TEMPERATURE SENSING DEVICE
    31.
    发明公开

    公开(公告)号:US20240133745A1

    公开(公告)日:2024-04-25

    申请号:US17970539

    申请日:2022-10-19

    CPC classification number: G01J5/07 G01J5/14

    Abstract: A temperature sensing device includes a substrate, a first reflective module, a first window cover, and a dual thermopile sensor. The first reflective module is disposed on the substrate, including a first mirror chamber with a narrow field of view (FOV), and the first reflective module focuses a thermal radiation from measured object to a first image plane in the first mirror chamber. The first window cover is disposed on the first reflective module, and the first window cover allows a selected band of the thermal radiation to pass through. The dual thermopile sensor is disposed on the substrate and located in the first mirror chamber, and the dual thermopile sensor senses a temperature data from the first image plane. Additional second reflective module, LED source plus pin hole with same FOV of dual thermopile sensor can illuminate the measured object for ease of placement of object to be heated.

    INFRARED TEMPERATURE SENSOR
    32.
    发明申请

    公开(公告)号:US20220113203A1

    公开(公告)日:2022-04-14

    申请号:US17129074

    申请日:2020-12-21

    Abstract: An infrared temperature sensor comprises a first communication port and a second communication port. A plurality of infrared temperature sensors can be cascaded to each other and connected to an external host controller through the second communication port. The external host controller can set up and administer the unique addresses of the plurality of the infrared temperature sensors through the second communication port, whereby to selectively perform multicasting communication or unicasting communication with the plurality of infrared temperature sensors through the first communication port. The infrared temperature sensor further comprises a second thermopile sensing element used to sense the thermal radiation of a package structure, whereby to compensate for the measurement error induced by temperature variation of the package structure. Thus, the measurement accuracy is increased.

    Chip-scale infrared emitter package
    33.
    发明授权
    Chip-scale infrared emitter package 有权
    芯片级红外发射器封装

    公开(公告)号:US08575578B1

    公开(公告)日:2013-11-05

    申请号:US13788757

    申请日:2013-03-07

    CPC classification number: G01N21/3504

    Abstract: A chip-scale infrared emitter package comprises an emitter chip and an enclosure. The emitter chip includes: a base having a central cavity; a membrane having a peripheral end, the peripheral end being isolated from a periphery of the central cavity by a loop-shaped gap; an electric resistor formed on the membrane; at least one slim supporting beam extending from the peripheral end of the membrane through the loop-shaped gap to the base; and a reflective material coated on the membrane. The enclosure has a can housing and a transparent window plate. The window plate cooperates with the can housing to define an enclosed vacuum chamber. The emitter chip is mounted in the enclosed vacuum chamber. The enclosed vacuum chamber has a pressure less than 0.01 torr.

    Abstract translation: 芯片级红外发射器封装包括发射极芯片和外壳。 发射极芯片包括:具有中心腔的基座; 具有外周端的膜,所述外周端通过环形间隙与所述中心腔的周边隔离; 形成在膜上的电阻器; 至少一个细长的支撑梁,从膜的周边端部延伸穿过环形间隙到基部; 和涂覆在膜上的反射材料。 外壳具有罐壳和透明窗板。 窗板与罐壳体配合以限定封闭的真空室。 发射极芯片安装在封闭的真空室中。 封闭的真空室的压力小于0.01乇。

    Probe assembly of infrared thermometer
    34.
    发明申请
    Probe assembly of infrared thermometer 失效
    红外测温仪探头组装

    公开(公告)号:US20070127545A1

    公开(公告)日:2007-06-07

    申请号:US11290607

    申请日:2005-12-01

    Applicant: Herman Lee

    Inventor: Herman Lee

    Abstract: A probe assembly of an infrared thermometer is capable of detecting the surface temperature of a thermal radiation source and is suitable for holding over human skin or inserting into a patient's ear canal for accurately taking human body temperature. The probe assembly comprises a taper plastic tube, a conductive shell, an infrared radiation sensor and an adiabatic supporter, wherein the plastic tube has a radiation collection end and the conductive shell has a first open end. The infrared radiation sensor is placed in the first open end of the conductive shell, and has a base against the adiabatic supporter. The infrared radiation sensor has a hot junction toward the first open end of the conductive shell and a cold junction toward the adiabatic supporter.

    Abstract translation: 红外线温度计的探针组件能够检测热辐射源的表面温度,适合于保持人体皮肤或插入患者的耳道,以准确地摄取人体温度。 探针组件包括锥形塑料管,导电壳,红外辐射传感器和绝热支架,其中塑料管具有辐射收集端,导电壳具有第一开口端。 红外辐射传感器被放置在导电壳体的第一开口端,并具有抵靠绝热支架的基座。 红外辐射传感器具有朝向导电壳体的第一开口端的热连接点和朝向绝热支撑件的冷接头。

    Electronic thermometer
    35.
    发明申请
    Electronic thermometer 审中-公开
    电子体温计

    公开(公告)号:US20070058691A1

    公开(公告)日:2007-03-15

    申请号:US11224991

    申请日:2005-09-14

    Applicant: Herman Lee

    Inventor: Herman Lee

    CPC classification number: G01K13/002 G01K1/18

    Abstract: An electronic thermometer comprises a first case, a second case, a metal tip section, a temperature sensor device and a cap. The first case made of rigid material, being hollow body, has a recession disposed on an outer periphery thereof. The second case has a cover section and a connecting section, both made of flexible material and a probe section made of rigid material, the cover section covers overall the firsts case and catch on the recession, a mating stem integrally forms with shrinkage at a distal end of the cover section, the connecting section forms a first roughness thereof. The probe section has two end parts wherein one end part forms a second roughness for corresponding to the first roughness; accordingly, the mating stem can be insert into the probe section and the probe section can firmly engage with the connecting section by the first roughness and the second roughness when assembly.

    Abstract translation: 电子温度计包括第一壳体,第二壳体,金属顶端部分,温度传感器装置和盖子。 由刚性材料制成的第一个壳体是中空体,在其外周上具有凹陷部。 第二种壳体具有覆盖部分和连接部分,两者均由柔性材料制成,并且由刚性材料制成的探针部分,盖部分整体覆盖第一壳体并在凹陷部分上收缩, 端部,连接部形成第一粗糙度。 探针部具有两个端部,其中一个端部形成对应于第一粗糙度的第二粗糙度; 因此,配合杆可以插入到探针部分中,并且当组装时探针部分可以通过第一粗糙度和第二粗糙度与连接部分牢固地接合。

    Probe for use in an infrared thermometer

    公开(公告)号:US20030016729A1

    公开(公告)日:2003-01-23

    申请号:US09935191

    申请日:2001-08-22

    CPC classification number: G01J5/16

    Abstract: The present invention discloses a probe assembly for used in an infrared ear thermometer. Given that the exchanged thermal radiation and the infrared detector's temperature are known, the subject temperature can be calculated according to Stefan-Boltzman's law. To make the Stefan-Boltzman's law applicable in a dynamic environment where temperature may vary greatly, the contact temperature sensor (thermistor) must acuurately and fast track the temperature of the infrared detector (thermopile sensor). By using the heat transfer theorem, the disclosed assembly makes the thermistor accurately track the cold junction temperature of the thermopile chip without being in an isothermal condition. Not only minimizes the measurement error in a dynamic environment, the design of the disclosed probe assembly also makes a samll and compact infrared thermometer possible.

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