公开(公告)号：US5403785A

公开(公告)日：1995-04-04

申请号：US63059

申请日：1993-05-19

申请人： Hitoshi Arai ,  Syuichi Furuichi ,  Toshiyuki Yamaguchi ,  Takeshi Kanou ,  Tooru Higuchi ,  Muneo Yamada ,  Toshimasa Kitagawa ,  Takashi Sugimoto

发明人： Hitoshi Arai ,  Syuichi Furuichi ,  Toshiyuki Yamaguchi ,  Takeshi Kanou ,  Tooru Higuchi ,  Muneo Yamada ,  Toshimasa Kitagawa ,  Takashi Sugimoto

IPC分类号： H01L21/607 ,  H01L23/495 ,  H05K3/32 ,  H05K3/40 ,  H01L21/60

CPC分类号： H01L24/86 ,  H01L23/49506 ,  H01L23/49531 ,  H01L23/49541 ,  H01L23/49548 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/181 ,  H05K3/328 ,  H05K3/403 ,  Y10T29/49121

摘要： An IC chip package is fabricated from a substrate carrying an IC chip and formed with a conductive pattern of conductors for electrical connection to the IC chip, and a leadframe having a plurality of connector leads with inner and outer lead sites for electrical connection with associated ones of the conductors and with an external circuit, respectively. Fabrication of the IC chip package is made through the steps of placing the inner lead sites into intimate contact on distal ends of the corresponding conductors, and applying ultrasonic vibrations to contacting surfaces between the inner lead sites and the conductors so as to effect diffusion bonding therebetween. For applying the ultrasonic vibrations, a horn is pressed against the inner lead sites of the connector leads in such a manner as to leave indents in the inner lead sites which act to anchor an encapsulating plastic at the time of encapsulating the IC chip, the substrate, and most of the leadframe, for obtaining tight grip between the encapsulating plastic and the connector leads. At least one of the inner lead site and the distal end of the corresponding conductor may be provided with a suitable plating or bump for facilitating the diffusion bonding.

摘要翻译： IC芯片封装由承载IC芯片的基板制成，并形成有用于与IC芯片电连接的导体图案，以及具有多个连接器引线的引线框架，其具有用于与相关联的电连接的内部和外部引线位置 的导体和外部电路。 通过将内部引线部位紧密接触在相应导体的远端上并对内部引线部位和导体之间的接触表面施加超声波振动以便在其间进行扩散接合的步骤来制造IC芯片封装 。 为了施加超声波振动，喇叭以这样的方式被压靠在连接器引线的内部引线部位上，以便在封装IC芯片时衬底内部引线位置留下凹槽，该内部引线位置用于锚固封装塑料，衬底 和大多数引线框架，用于在封装塑料和连接器引线之间获得紧密的握持。 相应导体的内引线部分和远端中的至少一个可以设置有用于促进扩散接合的合适的电镀或凸块。

公开(公告)号：US4835598A

公开(公告)日：1989-05-30

申请号：US52182

申请日：1987-05-14

申请人： Tooru Higuchi ,  Tosiyuki Yamaguchi ,  Takeshi Kanou

发明人： Tooru Higuchi ,  Tosiyuki Yamaguchi ,  Takeshi Kanou

IPC分类号： H01L23/14 ,  H01L23/36 ,  H01L23/498 ,  H05K1/02 ,  H05K1/18 ,  H05K3/38 ,  H05K3/40 ,  H05K3/44

CPC分类号： H01L23/142 ,  H01L23/36 ,  H01L23/49827 ,  H05K1/0204 ,  H05K1/021 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/3025 ,  H05K1/182 ,  H05K2201/0355 ,  H05K2201/10287 ,  H05K2201/10416 ,  H05K2201/10477 ,  H05K2203/049 ,  H05K2203/063 ,  H05K3/386 ,  H05K3/4046 ,  H05K3/445

摘要： A printed wiring board for carrying a semiconductor chip including a resin base substrate having at least one opening therethrough, a thermo-conductive plate for mounting the semiconductor chip thereon, the plate being inserted into the opening, an insulating adhesive layer covering at least one side of the substrate and an electric circuit formed on the layer. The wiring board of this invention eliminates those disadvantages of the existing resin substrate type and metal core type. In essence, the wiring board of this invention displays excellent heat releasing capability and magnetic shield effect as well as reliable electric insulation.

摘要翻译： 一种印刷电路板，用于承载包括具有至少一个开口的树脂基底的半导体芯片，用于将半导体芯片安装在其上的热导板，该板插入该开口中，绝缘粘合剂层覆盖至少一个侧面 和形成在该层上的电路。 本发明的布线板消除了现有的树脂基板型和金属芯型的缺点。 实质上，本发明的接线板显示出优异的散热能力和磁屏蔽效果以及可靠的电绝缘。

公开(公告)号：US5440985A

公开(公告)日：1995-08-15

申请号：US267254

申请日：1994-06-29

申请人： Masatoshi Shimmura ,  Yasuo Shibuya ,  Tooru Higuchi

发明人： Masatoshi Shimmura ,  Yasuo Shibuya ,  Tooru Higuchi

IPC分类号： B41F27/00 ,  B41F13/00 ,  B41F27/12 ,  B41L29/14

CPC分类号： B41F27/1206

摘要： A printing plate delivery system for a multi-stage printing press, in which a plurality of printing stages are arranged in vertical direction, comprises a vertical transporting device having a carrier movable in vertical direction between a loading position where a printing plate set along the height direction of the printing press being loaded and a printing plate transfer positions at the corresponding height positions to the printing stages for transferring the printing plate, and receiving device provided corresponding to each of the printing stages and cooperated with the vertical transporting device for receiving the printing plate from the carrier at the corresponding transfer position.

摘要翻译： 一种用于多台印刷机的印版输送系统，其中多个印刷台沿垂直方向布置，其包括垂直传送装置，该垂直传送装置具有可在垂直方向上移动的载体， 打印机的方向被装载，并且印刷板转印位置到相应的高度位置到印刷台，用于转印印版，以及与每个印刷台相对应设置的接收装置，并与垂直传送装置配合以接收印刷 在相应的转移位置从载体板。