公开(公告)号：US20130264309A1

公开(公告)日：2013-10-10

申请号：US13440884

申请日：2012-04-05

申请人： Ian J. Kenworthy ,  Daniel A. Brown ,  Cliff E. La Croix ,  Josh A. Cormier

发明人： Ian J. Kenworthy ,  Daniel A. Brown ,  Cliff E. La Croix ,  Josh A. Cormier

IPC分类号： H05H1/24 ,  B44C1/22

CPC分类号： H01J37/32 ,  H01J37/32798 ,  H05H1/2475 ,  H05H2001/2481 ,  H05H2001/2487

摘要： Methods and apparatus for processing a substrate using plasma are disclosed. The apparatus includes a plasma processing system having a process gas supply arrangement for supplying a process gas into an interior region of said chamber and a plasma source configured for generating said plasma at least from said process gas. The apparatus also includes an acoustic energy generator arrangement configured to apply acoustic energy to at least one of a chamber component and said substrate, wherein said acoustic energy generator generates said acoustic energy in the range of 10 Hz to 1 MHz using at least one of a piezoelectric transducing, mechanical coupling vibration, wafer backside gas pulsing, pulsing of said process gas, pressure wave pulsing, and electromagnetic coupling.

摘要翻译： 公开了使用等离子体处理衬底的方法和装置。 该装置包括等离子体处理系统，其具有用于将处理气体供应到所述室的内部区域中的处理气体供应装置和至少从所述处理气体产生所述等离子体的等离子体源。 该装置还包括声能发生器装置，其配置成将声能施加到腔室部件和所述衬底中的至少一个，其中所述声能发生器使用以下中的至少一个来产生在10Hz至1MHz的范围内的所述声能： 压电传感，机械耦合振动，晶片背面气体脉冲，所述工艺气体的脉冲，压力波脉冲和电磁耦合。

公开(公告)号：US20040022945A1

公开(公告)日：2004-02-05

申请号：US10381690

申请日：2003-03-25

发明人： Andrew Goodwin ,  Patrick Merlin ,  Jas Pal Badyal ,  Luke Ward

IPC分类号： H05H001/24

CPC分类号： B05D1/62 ,  B05B5/00 ,  B05B17/0623 ,  B05D1/10 ,  C23C16/4486 ,  C23C16/503 ,  H05H1/2475 ,  H05H2001/2481 ,  H05H2240/10

摘要： A method for forming a coating on a substrate using an atmospheric pressure plasma discharge. The method comprises introducing an atomized liquid and/or solid coating-forming material into an atmospheric pressure plasma discharge and/or an ionized gas stream resulting therefrom, and exposing the substrate to the atomized coating-forming material. The application also described a method for polymerizing a polymer forming material, and further to apparatus for forming a coating on a substrate.

摘要翻译： 使用大气压等离子体放电在基板上形成涂层的方法。 该方法包括将雾化的液体和/或固体涂层形成材料引入到由其产生的大气压等离子体放电和/或电离气流中，并将基底暴露于雾化涂层形成材料。 本申请还描述了聚合物形成材料的聚合方法，还描述了在基材上形成涂层的装置。