited on the gate oxide layer. Patterning to etch the polysilicon layer and the gate oxide layer to define a gate. First ions are implanted into the substrate by using said gate as a hard mask. Sequentially, a liner oxide is covered over the entire exposed surface of the resulting structure. Moreover, a conformal first dielectric layer and second dielectric layer are deposited above the liner oxide in proper order. The second dielectric layer is etched back to form a dielectric spacer on sidewall of the first dielectric layer. Next, the first dielectric layer is etched until upper surface of the gate and a portion of the substrate are exposed, wherein a part of the second dielectric layer is also etched accompanying with etching a part of the first dielectric layer. Further, second ions are implanted into the exposed substrate to form a source/drain region. A conductive layer is selectively formed on said over the exposed gate and source/drain. Finally, a self-aligned silicide layer is formed over the conductive layer.