公开(公告)号：US09947560B1

公开(公告)日：2018-04-17

申请号：US15358513

申请日：2016-11-22

Applicant: Xilinx, Inc.

Inventor： Mohsen H. Mardi ,  David Tan ,  Gamal Refai-Ahmed

IPC: H01L21/67 ,  H01L21/48 ,  H01L23/04 ,  H01L23/498 ,  H01L23/367 ,  H01L21/687

CPC classification number: H01L21/67121 ,  H01L21/4817 ,  H01L21/67098 ,  H01L21/687 ,  H01L21/68735 ,  H01L23/04 ,  H01L23/3675 ,  H01L23/49811 ,  H01L23/49866 ,  H01L2224/16225 ,  H01L2224/73253

Abstract: An integrated circuit (IC) package, assembly tool and method for assembling an IC package are described herein. In a first example, an IC package is provided that includes a package substrate, at least a first integrated circuit (IC) die and a cover. The first integrated circuit (IC) die is mechanically and electrically coupled to the package substrate via solder connections. The cover is bonded to the package substrate. The cover encloses the first IC die and is laterally offset from a peripheral edge of the package substrate.