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106 条记录 (耗时 0.011 秒)

    METHOD OF MASS REMOVAL AND ELECTROPOLISHING OF STENT ALLOYS CONTAINING NOBLE ELEMENTS
    37.
    发明公开
    METHOD OF MASS REMOVAL AND ELECTROPOLISHING OF STENT ALLOYS CONTAINING NOBLE ELEMENTS 审中-公开

    公开(公告)号：US20240229289A1

    公开(公告)日：2024-07-11

    申请号：US18505714

    申请日：2023-11-09

    申请人： Abbott Cardiovascular Systems, Inc.

    发明人： Donal F. Manley ,  Andrew J. Lindseth ,  Alan Hughes ,  Brenda M. Foley

    IPC分类号： C25F3/02 ,  C22C30/00 ,  C25F3/22

    CPC分类号： C25F3/02 ,  C22C30/00 ,  C25F3/22

    摘要： A process for electrochemical mass removal and/or electropolishing a stent formed from a cobalt-chromium-tungsten-platinum alloy. The alloy may also comprise nickel (e.g., at about 10% by weight), where no other elements are present in an amount over 3% by weight. The process includes positioning the stent in an electrolyte solution in an electropolishing cell, wherein the electrolyte includes each of H2SO4, HCl, and H3PO4, e.g., in a volumetric ratio (as prepared) of about 6:1:1, wherein the electrolyte further comprises ethylene glycol. The metallic body is electrochemically processed in the electrolyte solution in the electropolishing cell, wherein the mass removal and electropolishing includes application of an alternating current with a forward:reverse current ratio of at least 3:1 (e.g., from 3:1 to 5:1). Voltage may be allowed to float, e.g., within a range of 1 to 6 volts. Superficially similar processes using DC, other AC settings, or without ethylene glycol were ineffective.

    METHODS FOR ELECTROPOLISHING AND COATING ALUMINUM ON AIR AND/OR MOISTURE SENSITIVE SUBSTRATES
    38.
    发明申请
    METHODS FOR ELECTROPOLISHING AND COATING ALUMINUM ON AIR AND/OR MOISTURE SENSITIVE SUBSTRATES 有权

    公开(公告)号：US20210340688A1

    公开(公告)日：2021-11-04

    申请号：US17379395

    申请日：2021-07-19

    申请人： Consolidated Nuclear Security, LLC

    发明人： John W. FREIDERICH ,  Tasha L. BOYD

    IPC分类号： C25F3/20 ,  C25D5/44 ,  C25D3/44 ,  C25F3/16 ,  C23C18/31 ,  C25F3/26 ,  C25D3/66 ,  C25F3/22 ,  C25F3/28

    摘要： Methods for electropolishing and coating aluminum on a surface of an air and/or moisture sensitive substrate, including: in a vessel, submerging the substrate in a first molten salt bath and applying an anodizing current to the substrate at a first temperature to electropolish the surface of the substrate; wherein the first molten salt bath includes one of a first organic salt bath and first inorganic salt bath; wherein, when used, the first organic salt bath includes one of (a) aluminum halide and ionic liquid, (b) a combination of an aluminum halide and halogenatedmethylphenylsulfone (C6(H5-y,Xy)SO2CX3, where y is a number from 0-5), (c) a combination of an aluminum halide, an ionic liquid, and halogenatedmethylphenylsulfone (C6(H5-y,Xy)SO2CX3), and (d) AlF3-organofluoride-hydrofluoric acid adduct; wherein, when used, the first inorganic salt bath includes aluminum halide and alkali metal halide; and wherein the anodizing current is 10-30 mA/cm2.

    Systems and methods for achieving uniformity across a redistribution layer
    39.
    发明授权
    Systems and methods for achieving uniformity across a redistribution layer 有权

    公开(公告)号：US10714436B2

    公开(公告)日：2020-07-14

    申请号：US15458833

    申请日：2017-03-14

    申请人： Lam Research Corporation

    发明人： Bryan L. Buckalew ,  Thomas A. Ponnuswamy ,  Steven T. Mayer ,  Stephen J. Banik, II ,  Justin Oberst

    IPC分类号： H01L23/00 ,  C25D7/12 ,  H01L23/66 ,  C25F3/22 ,  C25D17/00 ,  H01L25/10

    摘要： Systems and methods for achieving uniformity across a redistribution layer are described. One of the methods includes patterning a photoresist layer over a substrate. The patterning defines a region for a conductive line and a via disposed below the region for the conductive line. The method further includes depositing a conductive material in between the patterned photoresist layer, such that the conductive material fills the via and the region for the conductive line. The depositing causes an overgrowth of conductive material of the conductive line to form a bump of the conductive material over the via. The method also includes planarizing a top surface of the conductive line while maintaining the patterned photoresist layer present over the substrate. The planarizing is facilitated by exerting a horizontal shear force over the conductive line and the bump. The planarizing is performed to flatten the bump.

    Removable electro-mechanical device for burnishing and smoothing metal parts
    40.
    发明授权
    Removable electro-mechanical device for burnishing and smoothing metal parts 有权

    公开(公告)号：US10315284B2

    公开(公告)日：2019-06-11

    申请号：US15300215

    申请日：2015-03-26

    申请人： STEROS GPA INNOVATIVE, S.L.

    发明人： Pau Sarsanedas Millet ,  Pau Narcis Guasch Piriz ,  Arnau Garrell Bunuel ,  Gerard Tordera Xandri

    IPC分类号： C25F3/22 ,  C25F7/00 ,  H02K7/14 ,  B24B37/04 ,  B24B39/00

    摘要： The invention relates to a removable electro-mechanical device for burnishing and smoothing metal parts, said device comprising: a tank (2) containing an electrolytic solution and the cathode (c); a main body (3) which closes the tank (2), and in which the electrical contacts (6), the mechanical components and the drive systems (5) are incorporated, said drive systems being located in the lower portion of the main body (3) and being vertically and radially secured to a part (7) such that, in addition, when said body (3) is coupled to the tank (2), they remain immersed in the solution; and a detachable head (4) that can be coupled to the main body (3) and includes an electric motor (14) linked to a rotating body (15) and a removable, coupleable, rod-shaped supporting structure (41) or anode (a) having securing means (42) for the parts to be treated, and being disposed in such a way that, when said head (4) is coupled to the main body (3), the parts remain immersed in said solution.