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公开(公告)号：USD684621S1
公开(公告)日：2013-06-18
申请号：US29406799
申请日：2011-11-18
申请人： Kazuya Inoue , Toshiyuki Yamaguchi , Akira Oda , Takuji Katsutani
设计人： Kazuya Inoue , Toshiyuki Yamaguchi , Akira Oda , Takuji Katsutani
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公开(公告)号：USD677307S1
公开(公告)日：2013-03-05
申请号：US29406822
申请日：2011-11-18
申请人： Kazuya Inoue , Toshiyuki Yamaguchi , Akira Oda , Takuji Katsutani
设计人： Kazuya Inoue , Toshiyuki Yamaguchi , Akira Oda , Takuji Katsutani
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公开(公告)号：USD677306S1
公开(公告)日：2013-03-05
申请号：US29406817
申请日：2011-11-18
申请人： Kazuya Inoue , Toshiyuki Yamaguchi , Akira Oda , Takuji Katsutani
设计人： Kazuya Inoue , Toshiyuki Yamaguchi , Akira Oda , Takuji Katsutani
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公开(公告)号：USD677304S1
公开(公告)日：2013-03-05
申请号：US29406790
申请日：2011-11-18
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公开(公告)号：USD667864S1
公开(公告)日：2012-09-25
申请号：US29389717
申请日：2011-04-15
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公开(公告)号：USD667480S1
公开(公告)日：2012-09-18
申请号：US29389774
申请日：2011-04-15
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公开(公告)号：USD572744S1
公开(公告)日：2008-07-08
申请号：US29285373
申请日：2007-03-28
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公开(公告)号：US06592410B2
公开(公告)日：2003-07-15
申请号：US10075563
申请日：2002-02-15
IPC分类号： H01R13502
CPC分类号： H01R13/506 , H01R13/432 , Y10S439/908
摘要： A bus bar is constituted by integrally forming pairs of terminal contact pieces, each pair of which is in contact with an opposed terminal, a pair of connecting base portions, which integrally connect the base-side portions of the terminal contact pieces arranged on the same side thereof, and connecting pieces for connecting the pair of connecting base portions. This bus bar is integrally coupled to a bus bar fixing member constituted by an insulating member. An arbitrary circuit including so-called a skip connection can be constructed by suitably cutting the connecting base portions and the connecting piece. Thus, the entire circuit forming element is constituted as one component.
摘要翻译： 汇流条通过一体地形成成对的一对端子接触片而构成，每对端子接触片与相对的端子相接触，一对连接基座部分一体地连接布置在其上的端子接触片的基部侧部分 以及用于连接该对连接基部的连接片。 该母线与由绝缘构件构成的汇流条固定构件一体地联接。 可以通过适当地切割连接基部和连接件来构成包括所谓的跳过连接的任意电路。 因此，整个电路形成元件被构成为一个部件。
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公开(公告)号：US6065369A
公开(公告)日：2000-05-23
申请号：US245724
申请日：1999-02-08
IPC分类号： F16H57/027 , F16H57/02
CPC分类号： F16H57/027 , Y10T74/2186
摘要： In an air breather structure in a transmission, a partition wall 2 defining an air breather chamber S extends substantially vertically downward in a curved configuration at a distance from a corner portion 1a of a transmission case to increase volume of the air breather chamber S. An oil entrance 4 is formed in an upper portion of the partition wall 2. An oil exit 5 wider than the oil entrance 4 is formed in a lower end portion of the partition wall 2 for discharging oil which enters the air breather chamber S. The oil exit 5 is formed between a lower end of the partition wall 2 and an oil-returning rib 6 projecting from the transmission case for preventing the oil from flowing upward into the air breather chamber S. With this construction, the air breather structure becomes free from "blow of oil".
摘要翻译： 在变速器中的空气通气结构中，限定空气通气室S的分隔壁2以与变速箱的角部1a相距一定距离的弯曲构造大致垂直向下延伸，以增加空气通气室S的体积。 油入口4形成在分隔壁2的上部。在分隔壁2的下端部形成有比油入口4宽的油出口5，用于排出进入通气室S的油。油 出口5形成在分隔壁2的下端和从变速箱突出的止油肋6之间，用于防止油向上流入空气通气室S.通过这种结构，空气通气结构变得没有 “油炸”。
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40.发明授权Process of fabrication IC chip package from an IC chip carrier substrate and a leadframe and the IC chip package fabricated thereby 失效从IC芯片载体基板和引线框架制造IC芯片封装的工艺和由此制造的IC芯片封装
公开(公告)号：US5403785A
公开(公告)日：1995-04-04
申请号：US63059
申请日：1993-05-19
申请人： Hitoshi Arai , Syuichi Furuichi , Toshiyuki Yamaguchi , Takeshi Kanou , Tooru Higuchi , Muneo Yamada , Toshimasa Kitagawa , Takashi Sugimoto
发明人： Hitoshi Arai , Syuichi Furuichi , Toshiyuki Yamaguchi , Takeshi Kanou , Tooru Higuchi , Muneo Yamada , Toshimasa Kitagawa , Takashi Sugimoto
IPC分类号： H01L21/607 , H01L23/495 , H05K3/32 , H05K3/40 , H01L21/60
CPC分类号： H01L24/86 , H01L23/49506 , H01L23/49531 , H01L23/49541 , H01L23/49548 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L24/48 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , H01L2924/181 , H05K3/328 , H05K3/403 , Y10T29/49121
摘要： An IC chip package is fabricated from a substrate carrying an IC chip and formed with a conductive pattern of conductors for electrical connection to the IC chip, and a leadframe having a plurality of connector leads with inner and outer lead sites for electrical connection with associated ones of the conductors and with an external circuit, respectively. Fabrication of the IC chip package is made through the steps of placing the inner lead sites into intimate contact on distal ends of the corresponding conductors, and applying ultrasonic vibrations to contacting surfaces between the inner lead sites and the conductors so as to effect diffusion bonding therebetween. For applying the ultrasonic vibrations, a horn is pressed against the inner lead sites of the connector leads in such a manner as to leave indents in the inner lead sites which act to anchor an encapsulating plastic at the time of encapsulating the IC chip, the substrate, and most of the leadframe, for obtaining tight grip between the encapsulating plastic and the connector leads. At least one of the inner lead site and the distal end of the corresponding conductor may be provided with a suitable plating or bump for facilitating the diffusion bonding.
摘要翻译： IC芯片封装由承载IC芯片的基板制成，并形成有用于与IC芯片电连接的导体图案，以及具有多个连接器引线的引线框架，其具有用于与相关联的电连接的内部和外部引线位置 的导体和外部电路。 通过将内部引线部位紧密接触在相应导体的远端上并对内部引线部位和导体之间的接触表面施加超声波振动以便在其间进行扩散接合的步骤来制造IC芯片封装 。 为了施加超声波振动，喇叭以这样的方式被压靠在连接器引线的内部引线部位上，以便在封装IC芯片时衬底内部引线位置留下凹槽，该内部引线位置用于锚固封装塑料，衬底 和大多数引线框架，用于在封装塑料和连接器引线之间获得紧密的握持。 相应导体的内引线部分和远端中的至少一个可以设置有用于促进扩散接合的合适的电镀或凸块。
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