Method for depositing a functional material on a substrate

    公开(公告)号:US11089690B2

    公开(公告)日:2021-08-10

    申请号:US15072180

    申请日:2016-03-16

    申请人: NCC NANO, LLC

    IPC分类号: H05K3/04 H05K3/20

    摘要: A method for depositing a functional material on a substrate is disclosed. An optically transparent plate having a first surface and a second surface with one or more wells is provided. After coating the second surface with a thin layer of light-absorbing material, the wells are filled with a functional material. The plate is then irradiated with a pulsed light to heat the layer of light-absorbing material in order to generate gas at an interface between the layer of light-absorbing material and the functional material to release the functional material from the wells onto a receiving substrate located adjacent to the plate.

    Application of Electrical Conductors of a Solar Cell

    公开(公告)号:US20210136923A1

    公开(公告)日:2021-05-06

    申请号:US17151664

    申请日:2021-01-19

    摘要: A method is disclosed for applying an electrical conductor to a solar cell, which comprises providing a flexible membrane with a pattern of groove formed on a first surface thereof, and loading the grooves with a composition comprising conductive particles. The composition is, or may be made, electrically conductive. Once the membrane is loaded, the grooved first surface of the membrane is brought into contact with a front or/and back of a solar cell. A pressure is then applied between the solar cell and the membrane(s) so that the composition loaded to the grooves adheres to the solar cell. The membrane(s) and the solar cell are separated and the composition in the groove is left on the solar cell surface. The electrically conductive particles in the composition are then sintered or otherwise fused to form a pattern of electrical conductor on the solar cell, the pattern corresponding to the pattern formed in the membrane(s).

    GARMENT-TYPE ELECTRONIC DEVICE AND METHOD FOR PRODUCING SAME

    公开(公告)号:US20210007223A1

    公开(公告)日:2021-01-07

    申请号:US17021431

    申请日:2020-09-15

    申请人: TOYOBO CO., LTD.

    摘要: The purpose of the present invention is to provide a garment-type electronic device capable of reducing discomfort during the wearing in the garment-type electronic device comprising an electrical wiring using stretchable conductor composition. In a part in contact with a body surface of a garment-type electronic device, a level difference at the boundary between the electrode portion where the conductor is exposed and the wiring portion covered with the insulating cover layer is substantially eliminated, whereby a garment type electronic device with a natural wearing feeling in which discomfort during wearing has been reduced is obtained. Furthermore, by providing the projections and the depressions in the fabric texture on its surface, a more natural wearing feeling is obtained. Such a garment-type electronic device can be produced by a printing transfer method.

    Radio-frequency identification (RFID) label or conductive trace thermal transfer printing method

    公开(公告)号:US10813225B2

    公开(公告)日:2020-10-20

    申请号:US16277930

    申请日:2019-02-15

    申请人: XEROX CORPORATION

    发明人: Marc D. Daniels

    IPC分类号: H05K3/12 H05K3/20 H05K3/04

    摘要: A method and structure for forming conductive structure such as an electric circuit, or a portion of an electric circuit, can include the use of a thermal print head and a ribbon including a carrier and a metal layer. The thermal print head is used to print a first portion of the metal layer onto a sacrificial print medium. The first portion printed has a first pattern, where a second portion having a second pattern remains on the carrier. The first pattern is a reverse image at least a portion of the electric circuit, while the second pattern includes at least a portion of the electric circuit. The second portion having the second pattern can be transferred to a circuit substrate, then used as an electric circuit.

    Conductor path structure having a component received in a vibration-damped manner

    公开(公告)号:US10779399B2

    公开(公告)日:2020-09-15

    申请号:US16775258

    申请日:2020-01-28

    摘要: A conductor path structure has a damping device for an oscillation-damped and/or vibration-damped (electronic, electromechanical, micromechanical) component. The conductor path structure has a first base body made of a carrier material including a connection area for receiving the component. The connection area is arranged separated from an area of the first base body surrounding it and is arranged oscillation-damped and/or vibration damped and co-acting with an intrinsic damping device of the conductor path structure. The conductor path structure includes a second base body arranged at a distance under the first base body, wherein above the second base body of the conductor path structure at least one adhesive layer of a damping material is provided. The intrinsic damping device is formed by said at least one adhesive layer arranged between the connection area of the first base body and the area of the second base body arranged below the connection area.

    RADIO-FREQUENCY IDENTIFICATION (RFID) LABEL OR CONDUCTIVE TRACE THERMAL TRANSFER PRINTING METHOD

    公开(公告)号:US20200267843A1

    公开(公告)日:2020-08-20

    申请号:US16277930

    申请日:2019-02-15

    申请人: XEROX CORPORATION

    发明人: Marc D. Daniels

    IPC分类号: H05K3/12 H05K3/20

    摘要: A method and structure for forming conductive structure such as an electric circuit, or a portion of an electric circuit, can include the use of a thermal print head and a ribbon including a carrier and a metal layer. The thermal print head is used to print a first portion of the metal layer onto a sacrificial print medium. The first portion printed has a first pattern, where a second portion having a second pattern remains on the carrier. The first pattern is a reverse image at least a portion of the electric circuit, while the second pattern includes at least a portion of the electric circuit. The second portion having the second pattern can be transferred to a circuit substrate, then used as an electric circuit.