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    Near-field communications low-power presence check
    31.
    发明授权
    Near-field communications low-power presence check 有权

    公开(公告)号：US11081778B2

    公开(公告)日：2021-08-03

    申请号：US16123908

    申请日：2018-09-06

    Applicant: STMicroelectronics, Inc.

    Inventor： Pierre Rizzo ,  Christophe Henri Ricard

    IPC: G01R29/10 ,  H01Q1/22 ,  G01V3/10 ,  H04B5/00

    Abstract: A method and apparatus for performing a low-power presence check are provided. In the method and apparatus, a controller detects a presence of a tag by at least causing the antenna to generate a magnetic field over a first time period for detecting the tag, measuring an antenna voltage over a second time period, causing the antenna to cease generating a magnetic field over a third time period longer than the first time period and comparing the antenna voltage to an antenna reference voltage to determine whether the tag is present. The controller detects the presence of the tag in response to receiving a command from a host device for performing the low-power presence check. The command may be a one-time command for every presence check stage or a command that is repeatedly received each time the controller detects the presence of the tag.

    ROBUST SENSOR TIMESTAMP MANAGEMENT
    32.
    发明申请
    ROBUST SENSOR TIMESTAMP MANAGEMENT 有权

    公开(公告)号：US20210191755A1

    公开(公告)日：2021-06-24

    申请号：US16721331

    申请日：2019-12-19

    Applicant: STMicroelectronics, Inc.

    Inventor： Karimuddin SAYED ,  Ashish BHARGAVA ,  Chandandeep Singh PABLA ,  Mahesh CHOWDHARY

    IPC: G06F9/48 ,  G06F9/54 ,  G06F11/07 ,  G06F11/30

    Abstract: Systems, methods and devices are provided to improve management and accuracy of timestamps associated with sensor-based data. An indication is received of a sensor event associated with data samples provided from a sensor having an output data rate. A respective timestamp is assigned to each of the data samples. Assigning the respective timestamp may include, responsive to a determination that the indicated event is an interrupt event, calculating an actual data sampling interval based at least in part on time intervals between previous sensor events and a on a quantity of the one or more data samples. Assigning the respective timestamp may alternatively include, responsive to a determination that the event type is a data flush event, assigning the respective timestamp based on an actual data sampling interval associated with one or more previous sensor events if the actual data sampling interval has been previously stored, and otherwise assigning the respective timestamp based at least in part on the output data rate. Correction logic and drift compensation may be applied to the assigned respective timestamps.

    TIME OF FLIGHT BASED ROTARY SPEED SENSOR WITH EARLY FAULT DETECTION
    33.
    发明申请
    TIME OF FLIGHT BASED ROTARY SPEED SENSOR WITH EARLY FAULT DETECTION 有权

    公开(公告)号：US20210190640A1

    公开(公告)日：2021-06-24

    申请号：US16719004

    申请日：2019-12-18

    Applicant: STMicroelectronics, Inc.

    Inventor： Cheng PENG ,  Xiaoyong YANG

    IPC: G01M99/00 ,  G01S17/58 ,  G01S7/4865

    Abstract: Disclosed herein is a system for detecting rotational speed and early failures of an electronic device. The system includes a rotating disk affixed to a rotating shaft of the electronic device. The rotating disk has projections extending from its periphery. A time of flight ranging system determines distance to the projections extending from the rotating disk. Processing circuitry determines a rotational speed of the rotating shaft from the determined distances to the projections extending from the rotating disk, and detects whether the electronic device is undergoing an early failure from the determined distances to the projections extending from the rotating disk. Rotational speed is determined from the time between successive peaks in the determined distances, and early failures (for example, due to wobble of the shaft) are determined where the peaks vary unexpectedly in magnitude.

    Leadframe with pad anchoring members and method of forming the same
    35.
    发明授权
    Leadframe with pad anchoring members and method of forming the same 有权

    公开(公告)号：US11031350B2

    公开(公告)日：2021-06-08

    申请号：US16223582

    申请日：2018-12-18

    Applicant: STMICROELECTRONICS, INC.

    Inventor： Jefferson Talledo

    IPC: H01L23/00 ,  H01L23/31 ,  H01L23/495 ,  H01L21/56 ,  H01L21/48

    Abstract: A leadframe having extensions around an outer edge of a die pad are disclosed. More specifically, leadframes are created with a flange formed at the outer edge of the die pad and extending away from the die pad. The flange is bent, such that it is positioned at an angle with respect to the die pad. Leadframes are also created with anchoring posts formed adjacent the outer edge of the die pad and extending away from the die pad. The anchoring posts have a central thickness that is less than a thickness of first and second portions opposite the central portion. When the leadframe is incorporated into a package, molding compound completely surrounds each flange or anchoring post, which increases the bond strength between the leadframe and the molding compound due to increased contact area. The net result is a reduced possibility of delamination at edges of the die pad.

    Control of wafer surface charge during CMP
    39.
    发明授权
    Control of wafer surface charge during CMP 有权

    公开(公告)号：US10964551B2

    公开(公告)日：2021-03-30

    申请号：US15085678

    申请日：2016-03-30

    Applicant: STMicroelectronics, Inc.

    Inventor： John H. Zhang

    IPC: H01L21/67 ,  H01L21/677 ,  H01L21/321 ,  B24B37/005 ,  H01L21/02 ,  H01L21/66

    Abstract: CMP selectivity, removal rate, and uniformity are controlled both locally and globally by altering electric charge at the wafer surface. Surface charge characterization is performed by an on-board metrology module. Based on a charge profile map, the wafer can be treated in an immersion bath to impart a more positive or negative charge overall, or to neutralize the entire wafer before the CMP operation is performed. If charge hot spots are detected on the wafer, a charge pencil can be used to neutralize localized areas. One type of charge pencil bears a tapered porous polymer tip that is placed in close proximity to the wafer surface. Films present on the wafer absorb ions from, or surrender ions to, the charge pencil tip, by electrostatic forces. The charge pencil can be incorporated into a CMP system to provide an in-situ treatment prior to the planarization step or the slurry removal step.

    Power Supply Package with Built-In Radio Frequency Identification Tag
    40.
    发明申请
    Power Supply Package with Built-In Radio Frequency Identification Tag 有权

    公开(公告)号：US20210089731A1

    公开(公告)日：2021-03-25

    申请号：US17108646

    申请日：2020-12-01

    Applicant: STMicroelectronics, Inc.

    Inventor： John N. Tran

    IPC: G06K7/10 ,  G06K19/07

    Abstract: A method includes providing a power supply package (PSP) that includes a power supply, an RFID tag, and a power switch, where a control terminal of the power switch is coupled to an output terminal of the RFID tag, and load path terminals of the power switch are coupled between an output terminal of the PSP and a first terminal of the power supply, where a control register of the RFID tag is pre-programmed with a first value such that the RFID tag is configured to generate a first control signal that turns off the power switch; receiving, by the RFID tag, a second value for the control register of the RFID tag; and writing, by the RFID tag, the second value to the control register of the RFID tag such that the RFID tag is configured to generate a second control signal that turns on the power switch.

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